DE112007002340T5 - Bearbeitungssystem, Bearbeitungsverfahren und Aufzeichnungsmedium - Google Patents

Bearbeitungssystem, Bearbeitungsverfahren und Aufzeichnungsmedium Download PDF

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Publication number
DE112007002340T5
DE112007002340T5 DE112007002340T DE112007002340T DE112007002340T5 DE 112007002340 T5 DE112007002340 T5 DE 112007002340T5 DE 112007002340 T DE112007002340 T DE 112007002340T DE 112007002340 T DE112007002340 T DE 112007002340T DE 112007002340 T5 DE112007002340 T5 DE 112007002340T5
Authority
DE
Germany
Prior art keywords
processing
space
pressure
vessel
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112007002340T
Other languages
German (de)
English (en)
Inventor
Jiro Koshi Higashijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE112007002340T5 publication Critical patent/DE112007002340T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/286—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials
    • H10P50/287—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of organic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE112007002340T 2006-11-24 2007-11-21 Bearbeitungssystem, Bearbeitungsverfahren und Aufzeichnungsmedium Withdrawn DE112007002340T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006317253A JP4907310B2 (ja) 2006-11-24 2006-11-24 処理装置、処理方法及び記録媒体
JP2006-317253 2006-11-24
PCT/JP2007/072540 WO2008062826A1 (en) 2006-11-24 2007-11-21 Treatment apparatus, method of treating and recording medium

Publications (1)

Publication Number Publication Date
DE112007002340T5 true DE112007002340T5 (de) 2009-07-30

Family

ID=39429755

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007002340T Withdrawn DE112007002340T5 (de) 2006-11-24 2007-11-21 Bearbeitungssystem, Bearbeitungsverfahren und Aufzeichnungsmedium

Country Status (6)

Country Link
US (1) US8298344B2 (https=)
JP (1) JP4907310B2 (https=)
KR (1) KR100979978B1 (https=)
DE (1) DE112007002340T5 (https=)
TW (1) TW200839862A (https=)
WO (1) WO2008062826A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4985183B2 (ja) * 2007-07-26 2012-07-25 東京エレクトロン株式会社 基板処理装置及び基板処理方法並びに記憶媒体
US8033771B1 (en) * 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
JP5474840B2 (ja) * 2011-01-25 2014-04-16 東京エレクトロン株式会社 液処理装置および液処理方法
JP5655735B2 (ja) * 2011-07-26 2015-01-21 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
JP6305736B2 (ja) * 2013-11-20 2018-04-04 測位衛星技術株式会社 情報管理システム、データバンク装置、データの管理方法、データベースの管理方法、および、プログラム
JP5994821B2 (ja) * 2014-06-13 2016-09-21 ウシオ電機株式会社 デスミア処理装置およびデスミア処理方法
US10460955B2 (en) * 2014-08-25 2019-10-29 The United States Of America As Represented By The Secretary Of The Army Methodology for annealing group III-nitride semiconductor device structures using novel weighted cover systems
JP6666793B2 (ja) * 2016-05-23 2020-03-18 大陽日酸株式会社 反応装置
JP6581644B2 (ja) * 2017-12-06 2019-09-25 ＣＳＧ Ｉｎｖｅｓｔｍｅｎｔｓ株式会社 密閉容器用蓋
JP7594976B2 (ja) * 2021-05-31 2024-12-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
US20260066239A1 (en) * 2024-09-03 2026-03-05 Applied Materials, Inc. Plasma source with integrated chamber liner

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224102A (ja) 2002-01-30 2003-08-08 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2003332322A (ja) 2002-03-08 2003-11-21 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2004134525A (ja) 2002-10-09 2004-04-30 Tokyo Electron Ltd 基板処理方法及び基板処理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248022A (en) * 1990-11-28 1993-09-28 Tokyo Electron Limited Driving device having sealing mechanism
JP3078834B2 (ja) * 1990-11-28 2000-08-21 東京エレクトロン株式会社 駆動装置
JP3106172B2 (ja) * 1991-02-26 2000-11-06 東京エレクトロン株式会社 熱処理装置の封止構造
JPH0910709A (ja) * 1995-06-30 1997-01-14 Dainippon Screen Mfg Co Ltd 基板処理装置
US5820692A (en) * 1996-01-16 1998-10-13 Fsi Interntional Vacuum compatible water vapor and rinse process module
JP3794808B2 (ja) * 1998-01-12 2006-07-12 大日本スクリーン製造株式会社 基板処理装置
JPH11219925A (ja) * 1998-01-29 1999-08-10 Shin Etsu Handotai Co Ltd 多孔質焼結体を用いた耐熱性半導体製造治具の洗浄方法及びその乾燥方法
JP3953682B2 (ja) * 1999-06-02 2007-08-08 株式会社荏原製作所 ウエハ洗浄装置
JP4196532B2 (ja) 2000-09-28 2008-12-17 株式会社日立製作所 自動車用発電機および回転機の音質評価方法
US6647642B2 (en) * 2000-12-15 2003-11-18 Tokyo Electron Limited Liquid processing apparatus and method
JP3992488B2 (ja) * 2000-12-15 2007-10-17 東京エレクトロン株式会社 液処理装置および液処理方法
US6729041B2 (en) * 2000-12-28 2004-05-04 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
KR100863782B1 (ko) * 2002-03-08 2008-10-16 도쿄엘렉트론가부시키가이샤 기판처리장치 및 기판처리방법
KR20050019129A (ko) * 2002-06-13 2005-02-28 비오씨 에드워즈 인코포레이티드 기판 처리 장치 및 기판 처리 방법
KR100992803B1 (ko) * 2002-07-25 2010-11-09 도쿄엘렉트론가부시키가이샤 기판 처리 용기

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224102A (ja) 2002-01-30 2003-08-08 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2003332322A (ja) 2002-03-08 2003-11-21 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2004134525A (ja) 2002-10-09 2004-04-30 Tokyo Electron Ltd 基板処理方法及び基板処理装置

Also Published As

Publication number Publication date
KR20080097402A (ko) 2008-11-05
TW200839862A (en) 2008-10-01
KR100979978B1 (ko) 2010-09-03
JP2008130978A (ja) 2008-06-05
WO2008062826A1 (en) 2008-05-29
TWI362070B (https=) 2012-04-11
US20090260656A1 (en) 2009-10-22
US8298344B2 (en) 2012-10-30
JP4907310B2 (ja) 2012-03-28

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Legal Events

Date Code Title Description
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20130601