TWI348563B - Embedded waveguide printed circuit board structure and method for forming an embedded waveguide - Google Patents

Embedded waveguide printed circuit board structure and method for forming an embedded waveguide

Info

Publication number
TWI348563B
TWI348563B TW095147206A TW95147206A TWI348563B TW I348563 B TWI348563 B TW I348563B TW 095147206 A TW095147206 A TW 095147206A TW 95147206 A TW95147206 A TW 95147206A TW I348563 B TWI348563 B TW I348563B
Authority
TW
Taiwan
Prior art keywords
embedded waveguide
forming
circuit board
printed circuit
board structure
Prior art date
Application number
TW095147206A
Other languages
English (en)
Other versions
TW200739153A (en
Inventor
Gary Brist
Bryce D Horine
Stephen H Hall
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200739153A publication Critical patent/TW200739153A/zh
Application granted granted Critical
Publication of TWI348563B publication Critical patent/TWI348563B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
    • H01P11/002—Manufacturing hollow waveguides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0379—Stacked conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
TW095147206A 2005-12-30 2006-12-15 Embedded waveguide printed circuit board structure and method for forming an embedded waveguide TWI348563B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/322,601 US7480435B2 (en) 2005-12-30 2005-12-30 Embedded waveguide printed circuit board structure

Publications (2)

Publication Number Publication Date
TW200739153A TW200739153A (en) 2007-10-16
TWI348563B true TWI348563B (en) 2011-09-11

Family

ID=38110734

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147206A TWI348563B (en) 2005-12-30 2006-12-15 Embedded waveguide printed circuit board structure and method for forming an embedded waveguide

Country Status (5)

Country Link
US (1) US7480435B2 (zh)
CN (1) CN101128088B (zh)
DE (1) DE112006003543T5 (zh)
TW (1) TWI348563B (zh)
WO (1) WO2007078893A2 (zh)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070145595A1 (en) * 2005-12-27 2007-06-28 Hall Stephen H High speed interconnect
US20070154157A1 (en) * 2005-12-30 2007-07-05 Horine Bryce D Quasi-waveguide printed circuit board structure
WO2009066121A1 (en) * 2007-11-21 2009-05-28 Nokia Corporation Printed wiring board having acoustic channel
US20110068423A1 (en) * 2009-09-18 2011-03-24 International Business Machines Corporation Photodetector with wavelength discrimination, and method for forming the same and design structure
US9544678B2 (en) 2011-01-12 2017-01-10 Blackberry Limited Printed circuit board with an acoustic channel for a microphone
US9142497B2 (en) * 2011-10-05 2015-09-22 Harris Corporation Method for making electrical structure with air dielectric and related electrical structures
SG11201602499TA (en) 2013-10-07 2016-04-28 Koninkl Philips Nv Precision batch production method for manufacturing ferrite rods
CN111342235B (zh) 2015-01-27 2022-11-04 奥特斯奥地利科技与系统技术有限公司 电子组件以及制造电子组件的方法
US10114067B2 (en) 2016-02-04 2018-10-30 Advantest Corporation Integrated waveguide structure and socket structure for millimeter waveband testing
US10381707B2 (en) 2016-02-04 2019-08-13 Advantest Corporation Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing
US10944148B2 (en) * 2016-02-04 2021-03-09 Advantest Corporation Plating methods for modular and/or ganged waveguides for automatic test equipment for semiconductor testing
US10393772B2 (en) 2016-02-04 2019-08-27 Advantest Corporation Wave interface assembly for automatic test equipment for semiconductor testing
US9674597B1 (en) * 2016-02-10 2017-06-06 Bose Corporation Electrical circuit board with embedded acoustic channel
EP3449532B1 (en) 2016-04-28 2024-02-28 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with integrated antenna arrangement, electronic apparatus, radio communication method
US10371716B2 (en) 2016-06-29 2019-08-06 Advantest Corporation Method and apparatus for socket power calibration with flexible printed circuit board
US11037839B2 (en) 2016-07-13 2021-06-15 Rockley Photonics Limited Integrated structure and manufacturing method thereof
EP3293814B1 (de) * 2016-09-13 2020-04-29 Dyconex AG Schaltungssubstrat und elektronisches höchstfrequenz-bauteil
TWI629920B (zh) * 2016-10-03 2018-07-11 中華精測科技股份有限公司 具有空心波導結構的晶片測試架構及其電路板
TWI752296B (zh) * 2018-10-17 2022-01-11 先豐通訊股份有限公司 電波傳輸板
US11996600B2 (en) 2018-11-14 2024-05-28 Optisys, Inc. Hollow metal waveguides having irregular hexagonal cross sections with specified interior angles
US11211680B2 (en) * 2018-11-14 2021-12-28 Optisys, LLC Hollow metal waveguides having irregular hexagonal cross-sections formed by additive manufacturing
EP3884541A4 (en) 2018-11-19 2022-08-24 Optisys, LLC IRREGULAR HEXAGONAL CROSS-SECTION HOLLOW METALLIC WAVEGUIDE FILTERS
US11553265B2 (en) * 2019-07-24 2023-01-10 Google Llc Compact home assistant having a controlled sound path
US11482767B2 (en) * 2020-04-17 2022-10-25 Honeywell Federal Manufacturing & Technologies, Llc Method of manufacturing a waveguide comprising stacking dielectric layers having aligned metallized channels formed therein to form the waveguide
CN111372395B (zh) * 2020-04-22 2022-07-05 上海航天电子通讯设备研究所 基于多层lcp电路板的微波导制备方法及微波导
CN115885588A (zh) * 2020-09-29 2023-03-31 华为技术有限公司 信号传输装置及电子设备
US11664567B2 (en) * 2020-11-30 2023-05-30 Nxp B.V. Hollow waveguide assembly formed by affixing first and second substrates to form a cavity therein and having a conductive layer covering the cavity
CN115226325A (zh) * 2021-04-14 2022-10-21 鹏鼎控股(深圳)股份有限公司 电路板的制作方法以及电路板
WO2022241483A2 (en) 2021-05-14 2022-11-17 Optisys, Inc. Planar monolithic combiner and multiplexer for antenna arrays
TWI796738B (zh) * 2021-07-23 2023-03-21 先豐通訊股份有限公司 具有波導管的線路板結構及其製作方法
WO2024193824A1 (en) * 2023-03-23 2024-09-26 Huawei Technologies Co., Ltd. Top-to-bottom air-waveguide for a mm-wave radio frequency signal in a printed circuit board

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3157847A (en) 1961-07-11 1964-11-17 Robert M Williams Multilayered waveguide circuitry formed by stacking plates having surface grooves
US6346842B1 (en) 1997-12-12 2002-02-12 Intel Corporation Variable delay path circuit
US6072699A (en) 1998-07-21 2000-06-06 Intel Corporation Method and apparatus for matching trace lengths of signal lines making 90°/180° turns
US6353539B1 (en) 1998-07-21 2002-03-05 Intel Corporation Method and apparatus for matched length routing of back-to-back package placement
US6144576A (en) 1998-08-19 2000-11-07 Intel Corporation Method and apparatus for implementing a serial memory architecture
US6587912B2 (en) 1998-09-30 2003-07-01 Intel Corporation Method and apparatus for implementing multiple memory buses on a memory module
US6175239B1 (en) 1998-12-29 2001-01-16 Intel Corporation Process and apparatus for determining transmission line characteristic impedance
US6429383B1 (en) 1999-04-14 2002-08-06 Intel Corporation Apparatus and method for improving circuit board solder
US6249142B1 (en) 1999-12-20 2001-06-19 Intel Corporation Dynamically terminated bus
US6366466B1 (en) 2000-03-14 2002-04-02 Intel Corporation Multi-layer printed circuit board with signal traces of varying width
US6362973B1 (en) 2000-03-14 2002-03-26 Intel Corporation Multilayer printed circuit board with placebo vias for controlling interconnect skew
US6788222B2 (en) 2001-01-16 2004-09-07 Intel Corporation Low weight data encoding for minimal power delivery impact
US6891899B2 (en) 2001-03-19 2005-05-10 Intel Corporation System and method for bit encoding to increase data transfer rate
US6674648B2 (en) 2001-07-23 2004-01-06 Intel Corporation Termination cards and systems therefore
US6882762B2 (en) 2001-09-27 2005-04-19 Intel Corporation Waveguide in a printed circuit board and method of forming the same
US6737883B2 (en) 2001-12-17 2004-05-18 Intel Corporation Transmission mode signaling with a slot
US6747216B2 (en) 2002-02-04 2004-06-08 Intel Corporation Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery
JP2003264405A (ja) 2002-03-08 2003-09-19 Opnext Japan Inc 高周波伝送線路およびそれを用いた電子部品並びに電子装置
US6803527B2 (en) 2002-03-26 2004-10-12 Intel Corporation Circuit board with via through surface mount device contact
US7020792B2 (en) 2002-04-30 2006-03-28 Intel Corporation Method and apparatus for time domain equalization
US6642158B1 (en) 2002-09-23 2003-11-04 Intel Corporation Photo-thermal induced diffusion
US6916183B2 (en) 2003-03-04 2005-07-12 Intel Corporation Array socket with a dedicated power/ground conductor bus
US7043706B2 (en) 2003-03-11 2006-05-09 Intel Corporation Conductor trace design to reduce common mode cross-talk and timing skew
US6992899B2 (en) 2003-03-21 2006-01-31 Intel Corporation Power delivery apparatus, systems, and methods
US7022919B2 (en) 2003-06-30 2006-04-04 Intel Corporation Printed circuit board trace routing method
TW592003B (en) 2003-07-04 2004-06-11 Sentelic Corp Method for using a printed circuit substrate to manufacture a micro structure
US20050063637A1 (en) 2003-09-22 2005-03-24 Mershon Jayne L. Connecting a component with an embedded optical fiber
US20050063638A1 (en) 2003-09-24 2005-03-24 Alger William O. Optical fibers embedded in a printed circuit board
US20050208749A1 (en) 2004-03-17 2005-09-22 Beckman Michael W Methods for forming electrical connections and resulting devices
US7691458B2 (en) 2004-03-31 2010-04-06 Intel Corporation Carrier substrate with a thermochromatic coating
US7121841B2 (en) 2004-11-10 2006-10-17 Intel Corporation Electrical socket with compressible domed contacts
US7249955B2 (en) 2004-12-30 2007-07-31 Intel Corporation Connection of package, board, and flex cable
US7301424B2 (en) 2005-06-29 2007-11-27 Intel Corporation Flexible waveguide cable with a dielectric core
US7271680B2 (en) 2005-06-29 2007-09-18 Intel Corporation Method, apparatus, and system for parallel plate mode radial pattern signaling
US7361842B2 (en) 2005-06-30 2008-04-22 Intel Corporation Apparatus and method for an embedded air dielectric for a package and a printed circuit board
US20070037432A1 (en) 2005-08-11 2007-02-15 Mershon Jayne L Built up printed circuit boards

Also Published As

Publication number Publication date
WO2007078893A3 (en) 2008-07-31
WO2007078893A2 (en) 2007-07-12
DE112006003543T5 (de) 2008-11-13
TW200739153A (en) 2007-10-16
US7480435B2 (en) 2009-01-20
CN101128088B (zh) 2014-08-13
US20070154155A1 (en) 2007-07-05
CN101128088A (zh) 2008-02-20

Similar Documents

Publication Publication Date Title
TWI348563B (en) Embedded waveguide printed circuit board structure and method for forming an embedded waveguide
GB2429847B (en) Printed circuit board and manuafacturing method thereof
EP2071907A4 (en) FLEXORIGID PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE FLEXORIGID PRINTED CIRCUIT BOARD
EP1768474A4 (en) PCB AND MANUFACTURING METHOD THEREFOR
TWI371997B (en) Printed wiring board and method for manufacturing the same
GB2422491B (en) Printed Circuit Board
EP1945013A4 (en) MULTILAYER PRINTED CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
TWI348339B (en) Circuit board and method for manufaturing thereof
EP1643817A4 (en) RESIN SOLUTION, PAINT PROCESSING AND PCB
EP1835792A4 (en) METHOD FOR PRODUCING A CONDUCTOR PLATE
TWI347159B (en) Method for forming transcriptional circuit and method for manufacturing circuit board
GB2429852B (en) Method and system of electrically connecting multiple printed circuit boards
EP1928218A4 (en) FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING THE SAME
EP1998603A4 (en) MULTILAYER CONDUCTOR PLATE AND METHOD FOR ASSEMBLING THEIR PARTS
EP1953818A4 (en) ASSEMBLY CARD FOR ELECTRONIC COMPONENTS AND METHOD FOR MANUFACTURING SUCH CARD
DE602006000514D1 (de) Leiterplatte und Herstellungsverfahren dafür
SG119300A1 (en) Circuit board
EP1860691A4 (en) ELECTRONIC SWITCHING AND MANUFACTURING METHOD THEREFOR
GB0806424D0 (en) Quasi-waveguide printed circuit board structure
EP1753279A4 (en) METHOD OF MANUFACTURING MULTILAYER CONDUCTOR PLATES
GB0806423D0 (en) Printed circuit board waveguide
EP2223580A4 (en) PANELLING METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
EP2184960A4 (en) CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
TWI373293B (en) Printed circuit board and fabrication method thereof
EP1949774A4 (en) METHOD FOR CONNECTING PRINTED CIRCUIT BOARDS