DE112015004443A5 - Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung - Google Patents

Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung Download PDF

Info

Publication number
DE112015004443A5
DE112015004443A5 DE112015004443.4T DE112015004443T DE112015004443A5 DE 112015004443 A5 DE112015004443 A5 DE 112015004443A5 DE 112015004443 T DE112015004443 T DE 112015004443T DE 112015004443 A5 DE112015004443 A5 DE 112015004443A5
Authority
DE
Germany
Prior art keywords
integrated chip
photonically integrated
production
optical component
photonically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015004443.4T
Other languages
English (en)
Inventor
Hanjo Rhee
Marvin Henniges
Christoph Theiss
David Selicke
David Stolarek
Lars Zimmermann
Stefan Meister
Harald H. Richter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sicoya GmbH
Original Assignee
Technische Universitaet Berlin
Sicoya GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universitaet Berlin, Sicoya GmbH filed Critical Technische Universitaet Berlin
Publication of DE112015004443A5 publication Critical patent/DE112015004443A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/124—Geodesic lenses or integrated gratings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12097—Ridge, rib or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12107—Grating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
DE112015004443.4T 2014-09-29 2015-09-25 Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung Withdrawn DE112015004443A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014219663.9A DE102014219663A1 (de) 2014-09-29 2014-09-29 Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung
DE102014219663.9 2014-09-29
PCT/DE2015/200463 WO2016050242A1 (de) 2014-09-29 2015-09-25 Photonisch integrierter chip, optisches bauelement mit photonisch integriertem chip und verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
DE112015004443A5 true DE112015004443A5 (de) 2017-07-20

Family

ID=54540774

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014219663.9A Withdrawn DE102014219663A1 (de) 2014-09-29 2014-09-29 Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung
DE112015004443.4T Withdrawn DE112015004443A5 (de) 2014-09-29 2015-09-25 Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014219663.9A Withdrawn DE102014219663A1 (de) 2014-09-29 2014-09-29 Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung

Country Status (5)

Country Link
US (1) US20170242191A1 (de)
EP (1) EP3201664A1 (de)
CN (1) CN106796326A (de)
DE (2) DE102014219663A1 (de)
WO (1) WO2016050242A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014219792A1 (de) 2014-09-30 2016-03-31 Technische Universität Berlin Optoelektronisches Bauelement
DE102016215076A1 (de) 2016-08-12 2018-02-15 Sicoya Gmbh Photonisches Bauelement und Verfahren zu dessen Herstellung
DE102016217749B4 (de) 2016-09-16 2023-07-06 Sicoya Gmbh Photonisches Bauelement
WO2019108578A1 (en) * 2017-11-28 2019-06-06 The Charles Stark Draper Laboratory, Inc. Coupling lens aberration correction through grating design in a switched focal plane array
FI128594B (en) * 2017-12-22 2020-08-31 Dispelix Oy Stair waveguide elements, personal display device and method for producing an image
CN111527431B (zh) * 2017-12-29 2023-02-17 根特大学 温度不敏感滤波器
FR3077652B1 (fr) * 2018-02-05 2022-05-27 Commissariat Energie Atomique Puce photonique a structure de collimation integree
CN111220963A (zh) * 2018-11-27 2020-06-02 北京万集科技股份有限公司 多层材料相控阵激光雷达发射芯片、制作方法及激光雷达
US12072445B2 (en) 2018-11-27 2024-08-27 Wuhan Vanjee Optoelectronic Technology Co., Ltd. Phased array LiDAR transmitting chip of multi-layer materials, manufacturing method thereof, and LiDAR device
US11079550B2 (en) * 2019-10-22 2021-08-03 Mitsubishi Electric Research Laboratories, Inc. Grating coupler and integrated grating coupler system
US11953625B2 (en) * 2020-01-27 2024-04-09 The Charles Stark Draper Laboratory, Inc. Beamsplitter architecture for monostatic LiDAR
US11143821B1 (en) * 2020-03-24 2021-10-12 Mitsubishi Electric Research Laboratories, Inc. Integrated grating coupler system
US11960122B2 (en) 2021-03-22 2024-04-16 Taiwan Semiconductor Manufacturing Company, Ltd. Devices, systems, and methods for optical signal processing
CN115903140A (zh) * 2021-08-26 2023-04-04 中兴通讯股份有限公司 光栅耦合器及光学设备
CN115657314B (zh) * 2022-11-09 2024-03-22 中国科学院长春光学精密机械与物理研究所 基于光场波前相位调制的ar衍射光波导装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5161059A (en) * 1987-09-21 1992-11-03 Massachusetts Institute Of Technology High-efficiency, multilevel, diffractive optical elements
US5227915A (en) * 1990-02-13 1993-07-13 Holo-Or Ltd. Diffractive optical element
US5335300A (en) * 1992-12-21 1994-08-02 Motorola, Inc. Method of manufacturing I/O node in an optical channel waveguide and apparatus for utilizing
DE4338969C2 (de) * 1993-06-18 1996-09-19 Schott Glaswerke Verfahren zur Herstellung anorganischer diffraktiver Elemente und Verwendung derselben
US5561558A (en) * 1993-10-18 1996-10-01 Matsushita Electric Industrial Co., Ltd. Diffractive optical device
JP2001343512A (ja) * 2000-05-31 2001-12-14 Canon Inc 回折光学素子及びそれを有する光学系
WO2002078142A1 (en) * 2001-03-22 2002-10-03 Infinite Photonics, Inc. Laser diode with output fiber feedback
US7184625B2 (en) * 2003-02-11 2007-02-27 Luxtera, Inc Optical waveguide grating coupler incorporating reflective optical elements and anti-reflection elements
CN101578537B (zh) * 2007-11-13 2012-07-04 松下电器产业株式会社 薄膜及发光装置
JP4535121B2 (ja) * 2007-11-28 2010-09-01 セイコーエプソン株式会社 光学素子及びその製造方法、液晶装置、電子機器
KR100918381B1 (ko) * 2007-12-17 2009-09-22 한국전자통신연구원 광통신을 위한 회절격자 커플러를 포함하는 반도체집적회로 및 그 형성 방법
WO2009141332A1 (en) * 2008-05-19 2009-11-26 Interuniversitair Microelektronica Centrum Vzw (Imec) Integrated photonics device
US8168939B2 (en) 2008-07-09 2012-05-01 Luxtera, Inc. Method and system for a light source assembly supporting direct coupling to an integrated circuit
WO2010100738A1 (ja) * 2009-03-05 2010-09-10 富士通株式会社 半導体レーザ、シリコン導波路基板、集積素子
US8515217B2 (en) * 2009-09-02 2013-08-20 Alcatel Lucent Vertical optically emitting photonic devices with electronic steering capability
US8625942B2 (en) * 2011-03-30 2014-01-07 Intel Corporation Efficient silicon-on-insulator grating coupler
GB201115784D0 (en) * 2011-09-13 2011-10-26 Univ Gent Integrated photonics waveguide grating coupler
DK2626731T3 (en) * 2012-02-07 2016-04-18 Huawei Tech Co Ltd Optical coupling device
US8755647B2 (en) * 2012-03-30 2014-06-17 Massachusetts Institute Of Technology Methods and apparatus for vertical coupling from dielectric waveguides
JP5811273B2 (ja) * 2012-03-30 2015-11-11 富士通株式会社 光素子、光送信素子、光受信素子、ハイブリッドレーザ、光送信装置

Also Published As

Publication number Publication date
DE102014219663A1 (de) 2016-03-31
CN106796326A (zh) 2017-05-31
WO2016050242A1 (de) 2016-04-07
US20170242191A1 (en) 2017-08-24
EP3201664A1 (de) 2017-08-09

Similar Documents

Publication Publication Date Title
DE112015004443A5 (de) Photonisch integrierter Chip, optisches Bauelement mit photonisch integriertem Chip und Verfahren zu deren Herstellung
DE112015003999A5 (de) Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112014002391A5 (de) Laserbauelement und Verfahren zu seiner Herstellung
DE112015004073A5 (de) Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
DE112015005446A5 (de) Konversionselement, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung von Konversionselementen
DE112015000888A5 (de) Verfahren zur Herstellung optoelektronischer Halbleiterbauteile und optoelektronisches Halbleiterbauteil
DE112016001544A5 (de) Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112015005495A5 (de) Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE112014004347A5 (de) Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE112015004631A5 (de) Laserbauelement und Verfahren zu seiner Herstellung
DE112014001638A5 (de) Laserbauelement und Verfahren zu seiner Herstellung
DE112015003591A5 (de) Elektronisches Bauelement, optoelektronisches Bauelement, Bauelementeanordnung und Verfahren zur Herstellung eines elektronischen Bauelements
FI20155123A (fi) Automaattisella palautustoiminnolla varustettu räkki ja automaattinen palautusmenetelmä samaa varten
TWI563072B (en) Encapsulant for light module, method for manufacturing the same and light module comprising the same
DE112015001351A5 (de) Optoelektronisches Bauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterbauelementen
DE112015005127A5 (de) Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
DE112014001924A5 (de) Optoelektronischer Halbleiterchip und Verfahren zu seiner Herstellung
SG11201707494RA (en) Optical functional film and method for producing the same
DE112015003629A5 (de) Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE112015005473A5 (de) Strahlungsemittierendes optoelektronisches Halbleiterbauteil und Verfahren zu dessen Herstellung
DE112015002558A5 (de) Organisches optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE112015001422A5 (de) Aktuator und Verfahren zu deren Herstellung
DE112018001450A5 (de) Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
DE112015003309A5 (de) Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe
DE112015002045A5 (de) Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips

Legal Events

Date Code Title Description
R081 Change of applicant/patentee

Owner name: SICOYA GMBH, DE

Free format text: FORMER OWNER: TECHNISCHE UNIVERSITAET BERLIN, 10623 BERLIN, DE

R082 Change of representative

Representative=s name: FISCHER, UWE, DIPL.-ING. DR.-ING., DE

R081 Change of applicant/patentee

Owner name: SICOYA GMBH, DE

Free format text: FORMER OWNERS: SICOYA GMBH, 12489 BERLIN, DE; TECHNISCHE UNIVERSITAET BERLIN, 10623 BERLIN, DE

R082 Change of representative

Representative=s name: FISCHER, UWE, DIPL.-ING. DR.-ING., DE

R005 Application deemed withdrawn due to failure to request examination