DE10321640B4 - Infrarotsensor mit verbesserter Strahlungsausbeute - Google Patents

Infrarotsensor mit verbesserter Strahlungsausbeute Download PDF

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Publication number
DE10321640B4
DE10321640B4 DE10321640.5A DE10321640A DE10321640B4 DE 10321640 B4 DE10321640 B4 DE 10321640B4 DE 10321640 A DE10321640 A DE 10321640A DE 10321640 B4 DE10321640 B4 DE 10321640B4
Authority
DE
Germany
Prior art keywords
carrier substrate
radiation
sensor according
radiation sensor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10321640.5A
Other languages
German (de)
English (en)
Other versions
DE10321640A1 (de
Inventor
Dr. Simon Marion
Mischa Schulze
Dr. Leneke Wilhelm
Karlheinz Storck
Dr. Schieferdecker Jörg
Stephan Karl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEIMANN Sensor GmbH
Original Assignee
HEIMANN Sensor GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEIMANN Sensor GmbH filed Critical HEIMANN Sensor GmbH
Priority to DE10321640.5A priority Critical patent/DE10321640B4/de
Priority to PCT/DE2004/000971 priority patent/WO2004102139A1/de
Priority to JP2006529594A priority patent/JP4685019B2/ja
Publication of DE10321640A1 publication Critical patent/DE10321640A1/de
Application granted granted Critical
Publication of DE10321640B4 publication Critical patent/DE10321640B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/041—Mountings in enclosures or in a particular environment
    • G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/046—Materials; Selection of thermal materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0808—Convex mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0814—Particular reflectors, e.g. faceted or dichroic mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
DE10321640.5A 2003-05-13 2003-05-13 Infrarotsensor mit verbesserter Strahlungsausbeute Expired - Fee Related DE10321640B4 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10321640.5A DE10321640B4 (de) 2003-05-13 2003-05-13 Infrarotsensor mit verbesserter Strahlungsausbeute
PCT/DE2004/000971 WO2004102139A1 (de) 2003-05-13 2004-05-10 Infrarotsensor mit verbesserter strahlungsausbeute
JP2006529594A JP4685019B2 (ja) 2003-05-13 2004-05-10 改善された放射活用を備えた赤外線センサー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10321640.5A DE10321640B4 (de) 2003-05-13 2003-05-13 Infrarotsensor mit verbesserter Strahlungsausbeute

Publications (2)

Publication Number Publication Date
DE10321640A1 DE10321640A1 (de) 2004-12-02
DE10321640B4 true DE10321640B4 (de) 2016-12-22

Family

ID=33394572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10321640.5A Expired - Fee Related DE10321640B4 (de) 2003-05-13 2003-05-13 Infrarotsensor mit verbesserter Strahlungsausbeute

Country Status (3)

Country Link
JP (1) JP4685019B2 (ja)
DE (1) DE10321640B4 (ja)
WO (1) WO2004102139A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018100322U1 (de) 2018-01-20 2018-01-31 LOEWE Technologies GmbH Vorrichtung für die Erfassung mindestens der CO2-Konzentration in der Umgebungsluft
WO2018122148A1 (de) 2016-12-30 2018-07-05 Heimann Sensor Gmbh Smd-fähiger thermopile infrarot sensor

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101213429B (zh) * 2005-06-27 2012-02-08 Hl-平面技术有限公司 用于检测电磁波的器件以及生产这样的器件的方法
DE102009048988A1 (de) * 2009-10-09 2011-04-14 Volkswagen Ag Thermoelektrische Teileinheit, thermoelektrische Einheit, thermoelektrisches Element und Verbindungsverfahren
US8806743B2 (en) 2012-08-07 2014-08-19 Excelitas Technologies Singapore Pte. Ltd Panelized process for SMT sensor devices
JP6194799B2 (ja) * 2014-01-15 2017-09-13 オムロン株式会社 赤外線センサ
JP6857019B2 (ja) * 2016-12-20 2021-04-14 セイコーＮｐｃ株式会社 センサモジュールの製造方法
JP6820789B2 (ja) * 2017-04-07 2021-01-27 セイコーＮｐｃ株式会社 赤外線センサ装置
DE102019206407A1 (de) * 2019-05-03 2020-11-05 Siemens Aktiengesellschaft Messverfahren und Messanordnung

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0599364A2 (en) * 1992-10-27 1994-06-01 Matsushita Electric Works, Ltd. Infrared detecting device and infrared detecting element for use in the device
DE4244607A1 (de) * 1992-12-31 1994-07-07 Hl Planartechnik Gmbh Thermoelektrischer Strahlungssensor, insbesondere für infrarotes und sichtbares Licht
WO1995018961A1 (en) * 1994-01-10 1995-07-13 Thermoscan, Inc. Noncontact active temperature sensor
US5693942A (en) * 1995-04-07 1997-12-02 Ishizuka Electronics Corporation Infrared detector
WO2000075616A1 (en) * 1999-06-07 2000-12-14 The Boeing Company Pixel structure having a bolometer with spaced apart absorber and transducer layers and an associated fabrication method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68923589T2 (de) * 1988-08-12 1996-01-18 Texas Instruments Inc Infrarot-Detektor.
DE3927735A1 (de) * 1989-08-23 1991-02-28 Asea Brown Boveri Strahlungsthermometer
JPH04268773A (ja) * 1991-02-25 1992-09-24 Matsushita Electric Works Ltd 赤外線センサおよびその製造方法
JPH11132857A (ja) * 1997-10-28 1999-05-21 Matsushita Electric Works Ltd 赤外線検出器
JP3289677B2 (ja) * 1998-05-25 2002-06-10 株式会社村田製作所 赤外線センサ
DE19962938A1 (de) * 1999-12-24 2001-07-19 Perkinelmer Optoelectronics Verfahren zum Korrigieren des Ausgangssignals eines Infrarotstrahlungsmehrelementsensors, Infrarotstrahlungsmehrelementsensor und Infrarotstrahlungsmehrelementsensorsystem
JP2001272271A (ja) * 2000-01-17 2001-10-05 Mitsubishi Electric Corp 赤外線センサ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0599364A2 (en) * 1992-10-27 1994-06-01 Matsushita Electric Works, Ltd. Infrared detecting device and infrared detecting element for use in the device
DE4244607A1 (de) * 1992-12-31 1994-07-07 Hl Planartechnik Gmbh Thermoelektrischer Strahlungssensor, insbesondere für infrarotes und sichtbares Licht
WO1995018961A1 (en) * 1994-01-10 1995-07-13 Thermoscan, Inc. Noncontact active temperature sensor
US5693942A (en) * 1995-04-07 1997-12-02 Ishizuka Electronics Corporation Infrared detector
WO2000075616A1 (en) * 1999-06-07 2000-12-14 The Boeing Company Pixel structure having a bolometer with spaced apart absorber and transducer layers and an associated fabrication method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018122148A1 (de) 2016-12-30 2018-07-05 Heimann Sensor Gmbh Smd-fähiger thermopile infrarot sensor
DE102017131049A1 (de) 2016-12-30 2018-07-05 Heimann Sensor Gmbh SMD-fähiger Thermopile Infrarot Sensor
EP4191215A1 (de) 2016-12-30 2023-06-07 Heimann Sensor GmbH Smd-fähiger thermopile infrarot sensor
DE202018100322U1 (de) 2018-01-20 2018-01-31 LOEWE Technologies GmbH Vorrichtung für die Erfassung mindestens der CO2-Konzentration in der Umgebungsluft

Also Published As

Publication number Publication date
JP2007503586A (ja) 2007-02-22
DE10321640A1 (de) 2004-12-02
WO2004102139A1 (de) 2004-11-25
JP4685019B2 (ja) 2011-05-18

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