JP7554342B2 - はんだボール供給装置およびはんだボール供給方法 - Google Patents

はんだボール供給装置およびはんだボール供給方法 Download PDF

Info

Publication number
JP7554342B2
JP7554342B2 JP2023508254A JP2023508254A JP7554342B2 JP 7554342 B2 JP7554342 B2 JP 7554342B2 JP 2023508254 A JP2023508254 A JP 2023508254A JP 2023508254 A JP2023508254 A JP 2023508254A JP 7554342 B2 JP7554342 B2 JP 7554342B2
Authority
JP
Japan
Prior art keywords
solder balls
cavities
unit
transport
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023508254A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022201355A1 (https=
Inventor
裕司 川崎
健人 岡田
祐輔 山▲崎▼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPWO2022201355A1 publication Critical patent/JPWO2022201355A1/ja
Application granted granted Critical
Publication of JP7554342B2 publication Critical patent/JP7554342B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023508254A 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法 Active JP7554342B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/012222 WO2022201355A1 (ja) 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法

Publications (2)

Publication Number Publication Date
JPWO2022201355A1 JPWO2022201355A1 (https=) 2022-09-29
JP7554342B2 true JP7554342B2 (ja) 2024-09-19

Family

ID=83396569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508254A Active JP7554342B2 (ja) 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法

Country Status (5)

Country Link
US (1) US12365041B2 (https=)
JP (1) JP7554342B2 (https=)
CN (1) CN116917074B (https=)
DE (1) DE112021007378T5 (https=)
WO (1) WO2022201355A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116724673B (zh) * 2021-01-29 2026-03-06 株式会社富士 散装供料器及元件安装机
WO2022230158A1 (ja) * 2021-04-29 2022-11-03 株式会社Fuji バルクフィーダ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084061A (ja) 2000-09-08 2002-03-22 Matsushita Electric Ind Co Ltd 導電性ボールの供給装置および供給方法
JP2010517251A (ja) 2006-11-22 2010-05-20 ロッコ・ベンチャーズ・プライベイト・リミテッド 改良されたボール実装装置および方法
JP2011091192A (ja) 2009-10-22 2011-05-06 Fuji Mach Mfg Co Ltd 半田ボール整列供給装置及び部品実装機
WO2016181502A1 (ja) 2015-05-12 2016-11-17 富士機械製造株式会社 はんだボール供給装置
JP2020074472A (ja) 2015-08-24 2020-05-14 株式会社Ｆｕｊｉ マルチフィーダ装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06344132A (ja) * 1993-06-10 1994-12-20 Hitachi Ltd 微小はんだボールの位置決め方法及びその装置
JPH088523A (ja) * 1994-06-20 1996-01-12 Mitsubishi Electric Corp 整列装置
JP2001144130A (ja) * 1999-11-17 2001-05-25 Hitachi Via Mechanics Ltd 導電性ボール搭載装置におけるフラックス供給装置
JP2004045592A (ja) * 2002-07-10 2004-02-12 Matsushita Electric Ind Co Ltd 球状体の観察装置
US20060053624A1 (en) * 2002-08-06 2006-03-16 Takashi Maeda Method and equipment for mounting part
TWI272708B (en) * 2002-10-14 2007-02-01 Aurigin Technology Pte Ltd Apparatus and method for filling a ball grid array template
JP2005064205A (ja) * 2003-08-11 2005-03-10 Niigata Seimitsu Kk 回路基板の移載装置および移載方法、半田ボール搭載方法
JP5717956B2 (ja) * 2009-10-22 2015-05-13 富士機械製造株式会社 半田ボール整列供給装置
KR101061364B1 (ko) * 2010-01-29 2011-09-01 주식회사 고려반도체시스템 미리 정해진 패턴의 범프를 형성하는 방법 및 이에 사용되는 솔더볼 주입 장치
KR101376825B1 (ko) 2012-07-27 2014-03-20 삼성전기주식회사 자중을 이용한 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법
KR101935518B1 (ko) * 2016-02-15 2019-01-04 주식회사 이오테크닉스 레이저 솔더링 수선 공정, 레이저 솔더링 공정 및 레이저 솔더링 시스템
JP7231706B2 (ja) * 2019-03-01 2023-03-01 株式会社Fuji 作業機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002084061A (ja) 2000-09-08 2002-03-22 Matsushita Electric Ind Co Ltd 導電性ボールの供給装置および供給方法
JP2010517251A (ja) 2006-11-22 2010-05-20 ロッコ・ベンチャーズ・プライベイト・リミテッド 改良されたボール実装装置および方法
JP2011091192A (ja) 2009-10-22 2011-05-06 Fuji Mach Mfg Co Ltd 半田ボール整列供給装置及び部品実装機
WO2016181502A1 (ja) 2015-05-12 2016-11-17 富士機械製造株式会社 はんだボール供給装置
JP2020074472A (ja) 2015-08-24 2020-05-14 株式会社Ｆｕｊｉ マルチフィーダ装置

Also Published As

Publication number Publication date
US20240165727A1 (en) 2024-05-23
US12365041B2 (en) 2025-07-22
CN116917074A (zh) 2023-10-20
JPWO2022201355A1 (https=) 2022-09-29
DE112021007378T5 (de) 2024-01-18
WO2022201355A1 (ja) 2022-09-29
CN116917074B (zh) 2026-04-17

Similar Documents

Publication Publication Date Title
CN116724673B (zh) 散装供料器及元件安装机
JP7554342B2 (ja) はんだボール供給装置およびはんだボール供給方法
JP7454060B2 (ja) 採取可否判定装置および採取可否判定方法
JP7487350B2 (ja) 部品供給制御システム
CN114651536A (zh) 散装供料器及元件安装机
JP7546152B2 (ja) バルクフィーダ
CN114651537A (zh) 散装供料器及元件安装机
JP7832776B2 (ja) メンテナンス装置およびメンテナンス方法
JP6131023B2 (ja) ノズル交換機構及び電子部品実装装置
JP5925524B2 (ja) 電子部品供給装置及び電子部品実装装置
JP7473745B2 (ja) バルクフィーダ
CN116671272B (zh) 元件供给控制系统
JP7438450B2 (ja) メンテナンス装置
JP7657297B2 (ja) 部品供給装置
JP7339346B2 (ja) 部品保持装置
JP7504714B2 (ja) ボウルフィーダ
WO2025022659A1 (ja) バルクフィーダ
WO2016142986A1 (ja) 認識装置および、認識方法
CN223379514U (zh) 散装供料器及散装供料器的排列部件
WO2024121970A1 (ja) 良否判定装置および良否判定方法
WO2026088270A1 (ja) バルクフィーダ
CN121312272A (zh) 拾取支援装置及拾取支援方法
CN121587086A (zh) 防振装置及散装供料器
JP2024081909A (ja) バルクフィーダ
CN121195604A (zh) 散装供料器

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230731

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240123

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20240312

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240426

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240716

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240730

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240903

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240906

R150 Certificate of patent or registration of utility model

Ref document number: 7554342

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150