DE112021007378T5 - Lotkugel-Zuführungsvorrichtung und Lotkugel-Zuführungsverfahren - Google Patents

Lotkugel-Zuführungsvorrichtung und Lotkugel-Zuführungsverfahren Download PDF

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Publication number
DE112021007378T5
DE112021007378T5 DE112021007378.8T DE112021007378T DE112021007378T5 DE 112021007378 T5 DE112021007378 T5 DE 112021007378T5 DE 112021007378 T DE112021007378 T DE 112021007378T DE 112021007378 T5 DE112021007378 T5 DE 112021007378T5
Authority
DE
Germany
Prior art keywords
solder ball
solder balls
section
solder
conveyance control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021007378.8T
Other languages
German (de)
English (en)
Inventor
Yuji Kawasaki
Takehito Okada
Yusuke Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of DE112021007378T5 publication Critical patent/DE112021007378T5/de
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE112021007378.8T 2021-03-24 2021-03-24 Lotkugel-Zuführungsvorrichtung und Lotkugel-Zuführungsverfahren Pending DE112021007378T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/012222 WO2022201355A1 (ja) 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法

Publications (1)

Publication Number Publication Date
DE112021007378T5 true DE112021007378T5 (de) 2024-01-18

Family

ID=83396569

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021007378.8T Pending DE112021007378T5 (de) 2021-03-24 2021-03-24 Lotkugel-Zuführungsvorrichtung und Lotkugel-Zuführungsverfahren

Country Status (5)

Country Link
US (1) US12365041B2 (https=)
JP (1) JP7554342B2 (https=)
CN (1) CN116917074B (https=)
DE (1) DE112021007378T5 (https=)
WO (1) WO2022201355A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116724673B (zh) * 2021-01-29 2026-03-06 株式会社富士 散装供料器及元件安装机
WO2022230158A1 (ja) * 2021-04-29 2022-11-03 株式会社Fuji バルクフィーダ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084061A (ja) 2000-09-08 2002-03-22 Matsushita Electric Ind Co Ltd 導電性ボールの供給装置および供給方法
JP2014027243A (ja) 2012-07-27 2014-02-06 Samsung Electro-Mechanics Co Ltd 自重を用いる半田ボール実装装置、これを含む半田ボール実装システム、及びこれを用いる半田ボール実装方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06344132A (ja) * 1993-06-10 1994-12-20 Hitachi Ltd 微小はんだボールの位置決め方法及びその装置
JPH088523A (ja) * 1994-06-20 1996-01-12 Mitsubishi Electric Corp 整列装置
JP2001144130A (ja) * 1999-11-17 2001-05-25 Hitachi Via Mechanics Ltd 導電性ボール搭載装置におけるフラックス供給装置
JP2004045592A (ja) * 2002-07-10 2004-02-12 Matsushita Electric Ind Co Ltd 球状体の観察装置
US20060053624A1 (en) * 2002-08-06 2006-03-16 Takashi Maeda Method and equipment for mounting part
TWI272708B (en) * 2002-10-14 2007-02-01 Aurigin Technology Pte Ltd Apparatus and method for filling a ball grid array template
JP2005064205A (ja) * 2003-08-11 2005-03-10 Niigata Seimitsu Kk 回路基板の移載装置および移載方法、半田ボール搭載方法
KR20090096706A (ko) 2006-11-22 2009-09-14 록코 벤처스 피티이 리미티드 향상된 볼 장착 장치 및 방법
JP5717956B2 (ja) * 2009-10-22 2015-05-13 富士機械製造株式会社 半田ボール整列供給装置
JP2011091192A (ja) 2009-10-22 2011-05-06 Fuji Mach Mfg Co Ltd 半田ボール整列供給装置及び部品実装機
KR101061364B1 (ko) * 2010-01-29 2011-09-01 주식회사 고려반도체시스템 미리 정해진 패턴의 범프를 형성하는 방법 및 이에 사용되는 솔더볼 주입 장치
WO2016181502A1 (ja) 2015-05-12 2016-11-17 富士機械製造株式会社 はんだボール供給装置
JP6894021B2 (ja) 2015-08-24 2021-06-23 株式会社Ｆｕｊｉ マルチフィーダ装置
KR101935518B1 (ko) * 2016-02-15 2019-01-04 주식회사 이오테크닉스 레이저 솔더링 수선 공정, 레이저 솔더링 공정 및 레이저 솔더링 시스템
JP7231706B2 (ja) * 2019-03-01 2023-03-01 株式会社Fuji 作業機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084061A (ja) 2000-09-08 2002-03-22 Matsushita Electric Ind Co Ltd 導電性ボールの供給装置および供給方法
JP2014027243A (ja) 2012-07-27 2014-02-06 Samsung Electro-Mechanics Co Ltd 自重を用いる半田ボール実装装置、これを含む半田ボール実装システム、及びこれを用いる半田ボール実装方法

Also Published As

Publication number Publication date
US20240165727A1 (en) 2024-05-23
US12365041B2 (en) 2025-07-22
JP7554342B2 (ja) 2024-09-19
CN116917074A (zh) 2023-10-20
JPWO2022201355A1 (https=) 2022-09-29
WO2022201355A1 (ja) 2022-09-29
CN116917074B (zh) 2026-04-17

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