DE112007002470T5 - Glaspoliermittel und -verfahren - Google Patents

Glaspoliermittel und -verfahren Download PDF

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Publication number
DE112007002470T5
DE112007002470T5 DE112007002470T DE112007002470T DE112007002470T5 DE 112007002470 T5 DE112007002470 T5 DE 112007002470T5 DE 112007002470 T DE112007002470 T DE 112007002470T DE 112007002470 T DE112007002470 T DE 112007002470T DE 112007002470 T5 DE112007002470 T5 DE 112007002470T5
Authority
DE
Germany
Prior art keywords
glass
polishing
mixture
poly
particle size
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007002470T
Other languages
German (de)
English (en)
Inventor
Nevin Aurora Naguib
Kevin Naperville Moeggenborg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of DE112007002470T5 publication Critical patent/DE112007002470T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09GPOLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00Polishing compositions
    • C09G1/02Polishing compositions containing abrasives or grinding agents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE112007002470T 2006-10-16 2007-10-16 Glaspoliermittel und -verfahren Withdrawn DE112007002470T5 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US85245106P 2006-10-16 2006-10-16
US60/852,451 2006-10-16
US93039907P 2007-05-16 2007-05-16
US60/930,399 2007-05-16
PCT/US2007/022014 WO2008048562A1 (en) 2006-10-16 2007-10-16 Glass polishing compositions and methods

Publications (1)

Publication Number Publication Date
DE112007002470T5 true DE112007002470T5 (de) 2009-09-10

Family

ID=39314335

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007002470T Withdrawn DE112007002470T5 (de) 2006-10-16 2007-10-16 Glaspoliermittel und -verfahren

Country Status (7)

Country Link
US (1) US20100022171A1 (https=)
JP (1) JP5448824B2 (https=)
KR (1) KR101477826B1 (https=)
CN (1) CN101528882B (https=)
DE (1) DE112007002470T5 (https=)
SG (1) SG175636A1 (https=)
WO (1) WO2008048562A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5362319B2 (ja) * 2008-10-21 2013-12-11 花王株式会社 研磨液組成物
KR101376057B1 (ko) * 2009-04-15 2014-03-19 솔베이 (차이나) 컴퍼니, 리미티드 세륨 기반 입자 조성물 및 그의 제조
EP2439768B1 (en) * 2009-06-04 2022-02-09 SUMCO Corporation Fixed-abrasive-grain machining apparatus, fixed-abrasive-grain machining method, and semiconductor-wafer manufacturing method
CN102101976A (zh) * 2009-12-18 2011-06-22 安集微电子(上海)有限公司 一种化学机械抛光液
US20130192304A1 (en) * 2010-09-30 2013-08-01 Hazuki Nakae Manufacturing Method for Glass Substrate for Information Recording Medium
US9090799B2 (en) * 2010-11-08 2015-07-28 Fujimi Incorporated Composition for polishing and method of polishing semiconductor substrate using same
JP2013159531A (ja) * 2012-02-07 2013-08-19 Panasonic Liquid Crystal Display Co Ltd 液晶表示素子の製造方法
CN102585708A (zh) * 2012-03-13 2012-07-18 上海华明高纳稀土新材料有限公司 稀土抛光材料及其制备方法
US9358659B2 (en) 2013-03-04 2016-06-07 Cabot Microelectronics Corporation Composition and method for polishing glass
US9966269B2 (en) * 2014-05-30 2018-05-08 Hitachi Chemical Company, Ltd. Polishing liquid for CMP, polishing liquid set for CMP, and polishing method
JP2017002166A (ja) * 2015-06-09 2017-01-05 テイカ株式会社 ガラス及びセラミック研磨用組成物
CN106189873A (zh) * 2016-07-22 2016-12-07 清华大学 一种抛光组合物
JP6262836B1 (ja) * 2016-07-28 2018-01-17 株式会社バイコウスキージャパン 研磨砥粒、その製造方法、それを含む研磨スラリー及びそれを用いる研磨方法
WO2018100324A1 (fr) * 2016-12-02 2018-06-07 Rhodia Operations Suspension d'oxyde de cerium
FR3059660B1 (fr) * 2016-12-02 2019-03-15 Rhodia Operations Suspension d'oxyde de cerium
CN109439282A (zh) * 2018-10-23 2019-03-08 蓝思科技(长沙)有限公司 复合纳米磨料、抛光液及其制备方法、玻璃晶片和电子设备
CN109135580B (zh) * 2018-10-25 2021-04-02 蓝思科技(长沙)有限公司 一种玻璃用抛光液及其制备方法
US10787592B1 (en) * 2019-05-16 2020-09-29 Rohm And Haas Electronic Materials Cmp Holdings, I Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment
KR20230090768A (ko) * 2021-12-15 2023-06-22 인오켐 주식회사 디스플레이 유리기판 연마용 조성물의 제조방법 및 상기 조성물을 이용한 디스플레이 기판을 연마하는 방법

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04135162A (ja) * 1990-09-21 1992-05-08 Asahi Glass Co Ltd ガラスの高効率研磨方法
CN1245471C (zh) * 1996-09-30 2006-03-15 日立化成工业株式会社 氧化铈研磨剂以及基板的研磨方法
US6110396A (en) * 1996-11-27 2000-08-29 International Business Machines Corporation Dual-valent rare earth additives to polishing slurries
US6248143B1 (en) * 1998-01-27 2001-06-19 Showa Denko Kabushiki Kaisha Composition for polishing glass and polishing method
US6299659B1 (en) * 1998-08-05 2001-10-09 Showa Denko K.K. Polishing material composition and polishing method for polishing LSI devices
JP4501694B2 (ja) * 1998-12-25 2010-07-14 日立化成工業株式会社 Cmp研磨剤用添加液
JP2000256654A (ja) * 1999-03-04 2000-09-19 Hitachi Chem Co Ltd Cmp研磨剤及び基板の研磨方法
US6350393B2 (en) * 1999-11-04 2002-02-26 Cabot Microelectronics Corporation Use of CsOH in a dielectric CMP slurry
US6454821B1 (en) * 2000-06-21 2002-09-24 Praxair S. T. Technology, Inc. Polishing composition and method
JP2002114970A (ja) * 2000-10-04 2002-04-16 Asahi Denka Kogyo Kk 水系ラップ液及び水系ラップ剤
US6726534B1 (en) * 2001-03-01 2004-04-27 Cabot Microelectronics Corporation Preequilibrium polishing method and system
US6736705B2 (en) * 2001-04-27 2004-05-18 Hitachi Global Storage Technologies Polishing process for glass or ceramic disks used in disk drive data storage devices
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
EP1554357A1 (en) * 2002-10-25 2005-07-20 Showa Denko K.K. Polishing slurry and polished substrate
US20050066687A1 (en) * 2003-09-30 2005-03-31 Mr. Chi-Fu Hsueh Methods for the production of marble-like crystallized glass panel wih embossed surface
JP2004291232A (ja) * 2004-07-20 2004-10-21 Hitachi Chem Co Ltd 酸化セリウム研磨剤及び基板の研磨法
JP2006041034A (ja) * 2004-07-23 2006-02-09 Hitachi Chem Co Ltd Cmp研磨剤及び基板の研磨方法
US20070218811A1 (en) * 2004-09-27 2007-09-20 Hitachi Chemical Co., Ltd. Cmp polishing slurry and method of polishing substrate
JP2006175552A (ja) * 2004-12-22 2006-07-06 Hitachi Chem Co Ltd 有機材料用cmp研磨剤及び有機材料の研磨方法
JP4463134B2 (ja) * 2005-03-29 2010-05-12 三井金属鉱業株式会社 セリウム系研摩材及びその中間体並びにこれらの製造方法
JP4776387B2 (ja) * 2006-02-06 2011-09-21 日立化成工業株式会社 酸化セリウム研磨剤および基板の研磨法

Also Published As

Publication number Publication date
JP2010506743A (ja) 2010-03-04
JP5448824B2 (ja) 2014-03-19
KR20090067213A (ko) 2009-06-24
CN101528882A (zh) 2009-09-09
KR101477826B1 (ko) 2015-01-02
CN101528882B (zh) 2014-07-16
US20100022171A1 (en) 2010-01-28
SG175636A1 (en) 2011-11-28
WO2008048562A1 (en) 2008-04-24

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Legal Events

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R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C09K0003140000

Ipc: C09G0001020000

R012 Request for examination validly filed

Effective date: 20140423

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C09K0003140000

Ipc: C09G0001020000

Effective date: 20140506

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee