DE112018004568T5 - Einrichtung zum befestigen eines wafers an einer einseiten-poliereinrichtung und verfahren zum befestigen eines wafers an einer einseiten-poliereinrichtung - Google Patents

Einrichtung zum befestigen eines wafers an einer einseiten-poliereinrichtung und verfahren zum befestigen eines wafers an einer einseiten-poliereinrichtung Download PDF

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Publication number
DE112018004568T5
DE112018004568T5 DE112018004568.4T DE112018004568T DE112018004568T5 DE 112018004568 T5 DE112018004568 T5 DE 112018004568T5 DE 112018004568 T DE112018004568 T DE 112018004568T DE 112018004568 T5 DE112018004568 T5 DE 112018004568T5
Authority
DE
Germany
Prior art keywords
wafer
water
temporary
polishing machine
side polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112018004568.4T
Other languages
German (de)
English (en)
Inventor
Katsutoshi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
Original Assignee
Sumco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Publication of DE112018004568T5 publication Critical patent/DE112018004568T5/de
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112018004568.4T 2017-10-16 2018-10-03 Einrichtung zum befestigen eines wafers an einer einseiten-poliereinrichtung und verfahren zum befestigen eines wafers an einer einseiten-poliereinrichtung Pending DE112018004568T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017200286A JP6863220B2 (ja) 2017-10-16 2017-10-16 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法
JP2017-200286 2017-10-16
PCT/JP2018/037125 WO2019078009A1 (ja) 2017-10-16 2018-10-03 片面研磨装置へのウェーハ貼付装置、および片面研磨装置へのウェーハ貼付方法

Publications (1)

Publication Number Publication Date
DE112018004568T5 true DE112018004568T5 (de) 2020-06-04

Family

ID=66174496

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112018004568.4T Pending DE112018004568T5 (de) 2017-10-16 2018-10-03 Einrichtung zum befestigen eines wafers an einer einseiten-poliereinrichtung und verfahren zum befestigen eines wafers an einer einseiten-poliereinrichtung

Country Status (6)

Country Link
JP (1) JP6863220B2 (ja)
KR (1) KR102370447B1 (ja)
CN (1) CN111295267B (ja)
DE (1) DE112018004568T5 (ja)
TW (1) TWI711508B (ja)
WO (1) WO2019078009A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI741866B (zh) * 2020-11-06 2021-10-01 環球晶圓股份有限公司 晶圓載具的貼覆裝置及其操作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103707A (ja) 2005-10-05 2007-04-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨装置および研磨方法
JP2008080443A (ja) 2006-09-27 2008-04-10 Covalent Materials Corp 片面研磨装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05102114A (ja) * 1991-10-03 1993-04-23 Shibayama Kikai Kk 半導体ウエハの仮置台
JP4062552B2 (ja) * 1995-10-23 2008-03-19 日本政策投資銀行 半導体ウエハの位置合わせ及び水張り方法
JPH10337656A (ja) * 1997-06-05 1998-12-22 Mitsubishi Materials Corp ウェーハ研磨装置およびウェーハ保持用インサートの洗浄方法
US6354922B1 (en) * 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
JP2003109926A (ja) * 2001-09-26 2003-04-11 Applied Materials Inc 基板の受け渡し方法および機械化学的研磨装置
JP2005019439A (ja) * 2003-06-23 2005-01-20 Tokyo Seimitsu Co Ltd ウェーハ受渡し方法、ウェーハ受渡し装置及びそれを用いたウェーハ加工装置
JP2011121218A (ja) * 2009-12-09 2011-06-23 Seiko Epson Corp ノズルプレート、吐出ヘッド及びそれらの製造方法並びに吐出装置
CN106206280B (zh) * 2016-08-17 2019-03-01 苏州聚晶科技有限公司 一种硅晶片的单面去psg层及抛光的制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103707A (ja) 2005-10-05 2007-04-19 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの研磨装置および研磨方法
JP2008080443A (ja) 2006-09-27 2008-04-10 Covalent Materials Corp 片面研磨装置

Also Published As

Publication number Publication date
TW201922418A (zh) 2019-06-16
KR20200067875A (ko) 2020-06-12
JP6863220B2 (ja) 2021-04-21
WO2019078009A1 (ja) 2019-04-25
CN111295267B (zh) 2022-07-08
KR102370447B1 (ko) 2022-03-03
TWI711508B (zh) 2020-12-01
CN111295267A (zh) 2020-06-16
JP2019072796A (ja) 2019-05-16

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