JPWO2022201355A1 - - Google Patents

Info

Publication number
JPWO2022201355A1
JPWO2022201355A1 JP2023508254A JP2023508254A JPWO2022201355A1 JP WO2022201355 A1 JPWO2022201355 A1 JP WO2022201355A1 JP 2023508254 A JP2023508254 A JP 2023508254A JP 2023508254 A JP2023508254 A JP 2023508254A JP WO2022201355 A1 JPWO2022201355 A1 JP WO2022201355A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023508254A
Other languages
Japanese (ja)
Other versions
JP7554342B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022201355A1 publication Critical patent/JPWO2022201355A1/ja
Application granted granted Critical
Publication of JP7554342B2 publication Critical patent/JP7554342B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/028—Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2023508254A 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法 Active JP7554342B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/012222 WO2022201355A1 (ja) 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法

Publications (2)

Publication Number Publication Date
JPWO2022201355A1 true JPWO2022201355A1 (https=) 2022-09-29
JP7554342B2 JP7554342B2 (ja) 2024-09-19

Family

ID=83396569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023508254A Active JP7554342B2 (ja) 2021-03-24 2021-03-24 はんだボール供給装置およびはんだボール供給方法

Country Status (5)

Country Link
US (1) US12365041B2 (https=)
JP (1) JP7554342B2 (https=)
CN (1) CN116917074B (https=)
DE (1) DE112021007378T5 (https=)
WO (1) WO2022201355A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116724673B (zh) * 2021-01-29 2026-03-06 株式会社富士 散装供料器及元件安装机
WO2022230158A1 (ja) * 2021-04-29 2022-11-03 株式会社Fuji バルクフィーダ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06344132A (ja) * 1993-06-10 1994-12-20 Hitachi Ltd 微小はんだボールの位置決め方法及びその装置
JPH088523A (ja) * 1994-06-20 1996-01-12 Mitsubishi Electric Corp 整列装置
JP2001144130A (ja) * 1999-11-17 2001-05-25 Hitachi Via Mechanics Ltd 導電性ボール搭載装置におけるフラックス供給装置
JP4286440B2 (ja) 2000-09-08 2009-07-01 パナソニック株式会社 導電性ボールの供給装置および供給方法
JP2004045592A (ja) * 2002-07-10 2004-02-12 Matsushita Electric Ind Co Ltd 球状体の観察装置
US20060053624A1 (en) * 2002-08-06 2006-03-16 Takashi Maeda Method and equipment for mounting part
TWI272708B (en) * 2002-10-14 2007-02-01 Aurigin Technology Pte Ltd Apparatus and method for filling a ball grid array template
JP2005064205A (ja) * 2003-08-11 2005-03-10 Niigata Seimitsu Kk 回路基板の移載装置および移載方法、半田ボール搭載方法
KR20090096706A (ko) 2006-11-22 2009-09-14 록코 벤처스 피티이 리미티드 향상된 볼 장착 장치 및 방법
JP5717956B2 (ja) * 2009-10-22 2015-05-13 富士機械製造株式会社 半田ボール整列供給装置
JP2011091192A (ja) 2009-10-22 2011-05-06 Fuji Mach Mfg Co Ltd 半田ボール整列供給装置及び部品実装機
KR101061364B1 (ko) * 2010-01-29 2011-09-01 주식회사 고려반도체시스템 미리 정해진 패턴의 범프를 형성하는 방법 및 이에 사용되는 솔더볼 주입 장치
KR101376825B1 (ko) 2012-07-27 2014-03-20 삼성전기주식회사 자중을 이용한 솔더 볼 실장 장치, 이를 포함한 솔더 볼 실장 시스템 및 이를 이용한 솔더 볼 실장 방법
WO2016181502A1 (ja) 2015-05-12 2016-11-17 富士機械製造株式会社 はんだボール供給装置
JP6894021B2 (ja) 2015-08-24 2021-06-23 株式会社Ｆｕｊｉ マルチフィーダ装置
KR101935518B1 (ko) * 2016-02-15 2019-01-04 주식회사 이오테크닉스 레이저 솔더링 수선 공정, 레이저 솔더링 공정 및 레이저 솔더링 시스템
JP7231706B2 (ja) * 2019-03-01 2023-03-01 株式会社Fuji 作業機

Also Published As

Publication number Publication date
US20240165727A1 (en) 2024-05-23
US12365041B2 (en) 2025-07-22
JP7554342B2 (ja) 2024-09-19
CN116917074A (zh) 2023-10-20
DE112021007378T5 (de) 2024-01-18
WO2022201355A1 (ja) 2022-09-29
CN116917074B (zh) 2026-04-17

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