DE112019001007A5 - Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements - Google Patents
Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements Download PDFInfo
- Publication number
- DE112019001007A5 DE112019001007A5 DE112019001007.7T DE112019001007T DE112019001007A5 DE 112019001007 A5 DE112019001007 A5 DE 112019001007A5 DE 112019001007 T DE112019001007 T DE 112019001007T DE 112019001007 A5 DE112019001007 A5 DE 112019001007A5
- Authority
- DE
- Germany
- Prior art keywords
- optoelectronic component
- producing
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102018104382.1 | 2018-02-27 | ||
DE102018104382.1A DE102018104382A1 (de) | 2018-02-27 | 2018-02-27 | Optoelektronisches bauelement und herstellungsverfahren |
PCT/EP2019/054521 WO2019166352A1 (de) | 2018-02-27 | 2019-02-25 | Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112019001007A5 true DE112019001007A5 (de) | 2020-12-10 |
DE112019001007B4 DE112019001007B4 (de) | 2024-09-26 |
Family
ID=65685306
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102018104382.1A Withdrawn DE102018104382A1 (de) | 2018-02-27 | 2018-02-27 | Optoelektronisches bauelement und herstellungsverfahren |
DE112019001007.7T Active DE112019001007B4 (de) | 2018-02-27 | 2019-02-25 | Verfahren zum Herstellen eines optoelektronischen Bauelements |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102018104382.1A Withdrawn DE102018104382A1 (de) | 2018-02-27 | 2018-02-27 | Optoelektronisches bauelement und herstellungsverfahren |
Country Status (3)
Country | Link |
---|---|
US (1) | US11728321B2 (de) |
DE (2) | DE102018104382A1 (de) |
WO (1) | WO2019166352A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD1022930S1 (en) * | 2020-03-30 | 2024-04-16 | Quanzhou San'an Semiconductor Technology Co., Ltd. | LED chip |
JP1682751S (de) * | 2020-04-01 | 2021-04-05 | ||
DE102020121656A1 (de) * | 2020-08-18 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2981370B2 (ja) | 1993-07-16 | 1999-11-22 | シャープ株式会社 | Midチップ型発光素子 |
JP2001168400A (ja) * | 1999-12-09 | 2001-06-22 | Rohm Co Ltd | ケース付チップ型発光装置およびその製造方法 |
JP4627177B2 (ja) | 2004-11-10 | 2011-02-09 | スタンレー電気株式会社 | Ledの製造方法 |
KR100790741B1 (ko) * | 2006-09-07 | 2008-01-02 | 삼성전기주식회사 | 엘이디 패키지용 렌즈의 제작 방법 |
DE102007017855A1 (de) * | 2007-04-16 | 2008-10-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement |
DE202007007341U1 (de) * | 2007-05-23 | 2007-07-26 | Tsai, Hua-Hsin, Linnei | Decke der Verpackung einer LED-Anordnung |
KR100880638B1 (ko) * | 2007-07-06 | 2009-01-30 | 엘지전자 주식회사 | 발광 소자 패키지 |
US8525213B2 (en) * | 2010-03-30 | 2013-09-03 | Lg Innotek Co., Ltd. | Light emitting device having multiple cavities and light unit having the same |
JP5983603B2 (ja) * | 2011-05-16 | 2016-08-31 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
CN103050603B (zh) * | 2011-10-17 | 2016-03-23 | 展晶科技(深圳)有限公司 | Led封装结构的制作方法 |
DE102012109144A1 (de) * | 2012-09-27 | 2014-04-17 | Osram Opto Semiconductors Gmbh | Bauteilanordnung und Verfahren zum Herstellen von optischen Bauteilen |
KR20140108172A (ko) * | 2013-02-28 | 2014-09-05 | 서울반도체 주식회사 | 발광 모듈 |
DE102013220960A1 (de) * | 2013-10-16 | 2015-04-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu seiner Herstellung |
DE102015116263A1 (de) | 2015-09-25 | 2017-03-30 | Osram Opto Semiconductors Gmbh | Herstellung eines elektronischen Bauelements |
DE102016101719A1 (de) | 2016-02-01 | 2017-08-03 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement |
DE102017101267B4 (de) * | 2017-01-24 | 2023-11-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
-
2018
- 2018-02-27 DE DE102018104382.1A patent/DE102018104382A1/de not_active Withdrawn
-
2019
- 2019-02-25 DE DE112019001007.7T patent/DE112019001007B4/de active Active
- 2019-02-25 WO PCT/EP2019/054521 patent/WO2019166352A1/de active Application Filing
- 2019-02-25 US US16/969,153 patent/US11728321B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
DE112019001007B4 (de) | 2024-09-26 |
DE102018104382A1 (de) | 2019-08-29 |
US20210043615A1 (en) | 2021-02-11 |
US11728321B2 (en) | 2023-08-15 |
WO2019166352A1 (de) | 2019-09-06 |
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Legal Events
Date | Code | Title | Description |
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R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033000000 Ipc: H01L0033580000 |
|
R012 | Request for examination validly filed | ||
R082 | Change of representative |
Representative=s name: ENGELHARDT, MARTIN, DIPL.-PHYS. UNIV. DR. RER., DE |
|
R016 | Response to examination communication | ||
R018 | Grant decision by examination section/examining division |