DE112011101556B4 - Gemischtlegierungslötmittelpaste - Google Patents

Gemischtlegierungslötmittelpaste Download PDF

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Publication number
DE112011101556B4
DE112011101556B4 DE112011101556.9T DE112011101556T DE112011101556B4 DE 112011101556 B4 DE112011101556 B4 DE 112011101556B4 DE 112011101556 T DE112011101556 T DE 112011101556T DE 112011101556 B4 DE112011101556 B4 DE 112011101556B4
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DE
Germany
Prior art keywords
alloy
weight
solder
paste
balance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112011101556.9T
Other languages
German (de)
English (en)
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DE112011101556T5 (de
Inventor
Hongwen Zhang
Ning-Cheng Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Indium Corp
Original Assignee
Indium Corp
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Publication date
Application filed by Indium Corp filed Critical Indium Corp
Publication of DE112011101556T5 publication Critical patent/DE112011101556T5/de
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Publication of DE112011101556B4 publication Critical patent/DE112011101556B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
DE112011101556.9T 2010-05-03 2011-04-04 Gemischtlegierungslötmittelpaste Active DE112011101556B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/772,897 US9017446B2 (en) 2010-05-03 2010-05-03 Mixed alloy solder paste
US12/772,897 2010-05-03
PCT/US2011/031107 WO2011139454A1 (en) 2010-05-03 2011-04-04 Mixed alloy solder paste

Publications (2)

Publication Number Publication Date
DE112011101556T5 DE112011101556T5 (de) 2013-02-14
DE112011101556B4 true DE112011101556B4 (de) 2023-11-09

Family

ID=44259596

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112011101556.9T Active DE112011101556B4 (de) 2010-05-03 2011-04-04 Gemischtlegierungslötmittelpaste

Country Status (7)

Country Link
US (2) US9017446B2 (https=)
JP (1) JP5938032B2 (https=)
KR (1) KR101820986B1 (https=)
CN (1) CN102892549B (https=)
DE (1) DE112011101556B4 (https=)
MY (1) MY158123A (https=)
WO (1) WO2011139454A1 (https=)

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US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
US11189537B2 (en) * 2012-03-21 2021-11-30 Infineon Technologies Ag Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
JP5635561B2 (ja) * 2012-06-21 2014-12-03 株式会社タムラ製作所 はんだ組成物
WO2014061085A1 (ja) * 2012-10-15 2014-04-24 千住金属工業株式会社 低温ソルダペーストのはんだ付け方法
US9272371B2 (en) * 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
EP3078446B1 (en) * 2013-12-03 2020-02-05 Hiroshima University Method of manufacturing a solder material and joining structure
US10376995B2 (en) 2013-12-13 2019-08-13 Schlumberger Technology Corporation Tin-antimony-based high temperature solder for downhole components
CN104668810B (zh) * 2015-01-29 2016-09-07 苏州天兼新材料科技有限公司 一种新型无铅焊接材料及其助焊剂的制备方法
WO2016144945A1 (en) * 2015-03-10 2016-09-15 Indium Corporation Mixed alloy solder paste
WO2016157971A1 (ja) * 2015-03-31 2016-10-06 住友金属鉱山株式会社 はんだペースト
TWI764632B (zh) * 2015-05-05 2022-05-11 美商銦業公司 用於嚴苛環境之電子應用的高可靠度無鉛焊料合金
JP6826995B2 (ja) * 2015-05-15 2021-02-10 アプティブ・テクノロジーズ・リミテッド インジウム−スズ−銀ベースの無鉛はんだ
CN105140209A (zh) * 2015-06-26 2015-12-09 江苏师范大学 一种用于3D封装芯片堆叠的In基互连材料
CN105234579B (zh) * 2015-10-21 2017-09-29 张家港市东大工业技术研究院 一种添加抗氧化颗粒的低熔点焊膏
US10376997B2 (en) 2016-06-23 2019-08-13 Purdue Research Foundation Transient liquid phase bonding process and assemblies formed thereby
TWI647316B (zh) * 2016-07-15 2019-01-11 Ｊｘ金屬股份有限公司 Solder alloy
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏
US10888958B2 (en) * 2018-05-29 2021-01-12 Indium Corporation Hybrid high temperature lead-free solder preform
WO2020044650A1 (ja) * 2018-08-31 2020-03-05 Ｊｘ金属株式会社 はんだ合金
US12030139B2 (en) 2018-10-31 2024-07-09 Robert Bosch Gmbh Sn—Cu mixed alloy solder paste, method of making the same and soldering method
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
JPWO2022153703A1 (https=) * 2021-01-18 2022-07-21
CN117480029A (zh) * 2021-06-11 2024-01-30 铟泰公司 混合焊料合金粉末的高可靠性无铅焊膏
US20230241725A1 (en) * 2022-01-19 2023-08-03 Ning-Cheng Lee Solder pastes and methods of using the same
EP4570420A4 (en) 2022-08-12 2026-03-11 Senju Metal Industry Co WELDING ALLOY, SOLDER PASTE AND SOFT BRAZING JOINT

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH11186712A (ja) 1997-12-24 1999-07-09 Nissan Motor Co Ltd はんだペーストおよび接続方法
US20090301607A1 (en) 2005-11-11 2009-12-10 Kosuke Nakano Solder Paste and Solder Joint

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JP5169871B2 (ja) 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
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JP5698447B2 (ja) * 2009-09-08 2015-04-08 株式会社タムラ製作所 はんだ接合剤組成物
JP5160576B2 (ja) * 2010-02-22 2013-03-13 株式会社タムラ製作所 ソルダペーストと、これを用いたピングリッドアレイパッケージ用基板及びピングリッドアレイパッケージ、並びにピングリッドアレイパッケージ用基板の製造方法
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
KR20140121211A (ko) 2013-04-05 2014-10-15 부산대학교 산학협력단 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11186712A (ja) 1997-12-24 1999-07-09 Nissan Motor Co Ltd はんだペーストおよび接続方法
US20090301607A1 (en) 2005-11-11 2009-12-10 Kosuke Nakano Solder Paste and Solder Joint

Also Published As

Publication number Publication date
JP5938032B2 (ja) 2016-06-22
US10118260B2 (en) 2018-11-06
WO2011139454A1 (en) 2011-11-10
US20110268985A1 (en) 2011-11-03
US20150224602A1 (en) 2015-08-13
CN102892549A (zh) 2013-01-23
MY158123A (en) 2016-08-30
DE112011101556T5 (de) 2013-02-14
KR101820986B1 (ko) 2018-01-22
US9017446B2 (en) 2015-04-28
KR20130056235A (ko) 2013-05-29
JP2013525121A (ja) 2013-06-20
CN102892549B (zh) 2017-01-18

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