DE102016105735B8 - Verfahren zur Ausbildung eines Verdrahtungsmusters - Google Patents

Verfahren zur Ausbildung eines Verdrahtungsmusters Download PDF

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Publication number
DE102016105735B8
DE102016105735B8 DE102016105735.5A DE102016105735A DE102016105735B8 DE 102016105735 B8 DE102016105735 B8 DE 102016105735B8 DE 102016105735 A DE102016105735 A DE 102016105735A DE 102016105735 B8 DE102016105735 B8 DE 102016105735B8
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DE
Germany
Prior art keywords
forming
wiring pattern
wiring
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102016105735.5A
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English (en)
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DE102016105735B4 (de
DE102016105735A1 (de
Inventor
Yuki Sato
Motoki Hiraoka
Hiroshi Yanagimoto
Hiroki Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Motor Corp
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Toyota Motor Corp
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Publication date
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Publication of DE102016105735B4 publication Critical patent/DE102016105735B4/de
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0121—Patterning, e.g. plating or etching by moving electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE102016105735.5A 2015-04-02 2016-03-30 Verfahren zur Ausbildung eines Verdrahtungsmusters Active DE102016105735B8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-076033 2015-04-02
JP2015076033A JP6265163B2 (ja) 2015-04-02 2015-04-02 配線パターンの形成方法および配線パターン形成用のエッチング処理装置

Publications (3)

Publication Number Publication Date
DE102016105735A1 DE102016105735A1 (de) 2016-10-06
DE102016105735B4 DE102016105735B4 (de) 2021-12-30
DE102016105735B8 true DE102016105735B8 (de) 2022-03-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102016105735.5A Active DE102016105735B8 (de) 2015-04-02 2016-03-30 Verfahren zur Ausbildung eines Verdrahtungsmusters

Country Status (4)

Country Link
US (1) US10161055B2 (de)
JP (1) JP6265163B2 (de)
CN (1) CN106061124B (de)
DE (1) DE102016105735B8 (de)

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US20170253988A1 (en) * 2016-03-01 2017-09-07 The Boeing Company Electromodification of Conductive Surfaces
JP6960452B2 (ja) * 2016-09-16 2021-11-05 スリーエム イノベイティブ プロパティズ カンパニー ナノ構造シリンダー形ロールの製造方法
CN108319083A (zh) * 2018-02-11 2018-07-24 深圳市华星光电半导体显示技术有限公司 一种显示组件及制造方法
KR102254027B1 (ko) * 2019-11-28 2021-05-20 (주)천우테크 고정식 대형 스테인리스스틸 저장탱크 내부의 표면처리를 할 수 있는 이동식 전해연마 시스템
JP7310599B2 (ja) * 2019-12-26 2023-07-19 トヨタ自動車株式会社 配線基板の製造方法および配線基板
WO2021203415A1 (zh) * 2020-04-10 2021-10-14 京东方科技集团股份有限公司 驱动基板及其制作方法、显示装置
JP7439652B2 (ja) 2020-06-02 2024-02-28 トヨタ自動車株式会社 配線基板の製造方法
JP7424218B2 (ja) * 2020-06-12 2024-01-30 トヨタ自動車株式会社 配線基板の製造方法
JP7306337B2 (ja) * 2020-06-25 2023-07-11 トヨタ自動車株式会社 配線基板の製造方法
JP7354944B2 (ja) * 2020-07-06 2023-10-03 トヨタ自動車株式会社 配線基板の製造方法
JP7456330B2 (ja) * 2020-08-21 2024-03-27 トヨタ自動車株式会社 配線基板の製造方法
JP7318620B2 (ja) * 2020-09-29 2023-08-01 トヨタ自動車株式会社 金属皮膜の成膜方法および金属皮膜の成膜装置
JP2022127486A (ja) 2021-02-19 2022-08-31 トヨタ自動車株式会社 配線基板の製造方法

Citations (1)

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Publication number Priority date Publication date Assignee Title
US20150014178A1 (en) 2012-02-23 2015-01-15 Toyota Jidosha Kabushiki Kaisha Film formation device and film formation method for forming metal film

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JP3493703B2 (ja) * 1994-01-25 2004-02-03 松下電工株式会社 回路板の形成方法
DE10145750A1 (de) * 2001-09-17 2003-04-24 Infineon Technologies Ag Verfahren zur Herstellung einer Metallschicht auf einem Trägerkörper und Trägerkörper mit einer Metallschicht
JP4848626B2 (ja) 2004-09-07 2011-12-28 トヨタ自動車株式会社 回路成形品の製造方法
JP4682285B2 (ja) * 2007-08-30 2011-05-11 日立電線株式会社 配線及び層間接続ビアの形成方法
US8621749B2 (en) * 2010-03-12 2014-01-07 Taiwan Green Point Enterprises Co., Ltd Non-deleterious technique for creating continuous conductive circuits
TW201729654A (zh) * 2011-11-28 2017-08-16 綠點高新科技股份有限公司 導電線路的製備方法
JP5803858B2 (ja) 2012-09-06 2015-11-04 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
JP2014063783A (ja) * 2012-09-20 2014-04-10 Murata Mfg Co Ltd 配線基板、および、配線基板の製造方法
JP5907049B2 (ja) * 2012-12-07 2016-04-20 トヨタ自動車株式会社 表面処理装置およびその処理方法
JP5692268B2 (ja) 2013-03-25 2015-04-01 トヨタ自動車株式会社 金属被膜の成膜装置および成膜方法
US9828677B2 (en) * 2014-01-16 2017-11-28 The United States Of America, As Represented By The Secretary Of Commerce Article and process for selective etching

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150014178A1 (en) 2012-02-23 2015-01-15 Toyota Jidosha Kabushiki Kaisha Film formation device and film formation method for forming metal film

Also Published As

Publication number Publication date
US10161055B2 (en) 2018-12-25
CN106061124A (zh) 2016-10-26
CN106061124B (zh) 2018-12-21
DE102016105735B4 (de) 2021-12-30
DE102016105735A1 (de) 2016-10-06
US20160289840A1 (en) 2016-10-06
JP6265163B2 (ja) 2018-01-24
JP2016196673A (ja) 2016-11-24

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