DE112018001205A5 - Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement - Google Patents

Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement Download PDF

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Publication number
DE112018001205A5
DE112018001205A5 DE112018001205.0T DE112018001205T DE112018001205A5 DE 112018001205 A5 DE112018001205 A5 DE 112018001205A5 DE 112018001205 T DE112018001205 T DE 112018001205T DE 112018001205 A5 DE112018001205 A5 DE 112018001205A5
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Prior art keywords
optoelectronic component
producing
optoelectronic
component
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DE112018001205.0T
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DE112018001205B4 (de
Inventor
Norwin Von Malm
Andreas Plössl
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0016—Processes relating to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
DE112018001205.0T 2017-03-08 2018-03-06 Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement Active DE112018001205B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017104886.3 2017-03-08
DE102017104886.3A DE102017104886A1 (de) 2017-03-08 2017-03-08 Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
PCT/EP2018/055472 WO2018162480A1 (de) 2017-03-08 2018-03-06 Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement

Publications (2)

Publication Number Publication Date
DE112018001205A5 true DE112018001205A5 (de) 2019-12-12
DE112018001205B4 DE112018001205B4 (de) 2024-01-04

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
DE102017104886.3A Withdrawn DE102017104886A1 (de) 2017-03-08 2017-03-08 Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE112018001205.0T Active DE112018001205B4 (de) 2017-03-08 2018-03-06 Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102017104886.3A Withdrawn DE102017104886A1 (de) 2017-03-08 2017-03-08 Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement

Country Status (4)

Country Link
US (1) US10991683B2 (de)
CN (1) CN110419103B (de)
DE (2) DE102017104886A1 (de)
WO (1) WO2018162480A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7100980B2 (ja) * 2018-01-22 2022-07-14 ローム株式会社 Ｌｅｄパッケージ
DE102022201411A1 (de) 2022-02-11 2023-08-17 Zf Friedrichshafen Ag Verfahren zum Herstellen einer elektronischen Schaltung durch selektive Diffusionslötung mittels gerichteter Diffusion

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
TW556044B (en) * 2001-02-15 2003-10-01 Sipix Imaging Inc Process for roll-to-roll manufacture of a display by synchronized photolithographic exposure on a substrate web
JP4416373B2 (ja) * 2002-03-08 2010-02-17 株式会社日立製作所 電子機器
JP2004119620A (ja) * 2002-09-25 2004-04-15 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
TWI281717B (en) * 2006-05-17 2007-05-21 Univ Tsinghua Apparatus for aligning microchips on substrate and method for the same
DE102009008032B4 (de) 2008-10-16 2010-06-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Selbstmontage von Bauelementen
JP5532886B2 (ja) * 2009-12-10 2014-06-25 東ソー株式会社 金属インジウムの製造方法
KR101058880B1 (ko) * 2010-05-07 2011-08-25 서울대학교산학협력단 액티브 소자를 구비한 ｌｅｄ 디스플레이 장치 및 그 제조방법
EP2688093B1 (de) 2012-07-19 2018-07-18 Technische Universität Ilmenau Verfahren und Vorrichtung zur Selbstmontage mittels eines Fluids von Komponenten auf einem Substrat
EP2880681A2 (de) * 2012-08-02 2015-06-10 Osram Sylvania Inc. Doppellotschicht für fluidische selbstanordnung und substrat eines elektrischen bauelements sowie verfahren zur anwendnung davon
DE102012216546B4 (de) * 2012-09-17 2023-01-19 Infineon Technologies Ag Verfahren zum verlöten eines halbleiterchips mit einem träger
KR102065485B1 (ko) * 2013-03-26 2020-01-14 엘지디스플레이 주식회사 포토레지스트 필름 및 이를 이용한 유기전계발광표시장치의 제조방법
KR102205692B1 (ko) * 2014-03-18 2021-01-21 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
US11605757B2 (en) * 2015-08-21 2023-03-14 Lg Electronics Inc. Display device using semiconductor light emitting diode

Also Published As

Publication number Publication date
WO2018162480A1 (de) 2018-09-13
DE102017104886A1 (de) 2018-09-13
US20200058630A1 (en) 2020-02-20
CN110419103B (zh) 2024-04-26
DE112018001205B4 (de) 2024-01-04
CN110419103A (zh) 2019-11-05
US10991683B2 (en) 2021-04-27

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