MY158123A - Mixed alloy solder paste - Google Patents

Mixed alloy solder paste

Info

Publication number
MY158123A
MY158123A MYPI2012004531A MYPI2012004531A MY158123A MY 158123 A MY158123 A MY 158123A MY PI2012004531 A MYPI2012004531 A MY PI2012004531A MY PI2012004531 A MYPI2012004531 A MY PI2012004531A MY 158123 A MY158123 A MY 158123A
Authority
MY
Malaysia
Prior art keywords
solder alloy
solder paste
alloy solder
mixed alloy
alloy powder
Prior art date
Application number
MYPI2012004531A
Other languages
English (en)
Inventor
Zhang Hongwen
Lee Ning-Cheng
Original Assignee
Indium Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp filed Critical Indium Corp
Publication of MY158123A publication Critical patent/MY158123A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01361—Chemical or physical modification, e.g. by sintering or anodisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
MYPI2012004531A 2010-05-03 2011-04-04 Mixed alloy solder paste MY158123A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/772,897 US9017446B2 (en) 2010-05-03 2010-05-03 Mixed alloy solder paste

Publications (1)

Publication Number Publication Date
MY158123A true MY158123A (en) 2016-08-30

Family

ID=44259596

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012004531A MY158123A (en) 2010-05-03 2011-04-04 Mixed alloy solder paste

Country Status (7)

Country Link
US (2) US9017446B2 (https=)
JP (1) JP5938032B2 (https=)
KR (1) KR101820986B1 (https=)
CN (1) CN102892549B (https=)
DE (1) DE112011101556B4 (https=)
MY (1) MY158123A (https=)
WO (1) WO2011139454A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
US11189537B2 (en) * 2012-03-21 2021-11-30 Infineon Technologies Ag Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
JP5635561B2 (ja) * 2012-06-21 2014-12-03 株式会社タムラ製作所 はんだ組成物
WO2014061085A1 (ja) * 2012-10-15 2014-04-24 千住金属工業株式会社 低温ソルダペーストのはんだ付け方法
US9272371B2 (en) * 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
EP3078446B1 (en) * 2013-12-03 2020-02-05 Hiroshima University Method of manufacturing a solder material and joining structure
US10376995B2 (en) 2013-12-13 2019-08-13 Schlumberger Technology Corporation Tin-antimony-based high temperature solder for downhole components
CN104668810B (zh) * 2015-01-29 2016-09-07 苏州天兼新材料科技有限公司 一种新型无铅焊接材料及其助焊剂的制备方法
WO2016144945A1 (en) * 2015-03-10 2016-09-15 Indium Corporation Mixed alloy solder paste
WO2016157971A1 (ja) * 2015-03-31 2016-10-06 住友金属鉱山株式会社 はんだペースト
TWI764632B (zh) * 2015-05-05 2022-05-11 美商銦業公司 用於嚴苛環境之電子應用的高可靠度無鉛焊料合金
JP6826995B2 (ja) * 2015-05-15 2021-02-10 アプティブ・テクノロジーズ・リミテッド インジウム−スズ−銀ベースの無鉛はんだ
CN105140209A (zh) * 2015-06-26 2015-12-09 江苏师范大学 一种用于3D封装芯片堆叠的In基互连材料
CN105234579B (zh) * 2015-10-21 2017-09-29 张家港市东大工业技术研究院 一种添加抗氧化颗粒的低熔点焊膏
US10376997B2 (en) 2016-06-23 2019-08-13 Purdue Research Foundation Transient liquid phase bonding process and assemblies formed thereby
TWI647316B (zh) * 2016-07-15 2019-01-11 Ｊｘ金屬股份有限公司 Solder alloy
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections
CN108857135A (zh) * 2018-03-12 2018-11-23 深圳市鑫富锦新材料有限公司 一种混合合金焊料膏
US10888958B2 (en) * 2018-05-29 2021-01-12 Indium Corporation Hybrid high temperature lead-free solder preform
WO2020044650A1 (ja) * 2018-08-31 2020-03-05 Ｊｘ金属株式会社 はんだ合金
US12030139B2 (en) 2018-10-31 2024-07-09 Robert Bosch Gmbh Sn—Cu mixed alloy solder paste, method of making the same and soldering method
US11267080B2 (en) * 2019-05-09 2022-03-08 Indium Corporation Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders
CN110936062A (zh) * 2019-12-18 2020-03-31 陕西易莱德新材料科技有限公司 一种添加有铂金属的焊料及其制备方法
JPWO2022153703A1 (https=) * 2021-01-18 2022-07-21
CN117480029A (zh) * 2021-06-11 2024-01-30 铟泰公司 混合焊料合金粉末的高可靠性无铅焊膏
US20230241725A1 (en) * 2022-01-19 2023-08-03 Ning-Cheng Lee Solder pastes and methods of using the same
EP4570420A4 (en) 2022-08-12 2026-03-11 Senju Metal Industry Co WELDING ALLOY, SOLDER PASTE AND SOFT BRAZING JOINT

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4767471A (en) * 1986-10-03 1988-08-30 Texas Instruments Incorporated Delayed reflow alloy mix solder paste
JPH01266987A (ja) * 1988-04-19 1989-10-24 Senju Metal Ind Co Ltd クリームはんだおよびクリームはんだのはんだ付け方法
JP2539445Y2 (ja) * 1990-08-09 1997-06-25 アイワ株式会社 プリント基板
JPH11186712A (ja) 1997-12-24 1999-07-09 Nissan Motor Co Ltd はんだペーストおよび接続方法
JPH11347784A (ja) 1998-06-01 1999-12-21 Victor Co Of Japan Ltd はんだペースト及びそれを用いた電子回路装置
JP4389331B2 (ja) 2000-03-23 2009-12-24 ソニー株式会社 ペーストはんだ
JP4438974B2 (ja) * 2000-10-05 2010-03-24 千住金属工業株式会社 ソルダペ−スト
JP2003211289A (ja) 2002-01-21 2003-07-29 Fujitsu Ltd 導電性接合材料、それを用いた接合方法及び電子機器
US7888411B2 (en) 2003-04-01 2011-02-15 Creative Electron, Inc. Thermally conductive adhesive composition and process for device attachment
JP2005183903A (ja) 2003-12-22 2005-07-07 Rohm & Haas Electronic Materials Llc 電子デバイスおよび電子デバイスを形成する方法
DE102004034035A1 (de) * 2004-07-13 2006-02-09 W.C. Heraeus Gmbh Bleifreie Lotpasten mit erhöhter Zuverlässigkeit
KR100995779B1 (ko) 2005-04-01 2010-11-22 아사히 가세이 일렉트로닉스 가부시끼가이샤 도전성 필러 및 땜납 재료
US9162324B2 (en) * 2005-11-11 2015-10-20 Senju Metal Industry Co., Ltd. Solder paste and solder joint
JP2007152418A (ja) * 2005-12-08 2007-06-21 Mitsui Mining & Smelting Co Ltd 高温はんだおよびその製造方法
US20070152026A1 (en) * 2005-12-30 2007-07-05 Daewoong Suh Transient liquid phase bonding method
EP2047943A4 (en) * 2006-07-05 2012-12-19 Fuji Electric Co Ltd SOLDER PASTE AND METHOD FOR SOLDERING AN ELECTRONIC PART
EP2058822A4 (en) * 2006-08-28 2011-01-05 Murata Manufacturing Co CONDUCTIVE BINDER AND ELECTRONIC DEVICE
JP2010029868A (ja) 2006-11-06 2010-02-12 Victor Co Of Japan Ltd 無鉛はんだペースト、それを用いた電子回路基板及びその製造方法
JP5871450B2 (ja) * 2007-01-22 2016-03-01 ユニヴァーシティー オブ メリーランドＵｎｉｖｅｒｓｉｔｙ Ｏｆ Ｍａｒｙｌａｎｄ 高温はんだ材料
JP5373464B2 (ja) * 2008-04-23 2013-12-18 パナソニック株式会社 導電性ペーストおよびこれを用いた実装構造体
JP5292977B2 (ja) * 2008-08-01 2013-09-18 富士電機株式会社 接合材、半導体装置およびその製造方法
JP5169871B2 (ja) 2009-01-26 2013-03-27 富士通株式会社 はんだ、はんだ付け方法及び半導体装置
WO2010114874A2 (en) 2009-04-02 2010-10-07 Ormet Circuits Inc. Conductive compositions containing blended alloy fillers
JP5698447B2 (ja) * 2009-09-08 2015-04-08 株式会社タムラ製作所 はんだ接合剤組成物
JP5160576B2 (ja) * 2010-02-22 2013-03-13 株式会社タムラ製作所 ソルダペーストと、これを用いたピングリッドアレイパッケージ用基板及びピングリッドアレイパッケージ、並びにピングリッドアレイパッケージ用基板の製造方法
US9017446B2 (en) 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
KR20140121211A (ko) 2013-04-05 2014-10-15 부산대학교 산학협력단 고융점 무연 솔더 조성물, 고융점 무연 솔더 합금 제조방법 및 이의 용도

Also Published As

Publication number Publication date
JP5938032B2 (ja) 2016-06-22
US10118260B2 (en) 2018-11-06
WO2011139454A1 (en) 2011-11-10
DE112011101556B4 (de) 2023-11-09
US20110268985A1 (en) 2011-11-03
US20150224602A1 (en) 2015-08-13
CN102892549A (zh) 2013-01-23
DE112011101556T5 (de) 2013-02-14
KR101820986B1 (ko) 2018-01-22
US9017446B2 (en) 2015-04-28
KR20130056235A (ko) 2013-05-29
JP2013525121A (ja) 2013-06-20
CN102892549B (zh) 2017-01-18

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