DE112018001835A5 - Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement - Google Patents
Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement Download PDFInfo
- Publication number
- DE112018001835A5 DE112018001835A5 DE112018001835.0T DE112018001835T DE112018001835A5 DE 112018001835 A5 DE112018001835 A5 DE 112018001835A5 DE 112018001835 T DE112018001835 T DE 112018001835T DE 112018001835 A5 DE112018001835 A5 DE 112018001835A5
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor component
- optoelectronic semiconductor
- producing
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000005693 optoelectronics Effects 0.000 title 2
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017107201.2A DE102017107201A1 (de) | 2017-04-04 | 2017-04-04 | Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement |
| DE102017107201.2 | 2017-04-04 | ||
| PCT/EP2018/058461 WO2018185086A1 (de) | 2017-04-04 | 2018-04-03 | Verfahren zum herstellen eines optoelektronischen halbleiterbauelements und optoelektronisches halbleiterbauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112018001835A5 true DE112018001835A5 (de) | 2020-01-02 |
Family
ID=61868526
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102017107201.2A Withdrawn DE102017107201A1 (de) | 2017-04-04 | 2017-04-04 | Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement |
| DE112018001835.0T Withdrawn DE112018001835A5 (de) | 2017-04-04 | 2018-04-03 | Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102017107201.2A Withdrawn DE102017107201A1 (de) | 2017-04-04 | 2017-04-04 | Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US11069842B2 (de) |
| DE (2) | DE102017107201A1 (de) |
| WO (1) | WO2018185086A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019105402A1 (de) | 2019-03-04 | 2020-09-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender halbleiterchip, strahlungsemittierendes halbleiterbauelement und scheinwerfer |
| CN115863526A (zh) * | 2019-05-09 | 2023-03-28 | 群创光电股份有限公司 | 电子装置 |
| DE102020200621A1 (de) * | 2020-01-21 | 2021-07-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierender halbleiterchip und verfahren zur herstellung eines strahlungsemittierenden halbleiterchips |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011102032A1 (de) * | 2011-05-19 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleitermodul und Display mit einer Mehrzahl derartiger Module |
| DE102011056888A1 (de) | 2011-12-22 | 2013-06-27 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| US8952413B2 (en) * | 2012-03-08 | 2015-02-10 | Micron Technology, Inc. | Etched trenches in bond materials for die singulation, and associated systems and methods |
| DE102012217533A1 (de) * | 2012-09-27 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelements |
| DE102012109460B4 (de) * | 2012-10-04 | 2024-03-07 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines Leuchtdioden-Displays und Leuchtdioden-Display |
| DE102012112302A1 (de) * | 2012-12-14 | 2014-06-18 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung und Verfahren zur Herstellung einer Anzeigevorrichtung |
| DE102014101492A1 (de) * | 2014-02-06 | 2015-08-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement |
| KR102227085B1 (ko) * | 2014-03-05 | 2021-03-12 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
| CN104393137B (zh) * | 2014-09-30 | 2017-08-25 | 厦门市三安光电科技有限公司 | 一种倒装发光器件及其制作方法 |
| CN106558597B (zh) * | 2015-09-30 | 2020-03-06 | 三星电子株式会社 | 发光器件封装件 |
| DE102015120642A1 (de) * | 2015-11-27 | 2017-06-01 | Osram Opto Semiconductors Gmbh | Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement |
| US10529696B2 (en) * | 2016-04-12 | 2020-01-07 | Cree, Inc. | High density pixelated LED and devices and methods thereof |
-
2017
- 2017-04-04 DE DE102017107201.2A patent/DE102017107201A1/de not_active Withdrawn
-
2018
- 2018-04-03 WO PCT/EP2018/058461 patent/WO2018185086A1/de active Application Filing
- 2018-04-03 DE DE112018001835.0T patent/DE112018001835A5/de not_active Withdrawn
- 2018-04-03 US US16/498,331 patent/US11069842B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018185086A1 (de) | 2018-10-11 |
| US11069842B2 (en) | 2021-07-20 |
| DE102017107201A1 (de) | 2018-10-04 |
| US20200220056A1 (en) | 2020-07-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R081 | Change of applicant/patentee |
Owner name: OSRAM OPTO SEMICONDUCTORS GMBH, DE Free format text: FORMER OWNER: OSRAM OPTO SEMICONDUCTORS GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG, 93055 REGENSBURG, DE |
|
| R082 | Change of representative |
Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE |
|
| R083 | Amendment of/additions to inventor(s) | ||
| R083 | Amendment of/additions to inventor(s) | ||
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |