DE112006003543T5 - Eingebettete Wellenleiter-Leiterplatten-Struktur - Google Patents

Eingebettete Wellenleiter-Leiterplatten-Struktur Download PDF

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Publication number
DE112006003543T5
DE112006003543T5 DE112006003543T DE112006003543T DE112006003543T5 DE 112006003543 T5 DE112006003543 T5 DE 112006003543T5 DE 112006003543 T DE112006003543 T DE 112006003543T DE 112006003543 T DE112006003543 T DE 112006003543T DE 112006003543 T5 DE112006003543 T5 DE 112006003543T5
Authority
DE
Germany
Prior art keywords
channel
waveguide
circuit board
embedded waveguide
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112006003543T
Other languages
German (de)
English (en)
Inventor
Gary A. Yamhill Brist
Bryce D. Portland Horine
Stephen H. Hillsboro Hall
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE112006003543T5 publication Critical patent/DE112006003543T5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/002—Manufacturing hollow waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
DE112006003543T 2005-12-30 2006-12-14 Eingebettete Wellenleiter-Leiterplatten-Struktur Withdrawn DE112006003543T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/322,601 US7480435B2 (en) 2005-12-30 2005-12-30 Embedded waveguide printed circuit board structure
US11/322,601 2005-12-30
PCT/US2006/048090 WO2007078893A2 (fr) 2005-12-30 2006-12-14 Structure de carte a circuit imprime a guide d'ondes integre

Publications (1)

Publication Number Publication Date
DE112006003543T5 true DE112006003543T5 (de) 2008-11-13

Family

ID=38110734

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112006003543T Withdrawn DE112006003543T5 (de) 2005-12-30 2006-12-14 Eingebettete Wellenleiter-Leiterplatten-Struktur

Country Status (5)

Country Link
US (1) US7480435B2 (fr)
CN (1) CN101128088B (fr)
DE (1) DE112006003543T5 (fr)
TW (1) TWI348563B (fr)
WO (1) WO2007078893A2 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
EP3293814A1 (fr) * 2016-09-13 2018-03-14 Dyconex AG Substrat de circuit et composant electronique haute frequence

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WO2009066121A1 (fr) * 2007-11-21 2009-05-28 Nokia Corporation Carte de câblage imprimé ayant un canal acoustique
US20110068423A1 (en) * 2009-09-18 2011-03-24 International Business Machines Corporation Photodetector with wavelength discrimination, and method for forming the same and design structure
US9544678B2 (en) 2011-01-12 2017-01-10 Blackberry Limited Printed circuit board with an acoustic channel for a microphone
US9142497B2 (en) * 2011-10-05 2015-09-22 Harris Corporation Method for making electrical structure with air dielectric and related electrical structures
EP3055871A1 (fr) * 2013-10-07 2016-08-17 Koninklijke Philips N.V. Procédé de production de lot de précision pour fabriquer des tiges de ferrite
CN111342235B (zh) 2015-01-27 2022-11-04 奥特斯奥地利科技与系统技术有限公司 电子组件以及制造电子组件的方法
US10381707B2 (en) 2016-02-04 2019-08-13 Advantest Corporation Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing
US10393772B2 (en) 2016-02-04 2019-08-27 Advantest Corporation Wave interface assembly for automatic test equipment for semiconductor testing
US10944148B2 (en) * 2016-02-04 2021-03-09 Advantest Corporation Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing
US10114067B2 (en) 2016-02-04 2018-10-30 Advantest Corporation Integrated waveguide structure and socket structure for millimeter waveband testing
US9674597B1 (en) * 2016-02-10 2017-06-06 Bose Corporation Electrical circuit board with embedded acoustic channel
CN109075457B (zh) 2016-04-28 2021-08-31 奥特斯奥地利科技与系统技术有限公司 带有集成的天线布置的部件承载件、电子设备、无线电通信方法
US10371716B2 (en) 2016-06-29 2019-08-06 Advantest Corporation Method and apparatus for socket power calibration with flexible printed circuit board
CN109642985B (zh) 2016-07-13 2021-03-12 洛克利光子有限公司 模式转换器及其制造方法
TWI629920B (zh) * 2016-10-03 2018-07-11 中華精測科技股份有限公司 具有空心波導結構的晶片測試架構及其電路板
TWI752296B (zh) * 2018-10-17 2022-01-11 先豐通訊股份有限公司 電波傳輸板
US11211680B2 (en) * 2018-11-14 2021-12-28 Optisys, LLC Hollow metal waveguides having irregular hexagonal cross-sections formed by additive manufacturing
US11996600B2 (en) 2018-11-14 2024-05-28 Optisys, Inc. Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles
KR20210093316A (ko) 2018-11-19 2021-07-27 옵티시스, 엘엘씨 불규칙 육각 단면형 중공의 금속 도파관 필터
US11553265B2 (en) * 2019-07-24 2023-01-10 Google Llc Compact home assistant having a controlled sound path
US11482767B2 (en) * 2020-04-17 2022-10-25 Honeywell Federal Manufacturing & Technologies, Llc Method of manufacturing a waveguide comprising stacking dielectric layers having aligned metallized channels formed therein to form the waveguide
CN111372395B (zh) * 2020-04-22 2022-07-05 上海航天电子通讯设备研究所 基于多层lcp电路板的微波导制备方法及微波导
WO2022067569A1 (fr) * 2020-09-29 2022-04-07 华为技术有限公司 Appareil de transmission de signal et dispositif électronique
US11664567B2 (en) * 2020-11-30 2023-05-30 Nxp B.V. Hollow waveguide assembly formed by affixing first and second substrates to form a cavity therein and having a conductive layer covering the cavity
CN115226325A (zh) * 2021-04-14 2022-10-21 鹏鼎控股(深圳)股份有限公司 电路板的制作方法以及电路板
TWI796738B (zh) * 2021-07-23 2023-03-21 先豐通訊股份有限公司 具有波導管的線路板結構及其製作方法

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Publication number Priority date Publication date Assignee Title
EP3293814A1 (fr) * 2016-09-13 2018-03-14 Dyconex AG Substrat de circuit et composant electronique haute frequence

Also Published As

Publication number Publication date
CN101128088A (zh) 2008-02-20
CN101128088B (zh) 2014-08-13
WO2007078893A3 (fr) 2008-07-31
US7480435B2 (en) 2009-01-20
TW200739153A (en) 2007-10-16
US20070154155A1 (en) 2007-07-05
TWI348563B (en) 2011-09-11
WO2007078893A2 (fr) 2007-07-12

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee