DE112019001007A5 - Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements - Google Patents

Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements Download PDF

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Publication number
DE112019001007A5
DE112019001007A5 DE112019001007.7T DE112019001007T DE112019001007A5 DE 112019001007 A5 DE112019001007 A5 DE 112019001007A5 DE 112019001007 T DE112019001007 T DE 112019001007T DE 112019001007 A5 DE112019001007 A5 DE 112019001007A5
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DE
Germany
Prior art keywords
optoelectronic component
producing
optoelectronic
component
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Granted
Application number
DE112019001007.7T
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English (en)
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DE112019001007B4 (de
Inventor
Daniel Richter
Tobias Gebuhr
Michael Betz
Markus Boss
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Osram Oled GmbH
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Osram Oled GmbH
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Publication of DE112019001007A5 publication Critical patent/DE112019001007A5/de
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Publication of DE112019001007B4 publication Critical patent/DE112019001007B4/de
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112019001007.7T 2018-02-27 2019-02-25 Verfahren zum Herstellen eines optoelektronischen Bauelements Active DE112019001007B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018104382.1 2018-02-27
DE102018104382.1A DE102018104382A1 (de) 2018-02-27 2018-02-27 Optoelektronisches bauelement und herstellungsverfahren
PCT/EP2019/054521 WO2019166352A1 (de) 2018-02-27 2019-02-25 Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements

Publications (2)

Publication Number Publication Date
DE112019001007A5 true DE112019001007A5 (de) 2020-12-10
DE112019001007B4 DE112019001007B4 (de) 2024-09-26

Family

ID=65685306

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102018104382.1A Withdrawn DE102018104382A1 (de) 2018-02-27 2018-02-27 Optoelektronisches bauelement und herstellungsverfahren
DE112019001007.7T Active DE112019001007B4 (de) 2018-02-27 2019-02-25 Verfahren zum Herstellen eines optoelektronischen Bauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102018104382.1A Withdrawn DE102018104382A1 (de) 2018-02-27 2018-02-27 Optoelektronisches bauelement und herstellungsverfahren

Country Status (3)

Country Link
US (1) US11728321B2 (de)
DE (2) DE102018104382A1 (de)
WO (1) WO2019166352A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1022930S1 (en) * 2020-03-30 2024-04-16 Quanzhou San'an Semiconductor Technology Co., Ltd. LED chip
JP1682751S (de) * 2020-04-01 2021-04-05
DE102020121656A1 (de) * 2020-08-18 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2981370B2 (ja) 1993-07-16 1999-11-22 シャープ株式会社 Ｍｉｄチップ型発光素子
JP2001168400A (ja) * 1999-12-09 2001-06-22 Rohm Co Ltd ケース付チップ型発光装置およびその製造方法
JP4627177B2 (ja) 2004-11-10 2011-02-09 スタンレー電気株式会社 Ｌｅｄの製造方法
KR100790741B1 (ko) * 2006-09-07 2008-01-02 삼성전기주식회사 엘이디 패키지용 렌즈의 제작 방법
DE102007017855A1 (de) * 2007-04-16 2008-10-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement
DE202007007341U1 (de) * 2007-05-23 2007-07-26 Tsai, Hua-Hsin, Linnei Decke der Verpackung einer LED-Anordnung
KR100880638B1 (ko) * 2007-07-06 2009-01-30 엘지전자 주식회사 발광 소자 패키지
US8525213B2 (en) * 2010-03-30 2013-09-03 Lg Innotek Co., Ltd. Light emitting device having multiple cavities and light unit having the same
JP5983603B2 (ja) * 2011-05-16 2016-08-31 日亜化学工業株式会社 発光装置及びその製造方法
CN103050603B (zh) * 2011-10-17 2016-03-23 展晶科技(深圳)有限公司 Led封装结构的制作方法
DE102012109144A1 (de) * 2012-09-27 2014-04-17 Osram Opto Semiconductors Gmbh Bauteilanordnung und Verfahren zum Herstellen von optischen Bauteilen
KR20140108172A (ko) * 2013-02-28 2014-09-05 서울반도체 주식회사 발광 모듈
DE102013220960A1 (de) * 2013-10-16 2015-04-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE102015116263A1 (de) 2015-09-25 2017-03-30 Osram Opto Semiconductors Gmbh Herstellung eines elektronischen Bauelements
DE102016101719A1 (de) 2016-02-01 2017-08-03 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE102017101267B4 (de) * 2017-01-24 2023-11-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Also Published As

Publication number Publication date
DE112019001007B4 (de) 2024-09-26
DE102018104382A1 (de) 2019-08-29
US20210043615A1 (en) 2021-02-11
US11728321B2 (en) 2023-08-15
WO2019166352A1 (de) 2019-09-06

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