DE112018005496A5 - Strahlungsemittierendes halbleiterbauelement und verfahren zur herstellung von strahlungsemittierenden halbleiterbauelementen - Google Patents
Strahlungsemittierendes halbleiterbauelement und verfahren zur herstellung von strahlungsemittierenden halbleiterbauelementen Download PDFInfo
- Publication number
- DE112018005496A5 DE112018005496A5 DE112018005496.9T DE112018005496T DE112018005496A5 DE 112018005496 A5 DE112018005496 A5 DE 112018005496A5 DE 112018005496 T DE112018005496 T DE 112018005496T DE 112018005496 A5 DE112018005496 A5 DE 112018005496A5
- Authority
- DE
- Germany
- Prior art keywords
- emitting semiconductor
- radiation
- manufacturing
- semiconductor component
- semiconductor components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017122325.8A DE102017122325A1 (de) | 2017-09-26 | 2017-09-26 | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
DE102017122325.8 | 2017-09-26 | ||
PCT/EP2018/075488 WO2019063412A1 (de) | 2017-09-26 | 2018-09-20 | Strahlungsemittierendes halbleiterbauelement und verfahren zur herstellung von strahlungsemittierenden halbleiterbauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112018005496A5 true DE112018005496A5 (de) | 2020-10-08 |
DE112018005496B4 DE112018005496B4 (de) | 2024-03-21 |
Family
ID=63685965
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017122325.8A Withdrawn DE102017122325A1 (de) | 2017-09-26 | 2017-09-26 | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
DE112018008290.3T Active DE112018008290B4 (de) | 2017-09-26 | 2018-09-20 | Strahlungsemittierendes halbleiterbauelement |
DE112018005496.9T Active DE112018005496B4 (de) | 2017-09-26 | 2018-09-20 | Strahlungsemittierendes halbleiterbauelement und verfahren zur herstellung von strahlungsemittierenden halbleiterbauelementen |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102017122325.8A Withdrawn DE102017122325A1 (de) | 2017-09-26 | 2017-09-26 | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
DE112018008290.3T Active DE112018008290B4 (de) | 2017-09-26 | 2018-09-20 | Strahlungsemittierendes halbleiterbauelement |
Country Status (5)
Country | Link |
---|---|
US (3) | US11316084B2 (de) |
JP (2) | JP7052019B2 (de) |
CN (2) | CN117276451A (de) |
DE (3) | DE102017122325A1 (de) |
WO (1) | WO2019063412A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017122325A1 (de) * | 2017-09-26 | 2019-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
JP7438476B2 (ja) * | 2019-08-20 | 2024-02-27 | 日亜化学工業株式会社 | 半導体レーザ装置及びその製造方法 |
CN117096236B (zh) * | 2023-10-18 | 2024-01-26 | 南昌凯捷半导体科技有限公司 | 一种共振腔结构红光led芯片及其制作方法 |
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JPH07221590A (ja) | 1994-01-31 | 1995-08-18 | Matsushita Electric Ind Co Ltd | 電子部品とその製造方法 |
US6320206B1 (en) | 1999-02-05 | 2001-11-20 | Lumileds Lighting, U.S., Llc | Light emitting devices having wafer bonded aluminum gallium indium nitride structures and mirror stacks |
JP2001156396A (ja) | 1999-11-24 | 2001-06-08 | Seiko Epson Corp | 面発光レーザおよびその製造方法 |
JP2002026452A (ja) | 2000-07-12 | 2002-01-25 | Toyota Central Res & Dev Lab Inc | 面発光型光源及びその製造方法、レーザ加工機用光源 |
US7053419B1 (en) | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
JP2002141556A (ja) | 2000-09-12 | 2002-05-17 | Lumileds Lighting Us Llc | 改良された光抽出効果を有する発光ダイオード |
US20030091084A1 (en) | 2001-11-13 | 2003-05-15 | Decai Sun | Integration of VCSEL array and microlens for optical scanning |
JP3998990B2 (ja) | 2002-02-04 | 2007-10-31 | 永大産業株式会社 | 木質材の欠陥補修装置 |
JP3821041B2 (ja) | 2002-04-26 | 2006-09-13 | 横河電機株式会社 | 面発光レーザ |
JP2003333590A (ja) | 2002-05-16 | 2003-11-21 | Komatsu Ltd | 現場の画像生成システム |
JP4446149B2 (ja) * | 2003-04-10 | 2010-04-07 | ソニー株式会社 | 複合光学装置の製造方法 |
JP4092570B2 (ja) * | 2003-07-23 | 2008-05-28 | セイコーエプソン株式会社 | 光素子およびその製造方法、光モジュール、ならびに光モジュールの駆動方法 |
JP2005080982A (ja) | 2003-09-10 | 2005-03-31 | Miwatec:Kk | 血液ポンプシステムの異常状態の検知方法 |
CN100461561C (zh) * | 2004-01-07 | 2009-02-11 | 浜松光子学株式会社 | 半导体发光元件及其制造方法 |
JP2006066538A (ja) | 2004-08-25 | 2006-03-09 | Hamamatsu Photonics Kk | 面発光レーザ光源の製造方法及び面発光レーザ光源 |
JP4036217B2 (ja) | 2004-10-27 | 2008-01-23 | セイコーエプソン株式会社 | 測位システム、端末装置、測位装置及びプログラム |
US7462502B2 (en) | 2004-11-12 | 2008-12-09 | Philips Lumileds Lighting Company, Llc | Color control by alteration of wavelength converting element |
US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
JP2007173393A (ja) | 2005-12-20 | 2007-07-05 | Denso Corp | レーザ装置 |
KR101370367B1 (ko) * | 2006-09-22 | 2014-03-05 | 코닌클리케 필립스 엔.브이. | 장력 완화를 갖는 발광 장치 |
US20090050905A1 (en) * | 2007-08-20 | 2009-02-26 | Abu-Ageel Nayef M | Highly Efficient Light-Emitting Diode |
WO2009081328A1 (en) | 2007-12-19 | 2009-07-02 | Philips Intellectual Property & Standards Gmbh | Vecsel-pumped solid-state laser |
JP2010062267A (ja) | 2008-09-02 | 2010-03-18 | Toshiba Corp | 面発光装置及びその製造方法、並びに光伝送モジュール |
EP2377211B1 (de) | 2008-12-10 | 2013-02-20 | Philips Intellectual Property & Standards GmbH | Hochleistungs-vcsel mit verbessertem räumlichem modus |
JP5919191B2 (ja) | 2009-08-20 | 2016-05-18 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 角度選択的なフィードバックを有する縦キャビティ面発光レーザー装置 |
DE102009056386B4 (de) * | 2009-11-30 | 2024-06-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Halbleiterbauelements |
US8183579B2 (en) * | 2010-03-02 | 2012-05-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | LED flip-chip package structure with dummy bumps |
KR101784417B1 (ko) | 2010-07-12 | 2017-11-07 | 삼성전자주식회사 | 발광 디바이스 및 그 제조방법 |
WO2012059864A1 (en) * | 2010-11-03 | 2012-05-10 | Koninklijke Philips Electronics N.V. | Optical element for vertical external-cavity surface-emitting laser |
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JP2013160455A (ja) | 2012-02-06 | 2013-08-19 | Fujimori Sangyo Kk | ソックダクト |
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US9041015B2 (en) | 2013-03-12 | 2015-05-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package structure and methods of forming same |
CN111063787A (zh) | 2014-01-23 | 2020-04-24 | 亮锐控股有限公司 | 具有自对准预制透镜的发光设备 |
JP2015146086A (ja) | 2014-02-01 | 2015-08-13 | 日本電気硝子株式会社 | タッチパネル |
KR102415331B1 (ko) * | 2015-08-26 | 2022-06-30 | 삼성전자주식회사 | 발광 소자 패키지, 및 이를 포함하는 장치 |
JP6750404B2 (ja) | 2015-09-18 | 2020-09-02 | 三菱マテリアル株式会社 | 熱電変換モジュール及び熱電変換装置並びに熱電変換モジュールの製造方法 |
DE102016104280A1 (de) * | 2016-03-09 | 2017-09-14 | Osram Opto Semiconductors Gmbh | Bauelement und Verfahren zur Herstellung eines Bauelements |
DE102017100997A1 (de) | 2017-01-19 | 2018-07-19 | Osram Opto Semiconductors Gmbh | Halbleiterlaser und Verfahren zur Herstellung eines solchen Halbleiterlasers |
DE102017122325A1 (de) * | 2017-09-26 | 2019-03-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Herstellung von strahlungsemittierenden Halbleiterbauelementen |
-
2017
- 2017-09-26 DE DE102017122325.8A patent/DE102017122325A1/de not_active Withdrawn
-
2018
- 2018-09-20 DE DE112018008290.3T patent/DE112018008290B4/de active Active
- 2018-09-20 US US16/650,100 patent/US11316084B2/en active Active
- 2018-09-20 CN CN202311440188.7A patent/CN117276451A/zh active Pending
- 2018-09-20 DE DE112018005496.9T patent/DE112018005496B4/de active Active
- 2018-09-20 WO PCT/EP2018/075488 patent/WO2019063412A1/de active Application Filing
- 2018-09-20 JP JP2020515028A patent/JP7052019B2/ja active Active
- 2018-09-20 CN CN201880062397.3A patent/CN111542933B/zh active Active
-
2022
- 2022-03-02 US US17/685,058 patent/US11848406B2/en active Active
- 2022-03-30 JP JP2022057347A patent/JP7318048B2/ja active Active
-
2023
- 2023-10-26 US US18/495,068 patent/US20240055568A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2020535634A (ja) | 2020-12-03 |
US20240055568A1 (en) | 2024-02-15 |
US11316084B2 (en) | 2022-04-26 |
CN117276451A (zh) | 2023-12-22 |
JP7052019B2 (ja) | 2022-04-11 |
DE102017122325A1 (de) | 2019-03-28 |
CN111542933B (zh) | 2023-10-31 |
US20220190217A1 (en) | 2022-06-16 |
US11848406B2 (en) | 2023-12-19 |
DE112018005496B4 (de) | 2024-03-21 |
WO2019063412A1 (de) | 2019-04-04 |
US20200227602A1 (en) | 2020-07-16 |
CN111542933A (zh) | 2020-08-14 |
DE112018008290B4 (de) | 2024-09-19 |
JP7318048B2 (ja) | 2023-07-31 |
JP2022088580A (ja) | 2022-06-14 |
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