DE112015005446A5 - Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen - Google Patents

Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen Download PDF

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Publication number
DE112015005446A5
DE112015005446A5 DE112015005446.4T DE112015005446T DE112015005446A5 DE 112015005446 A5 DE112015005446 A5 DE 112015005446A5 DE 112015005446 T DE112015005446 T DE 112015005446T DE 112015005446 A5 DE112015005446 A5 DE 112015005446A5
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DE
Germany
Prior art keywords
semiconductor component
optoelectronic semiconductor
producing
conversion element
conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015005446.4T
Other languages
English (en)
Inventor
Frank Singer
Stefan Illek
Michael Zitzlsperger
Britta Göötz
Dominik Schulten
Thomas Schwarz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015005446A5 publication Critical patent/DE112015005446A5/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Optical Filters (AREA)
DE112015005446.4T 2014-12-05 2015-12-04 Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen Withdrawn DE112015005446A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014117983.8A DE102014117983A1 (de) 2014-12-05 2014-12-05 Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen
DE102014117983.8 2014-12-05
PCT/EP2015/078697 WO2016087656A1 (de) 2014-12-05 2015-12-04 Konversionselement, optoelektronisches halbleiterbauelement und verfahren zur herstellung von konversionselementen

Publications (1)

Publication Number Publication Date
DE112015005446A5 true DE112015005446A5 (de) 2017-08-17

Family

ID=54782729

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014117983.8A Withdrawn DE102014117983A1 (de) 2014-12-05 2014-12-05 Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen
DE112015005446.4T Withdrawn DE112015005446A5 (de) 2014-12-05 2015-12-04 Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014117983.8A Withdrawn DE102014117983A1 (de) 2014-12-05 2014-12-05 Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen

Country Status (5)

Country Link
US (1) US20170365752A1 (de)
JP (1) JP2017538166A (de)
CN (1) CN107210345A (de)
DE (2) DE102014117983A1 (de)
WO (1) WO2016087656A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017120385B4 (de) 2017-09-05 2024-02-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Licht emittierendes Bauelement und Verfahren zur Herstellung eines Licht emittierenden Bauelements
DE102018111417A1 (de) * 2018-05-14 2019-11-14 Osram Opto Semiconductors Gmbh Konversionselement, optoelektronisches bauteil, verfahren zur herstellung einer vielzahl von konversionselementen, verfahren zur herstellung einer vielzahl von optoelektronischen bauteilen und verfahren zur herstellung eines optoelektronischen bauteils
DE102018125506A1 (de) * 2018-10-15 2020-04-16 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verfahren zur Herstellung von optoelektronischen Vorrichtungen
WO2021106556A1 (ja) * 2019-11-29 2021-06-03 昭和電工マテリアルズ株式会社 波長変換部材及びその製造方法、バックライトユニット、並びに画像表示装置
DE102020101470A1 (de) 2020-01-22 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Bauelement mit konverterschicht und verfahren zur herstellung eines bauelements
DE102021100530A1 (de) 2021-01-13 2022-07-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
DE102021208179A1 (de) 2021-07-29 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement

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US7294861B2 (en) * 2005-06-30 2007-11-13 3M Innovative Properties Company Phosphor tape article
JP2007273498A (ja) * 2006-03-30 2007-10-18 Kyocera Corp 波長変換器および発光装置
JP2007317787A (ja) * 2006-05-24 2007-12-06 Citizen Electronics Co Ltd 発光装置およびその製造方法
DE102007039291A1 (de) * 2007-08-20 2009-02-26 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleitermodul und Verfahren zur Herstellung eines solchen
DE102007052181A1 (de) * 2007-09-20 2009-04-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
KR101577300B1 (ko) * 2008-10-28 2015-12-15 삼성디스플레이 주식회사 양자점을 이용한 백색광 발광다이오드 구조 및 이를 포함하는 백라이트 어셈블리
TWI476959B (zh) * 2010-04-11 2015-03-11 Achrolux Inc 轉移均勻螢光層至一物件上之方法及所製得之發光結構
KR20110136676A (ko) * 2010-06-14 2011-12-21 삼성엘이디 주식회사 양자점을 이용한 발광소자 패키지, 조광 장치 및 디스플레이 장치
EP2638321B1 (de) * 2010-11-10 2019-05-08 Nanosys, Inc. Quantenpunktfilme, beleuchtungsvorrichtungen und beleuchtungsverfahren
TW201222878A (en) * 2010-11-23 2012-06-01 Siliconware Precision Industries Co Ltd Light-permeating cover board, fabrication method thereof, and package structure having LED
KR101710212B1 (ko) * 2010-12-28 2017-02-24 엘지전자 주식회사 광소자 및 이를 이용한 발광 다이오드 패키지, 백라이트 장치
DE102012100375A1 (de) * 2011-01-17 2012-07-19 Günther Nath Lichtleiteranordnung und optisches Bestrahlungsgerät
CN103328605B (zh) * 2011-01-28 2015-04-08 昭和电工株式会社 包含量子点荧光体的组合物、量子点荧光体分散树脂成型体、包含量子点荧光体的结构物、发光装置、电子设备、机械装置及量子点荧光体分散树脂成型体的制造方法
DE102011017633A1 (de) * 2011-04-27 2012-10-31 Osram Ag Verfahren zum Bilden einer Leuchtstoffanordnung und dazugehörige Leuchtstoffanordnung
JP2013033833A (ja) * 2011-08-01 2013-02-14 Panasonic Corp 波長変換膜及びそれを用いた発光装置並びに照明装置
KR20130015847A (ko) * 2011-08-05 2013-02-14 삼성전자주식회사 발광장치, 백라이트 유닛과 디스플레이 장치 및 그 제조방법
KR101251821B1 (ko) * 2011-09-15 2013-04-09 엘지이노텍 주식회사 발광 소자 패키지
JP2013115351A (ja) * 2011-11-30 2013-06-10 Sumitomo Metal Mining Co Ltd Ｌｅｄ波長変換部材とその製造方法
DE102012200327B4 (de) * 2012-01-11 2022-01-05 Osram Gmbh Optoelektronisches Bauelement
DE102012201448B4 (de) * 2012-02-01 2015-10-22 Osram Gmbh Verfahren zum Herstellen einer mit Leuchtstoff versetzten Platte
JP2013197309A (ja) * 2012-03-19 2013-09-30 Toshiba Corp 発光装置
DE102012109083A1 (de) * 2012-09-26 2014-03-27 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
EP2940743A4 (de) * 2012-12-28 2016-07-27 Konica Minolta Inc Lichtemittierende vorrichtung
JP6102273B2 (ja) * 2013-01-18 2017-03-29 日亜化学工業株式会社 発光装置及びその製造方法
DE102013207460A1 (de) * 2013-04-24 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
CN105900251A (zh) * 2013-11-13 2016-08-24 纳米技术有限公司 包含量子点荧光体的led盖
JP6221950B2 (ja) * 2014-06-09 2017-11-01 日本電気硝子株式会社 発光デバイス
JP6316971B2 (ja) * 2014-09-12 2018-04-25 富士フイルム株式会社 機能性積層フィルムおよび機能性積層フィルムの製造方法
KR20160038325A (ko) * 2014-09-30 2016-04-07 코닝정밀소재 주식회사 색변환용 기판, 그 제조방법 및 이를 포함하는 디스플레이 장치

Also Published As

Publication number Publication date
WO2016087656A1 (de) 2016-06-09
JP2017538166A (ja) 2017-12-21
CN107210345A (zh) 2017-09-26
DE102014117983A1 (de) 2016-06-09
US20170365752A1 (en) 2017-12-21

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