DE112013005519A5 - Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements - Google Patents
Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements Download PDFInfo
- Publication number
- DE112013005519A5 DE112013005519A5 DE112013005519.8T DE112013005519T DE112013005519A5 DE 112013005519 A5 DE112013005519 A5 DE 112013005519A5 DE 112013005519 T DE112013005519 T DE 112013005519T DE 112013005519 A5 DE112013005519 A5 DE 112013005519A5
- Authority
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- Germany
- Prior art keywords
- producing
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- electronic component
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45536—Use of plasma, radiation or electromagnetic fields
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0025—Processes relating to coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102012221080.6A DE102012221080A1 (de) | 2012-11-19 | 2012-11-19 | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
DE102012221080.6 | 2012-11-19 | ||
PCT/EP2013/074068 WO2014076276A1 (de) | 2012-11-19 | 2013-11-18 | Verfahren zur herstellung einer schicht auf einem oberflächenbereich eines elektronischen bauelements |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112013005519A5 true DE112013005519A5 (de) | 2015-07-30 |
DE112013005519B4 DE112013005519B4 (de) | 2021-06-24 |
Family
ID=49619927
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102012221080.6A Withdrawn DE102012221080A1 (de) | 2012-11-19 | 2012-11-19 | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
DE112013005519.8T Active DE112013005519B4 (de) | 2012-11-19 | 2013-11-18 | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102012221080.6A Withdrawn DE102012221080A1 (de) | 2012-11-19 | 2012-11-19 | Verfahren zur Herstellung einer Schicht auf einem Oberflächenbereich eines elektronischen Bauelements |
Country Status (6)
Country | Link |
---|---|
US (1) | US20150292085A1 (de) |
JP (1) | JP2016506013A (de) |
KR (1) | KR102129939B1 (de) |
CN (1) | CN104798220B (de) |
DE (2) | DE102012221080A1 (de) |
WO (1) | WO2014076276A1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI126794B (en) * | 2014-12-22 | 2017-05-31 | Picosun Oy | Photo-assisted coating process |
FI126970B (en) * | 2014-12-22 | 2017-08-31 | Picosun Oy | Atomic layer cultivation in which the first and second species of source materials are present simultaneously |
JP6716129B2 (ja) * | 2015-11-30 | 2020-07-01 | 気相成長株式会社 | 金属酸化物膜形成方法 |
CN105972454B (zh) * | 2016-08-10 | 2020-01-31 | 广东合一新材料研究院有限公司 | 一种相变热管式大功率led灯及其散热方法 |
DE102016224114A1 (de) * | 2016-12-05 | 2018-06-07 | Innovent E.V. | Verfahren zum Beschichten eines Substrats |
CN106929821B (zh) * | 2017-01-17 | 2019-12-20 | 复旦大学 | 一种金属含量可调的金属氮化物薄膜的制备方法及反应器 |
KR102520541B1 (ko) * | 2018-02-14 | 2023-04-10 | 엘지디스플레이 주식회사 | 산화물 박막의 제조 장치와 제조 방법 및 그 산화물 박막을 포함하는 디스플레이 장치 |
CN109457234A (zh) * | 2018-10-29 | 2019-03-12 | 吉林大学 | 一种高能光子辅助的原子层沉积方法 |
FI129040B (fi) * | 2019-06-06 | 2021-05-31 | Picosun Oy | Fluidia läpäisevien materiaalien päällystäminen |
DE102021116036A1 (de) | 2021-06-21 | 2022-12-22 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Verfahren und System zum Herstellen einer metallischen Struktur |
Family Cites Families (29)
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US5863327A (en) * | 1997-02-10 | 1999-01-26 | Micron Technology, Inc. | Apparatus for forming materials |
JP2002170821A (ja) * | 2000-11-30 | 2002-06-14 | Sony Corp | 膜の形成方法 |
KR100407381B1 (ko) * | 2001-06-29 | 2003-12-01 | 주식회사 하이닉스반도체 | 반도체 소자의 커패시터 형성방법 |
JP3944461B2 (ja) * | 2002-03-27 | 2007-07-11 | 株式会社東芝 | 電界効果型トランジスタおよびその応用装置 |
US7115304B2 (en) * | 2004-02-19 | 2006-10-03 | Nanosolar, Inc. | High throughput surface treatment on coiled flexible substrates |
JP4595727B2 (ja) * | 2005-07-22 | 2010-12-08 | ソニー株式会社 | 外力推定システム及び外力推定方法、並びにコンピュータ・プログラム |
US7727912B2 (en) * | 2006-03-20 | 2010-06-01 | Tokyo Electron Limited | Method of light enhanced atomic layer deposition |
US7413982B2 (en) * | 2006-03-29 | 2008-08-19 | Eastman Kodak Company | Process for atomic layer deposition |
US20070259111A1 (en) * | 2006-05-05 | 2007-11-08 | Singh Kaushal K | Method and apparatus for photo-excitation of chemicals for atomic layer deposition of dielectric film |
US7798096B2 (en) * | 2006-05-05 | 2010-09-21 | Applied Materials, Inc. | Plasma, UV and ion/neutral assisted ALD or CVD in a batch tool |
US20100024732A1 (en) * | 2006-06-02 | 2010-02-04 | Nima Mokhlesi | Systems for Flash Heating in Atomic Layer Deposition |
US20070281105A1 (en) * | 2006-06-02 | 2007-12-06 | Nima Mokhlesi | Atomic Layer Deposition of Oxides Using Krypton as an Ion Generating Feeding Gas |
WO2008013659A2 (en) * | 2006-07-21 | 2008-01-31 | The Boc Group, Inc. | Single precursors for atomic layer deposition |
US20080226842A1 (en) * | 2006-09-29 | 2008-09-18 | Tokyo Electron Limited | Lazy Susan Tool Layout for Light-Activated ALD |
TWI438953B (zh) * | 2008-01-30 | 2014-05-21 | Osram Opto Semiconductors Gmbh | 電子組件之製造方法及電子組件 |
US8009938B2 (en) * | 2008-02-29 | 2011-08-30 | Applied Materials, Inc. | Advanced process sensing and control using near infrared spectral reflectometry |
DE102008015697A1 (de) * | 2008-03-26 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines strukturierten optoelektronischen Bauelementes und Anordnung zur Durchführung eines solchen |
DE102008019926B4 (de) * | 2008-04-21 | 2011-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Beleuchtungsvorrichtung und Verfahren zur Erzeugung einer flächigen Lichtausgabe |
US20090278454A1 (en) * | 2008-05-12 | 2009-11-12 | Fedorovskaya Elena A | Oled display encapsulated with a filter |
CN101620991B (zh) * | 2008-07-02 | 2011-08-17 | 中芯国际集成电路制造(上海)有限公司 | Tft快闪存储单元的原子层沉积外延硅生长 |
EP2356372B1 (de) | 2008-12-11 | 2016-08-10 | OSRAM OLED GmbH | Organische leuchtdiode und beleuchtungsmittel |
US20100221426A1 (en) * | 2009-03-02 | 2010-09-02 | Fluens Corporation | Web Substrate Deposition System |
DE102009024411A1 (de) * | 2009-03-24 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
US8372667B2 (en) * | 2009-04-20 | 2013-02-12 | Applied Materials, Inc. | Fiber laser substrate processing |
US8548203B2 (en) * | 2010-07-12 | 2013-10-01 | International Business Machines Corporation | Sequential event detection from video |
JP2013533602A (ja) * | 2010-08-13 | 2013-08-22 | エルジー・ケム・リミテッド | 有機発光素子およびその製造方法 |
JP2012077064A (ja) * | 2010-09-08 | 2012-04-19 | Fujifilm Corp | 光電変換材料、該材料を含む膜、光電変換素子、光電変換素子の製造方法、光電変換素子の使用方法、光センサ、撮像素子 |
DE102010040839B4 (de) * | 2010-09-15 | 2013-10-17 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines elektronsichen Bauelements und elektronisches Bauelement |
US20120225203A1 (en) * | 2011-03-01 | 2012-09-06 | Applied Materials, Inc. | Apparatus and Process for Atomic Layer Deposition |
-
2012
- 2012-11-19 DE DE102012221080.6A patent/DE102012221080A1/de not_active Withdrawn
-
2013
- 2013-11-18 KR KR1020157015968A patent/KR102129939B1/ko active IP Right Grant
- 2013-11-18 WO PCT/EP2013/074068 patent/WO2014076276A1/de active Application Filing
- 2013-11-18 US US14/646,004 patent/US20150292085A1/en not_active Abandoned
- 2013-11-18 CN CN201380060345.XA patent/CN104798220B/zh active Active
- 2013-11-18 JP JP2015542284A patent/JP2016506013A/ja active Pending
- 2013-11-18 DE DE112013005519.8T patent/DE112013005519B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
DE112013005519B4 (de) | 2021-06-24 |
US20150292085A1 (en) | 2015-10-15 |
KR20150087311A (ko) | 2015-07-29 |
CN104798220A (zh) | 2015-07-22 |
DE102012221080A1 (de) | 2014-03-06 |
KR102129939B1 (ko) | 2020-07-03 |
CN104798220B (zh) | 2018-06-12 |
WO2014076276A1 (de) | 2014-05-22 |
JP2016506013A (ja) | 2016-02-25 |
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