DE112013006244B4 - Verfahren zur Herstellung einer Verbundstruktur - Google Patents
Verfahren zur Herstellung einer Verbundstruktur Download PDFInfo
- Publication number
- DE112013006244B4 DE112013006244B4 DE112013006244.5T DE112013006244T DE112013006244B4 DE 112013006244 B4 DE112013006244 B4 DE 112013006244B4 DE 112013006244 T DE112013006244 T DE 112013006244T DE 112013006244 B4 DE112013006244 B4 DE 112013006244B4
- Authority
- DE
- Germany
- Prior art keywords
- monocrystalline silicon
- silicon substrate
- front surface
- wafer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 100
- 238000000034 method Methods 0.000 claims abstract description 49
- -1 helium ions Chemical class 0.000 claims abstract description 48
- 239000001257 hydrogen Substances 0.000 claims abstract description 38
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 38
- 239000001307 helium Substances 0.000 claims abstract description 33
- 229910052734 helium Inorganic materials 0.000 claims abstract description 33
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 33
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 27
- 239000010703 silicon Substances 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 238000003776 cleavage reaction Methods 0.000 claims abstract description 18
- 230000007017 scission Effects 0.000 claims abstract description 18
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 11
- 239000010980 sapphire Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000010453 quartz Substances 0.000 claims abstract description 10
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 7
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims abstract description 7
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 7
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 46
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 230000004913 activation Effects 0.000 claims description 8
- 239000002344 surface layer Substances 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 104
- 238000002513 implantation Methods 0.000 description 24
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- 238000001723 curing Methods 0.000 description 10
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 8
- 238000001029 thermal curing Methods 0.000 description 8
- 238000005468 ion implantation Methods 0.000 description 7
- 238000001994 activation Methods 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000000678 plasma activation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 241000252506 Characiformes Species 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004992 fission Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 238000009279 wet oxidation reaction Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 238000002109 crystal growth method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261746822P | 2012-12-28 | 2012-12-28 | |
| US61/746,822 | 2012-12-28 | ||
| PCT/US2013/077491 WO2014105828A1 (en) | 2012-12-28 | 2013-12-23 | Method for low temperature layer transfer in the preparation of multilayer semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE112013006244T5 DE112013006244T5 (de) | 2015-10-08 |
| DE112013006244B4 true DE112013006244B4 (de) | 2020-03-05 |
Family
ID=50031514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112013006244.5T Active DE112013006244B4 (de) | 2012-12-28 | 2013-12-23 | Verfahren zur Herstellung einer Verbundstruktur |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9281233B2 (enExample) |
| JP (2) | JP2016508291A (enExample) |
| KR (1) | KR102026506B1 (enExample) |
| DE (1) | DE112013006244B4 (enExample) |
| TW (1) | TWI603387B (enExample) |
| WO (1) | WO2014105828A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015210384A1 (de) | 2015-06-05 | 2016-12-08 | Soitec | Verfahren zur mechanischen Trennung für eine Doppelschichtübertragung |
| JP6632462B2 (ja) * | 2016-04-28 | 2020-01-22 | 信越化学工業株式会社 | 複合ウェーハの製造方法 |
| WO2019236320A1 (en) * | 2018-06-08 | 2019-12-12 | Globalwafers Co., Ltd. | Method for transfer of a thin layer of silicon |
| CN110739217B (zh) * | 2019-10-28 | 2025-10-10 | 沈阳硅基科技有限公司 | 一种降低soi硅片应力的制备方法 |
| PL445432A1 (pl) * | 2023-06-30 | 2025-01-07 | Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki I Fotoniki | Sposób modyfikacji podłoża z monokrystalicznego SiC, zmodyfikowane podłoże, urządzenie zawierające takie podłoże i zastosowanie takiego urządzenia |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5189500A (en) * | 1989-09-22 | 1993-02-23 | Mitsubishi Denki Kabushiki Kaisha | Multi-layer type semiconductor device with semiconductor element layers stacked in opposite directions and manufacturing method thereof |
| US20070037363A1 (en) * | 2002-11-07 | 2007-02-15 | Bernard Aspar | Method for forming a brittle zone in a substrate by co-implantation |
| US20070212852A1 (en) * | 2006-03-13 | 2007-09-13 | Tauzin Aurelie | Method of fabricating a thin film |
| US20100127343A1 (en) * | 2008-11-26 | 2010-05-27 | Christopher Paul Daigler | Glass-Ceramic-Based Semiconductor-On-Insulator Structures and Method For Making The Same |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2748851B1 (fr) * | 1996-05-15 | 1998-08-07 | Commissariat Energie Atomique | Procede de realisation d'une couche mince de materiau semiconducteur |
| FR2774511B1 (fr) * | 1998-01-30 | 2002-10-11 | Commissariat Energie Atomique | Substrat compliant en particulier pour un depot par hetero-epitaxie |
| JP3456521B2 (ja) * | 1998-05-12 | 2003-10-14 | 三菱住友シリコン株式会社 | Ｓｏｉ基板の製造方法 |
| FR2797347B1 (fr) * | 1999-08-04 | 2001-11-23 | Commissariat Energie Atomique | Procede de transfert d'une couche mince comportant une etape de surfragililisation |
| FR2809867B1 (fr) * | 2000-05-30 | 2003-10-24 | Commissariat Energie Atomique | Substrat fragilise et procede de fabrication d'un tel substrat |
| KR100511656B1 (ko) * | 2002-08-10 | 2005-09-07 | 주식회사 실트론 | 나노 에스오아이 웨이퍼의 제조방법 및 그에 따라 제조된나노 에스오아이 웨이퍼 |
| US20060240275A1 (en) * | 2005-04-25 | 2006-10-26 | Gadkaree Kishor P | Flexible display substrates |
| US7575988B2 (en) * | 2006-07-11 | 2009-08-18 | S.O.I.Tec Silicon On Insulator Technologies | Method of fabricating a hybrid substrate |
| FR2914110B1 (fr) * | 2007-03-20 | 2009-06-05 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat hybride |
| JP2008153411A (ja) * | 2006-12-18 | 2008-07-03 | Shin Etsu Chem Co Ltd | Ｓｏｉ基板の製造方法 |
| US7795111B2 (en) * | 2007-06-27 | 2010-09-14 | Semiconductor Energy Laboratory Co., Ltd. | Manufacturing method of SOI substrate and manufacturing method of semiconductor device |
| JP4631946B2 (ja) * | 2008-08-11 | 2011-02-16 | 住友電気工業株式会社 | Ｉｉｉ族窒化物半導体層貼り合わせ基板の製造方法 |
| JP2010278342A (ja) * | 2009-05-29 | 2010-12-09 | Shin-Etsu Chemical Co Ltd | Ｓｏｉ基板の製造方法 |
| US8367519B2 (en) * | 2009-12-30 | 2013-02-05 | Memc Electronic Materials, Inc. | Method for the preparation of a multi-layered crystalline structure |
-
2013
- 2013-12-19 US US14/133,893 patent/US9281233B2/en active Active
- 2013-12-23 WO PCT/US2013/077491 patent/WO2014105828A1/en not_active Ceased
- 2013-12-23 DE DE112013006244.5T patent/DE112013006244B4/de active Active
- 2013-12-23 KR KR1020157020111A patent/KR102026506B1/ko active Active
- 2013-12-23 JP JP2015550735A patent/JP2016508291A/ja active Pending
- 2013-12-27 TW TW102148841A patent/TWI603387B/zh active
-
2018
- 2018-01-24 JP JP2018009428A patent/JP2018085536A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5189500A (en) * | 1989-09-22 | 1993-02-23 | Mitsubishi Denki Kabushiki Kaisha | Multi-layer type semiconductor device with semiconductor element layers stacked in opposite directions and manufacturing method thereof |
| US20070037363A1 (en) * | 2002-11-07 | 2007-02-15 | Bernard Aspar | Method for forming a brittle zone in a substrate by co-implantation |
| US20070212852A1 (en) * | 2006-03-13 | 2007-09-13 | Tauzin Aurelie | Method of fabricating a thin film |
| US20100127343A1 (en) * | 2008-11-26 | 2010-05-27 | Christopher Paul Daigler | Glass-Ceramic-Based Semiconductor-On-Insulator Structures and Method For Making The Same |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112013006244T5 (de) | 2015-10-08 |
| WO2014105828A1 (en) | 2014-07-03 |
| US20140187020A1 (en) | 2014-07-03 |
| KR102026506B1 (ko) | 2019-09-27 |
| KR20150099847A (ko) | 2015-09-01 |
| TWI603387B (zh) | 2017-10-21 |
| JP2018085536A (ja) | 2018-05-31 |
| US9281233B2 (en) | 2016-03-08 |
| JP2016508291A (ja) | 2016-03-17 |
| TW201435991A (zh) | 2014-09-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R016 | Response to examination communication | ||
| R081 | Change of applicant/patentee |
Owner name: GLOBALWAFERS CO., LTD., TW Free format text: FORMER OWNER: SUNEDISON SEMICONDUCTOR LTD., SINGAPUR, SG |
|
| R082 | Change of representative |
Representative=s name: MAIWALD PATENTANWALTS- UND RECHTSANWALTSGESELL, DE |
|
| R016 | Response to examination communication | ||
| R018 | Grant decision by examination section/examining division | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0021762000 Ipc: H01L0021840000 |
|
| R020 | Patent grant now final | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0021840000 Ipc: H10D0086010000 |