DE10308530A1 - Hochfrequenzdämpfungsglied unter Verwendung von Flüssigmetallmikroschaltern - Google Patents
Hochfrequenzdämpfungsglied unter Verwendung von FlüssigmetallmikroschalternInfo
- Publication number
- DE10308530A1 DE10308530A1 DE10308530A DE10308530A DE10308530A1 DE 10308530 A1 DE10308530 A1 DE 10308530A1 DE 10308530 A DE10308530 A DE 10308530A DE 10308530 A DE10308530 A DE 10308530A DE 10308530 A1 DE10308530 A1 DE 10308530A1
- Authority
- DE
- Germany
- Prior art keywords
- limms
- substrate
- attenuator
- terminal
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910001338 liquidmetal Inorganic materials 0.000 title description 8
- 230000005540 biological transmission Effects 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000004020 conductor Substances 0.000 abstract description 14
- 238000013016 damping Methods 0.000 abstract description 13
- 230000008878 coupling Effects 0.000 abstract description 8
- 238000010168 coupling process Methods 0.000 abstract description 8
- 238000005859 coupling reaction Methods 0.000 abstract description 8
- 230000009467 reduction Effects 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 18
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 18
- 229910052753 mercury Inorganic materials 0.000 description 18
- 238000010586 diagram Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- ZCJJIQHVZCFSGZ-UHFFFAOYSA-N 2,8-bis(diphenylphosphoryl)dibenzothiophene Chemical compound C=1C=CC=CC=1P(C=1C=C2C3=CC(=CC=C3SC2=CC=1)P(=O)(C=1C=CC=CC=1)C=1C=CC=CC=1)(=O)C1=CC=CC=C1 ZCJJIQHVZCFSGZ-UHFFFAOYSA-N 0.000 description 1
- 235000013175 Crataegus laevigata Nutrition 0.000 description 1
- 208000010994 Lethal infantile mitochondrial myopathy Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000004353 relayed correlation spectroscopy Methods 0.000 description 1
- 239000012945 sealing adhesive Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/22—Attenuating devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
Landscapes
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
- Attenuators (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Micromachines (AREA)
- Thermally Actuated Switches (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/136,147 US6646527B1 (en) | 2002-04-30 | 2002-04-30 | High frequency attenuator using liquid metal micro switches |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10308530A1 true DE10308530A1 (de) | 2003-11-20 |
Family
ID=22471522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE10308530A Withdrawn DE10308530A1 (de) | 2002-04-30 | 2003-02-27 | Hochfrequenzdämpfungsglied unter Verwendung von Flüssigmetallmikroschaltern |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6646527B1 (enExample) |
| JP (1) | JP2003346629A (enExample) |
| DE (1) | DE10308530A1 (enExample) |
| GB (1) | GB2388253B (enExample) |
| TW (1) | TWI258782B (enExample) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6689976B1 (en) * | 2002-10-08 | 2004-02-10 | Agilent Technologies, Inc. | Electrically isolated liquid metal micro-switches for integrally shielded microcircuits |
| US6774324B2 (en) * | 2002-12-12 | 2004-08-10 | Agilent Technologies, Inc. | Switch and production thereof |
| US6855898B2 (en) * | 2002-12-12 | 2005-02-15 | Agilent Technologies, Inc. | Ceramic channel plate for a switch |
| US6743990B1 (en) * | 2002-12-12 | 2004-06-01 | Agilent Technologies, Inc. | Volume adjustment apparatus and method for use |
| US7022926B2 (en) * | 2002-12-12 | 2006-04-04 | Agilent Technologies, Inc. | Ultrasonically milled channel plate for a switch |
| US7019235B2 (en) * | 2003-01-13 | 2006-03-28 | Agilent Technologies, Inc. | Photoimaged channel plate for a switch |
| US6825429B2 (en) * | 2003-03-31 | 2004-11-30 | Agilent Technologies, Inc. | Hermetic seal and controlled impedance RF connections for a liquid metal micro switch |
| US6841746B2 (en) * | 2003-04-14 | 2005-01-11 | Agilent Technologies, Inc. | Bent switching fluid cavity |
| US6768068B1 (en) * | 2003-04-14 | 2004-07-27 | Agilent Technologies, Inc. | Method and structure for a slug pusher-mode piezoelectrically actuated liquid metal switch |
| US6774325B1 (en) * | 2003-04-14 | 2004-08-10 | Agilent Technologies, Inc. | Reducing oxides on a switching fluid in a fluid-based switch |
| US6770827B1 (en) * | 2003-04-14 | 2004-08-03 | Agilent Technologies, Inc. | Electrical isolation of fluid-based switches |
| US6818844B2 (en) * | 2003-04-14 | 2004-11-16 | Agilent Technologies, Inc. | Method and structure for a slug assisted pusher-mode piezoelectrically actuated liquid metal optical switch |
| US6891116B2 (en) * | 2003-04-14 | 2005-05-10 | Agilent Technologies, Inc. | Substrate with liquid electrode |
| US6906271B2 (en) * | 2003-04-14 | 2005-06-14 | Agilent Technologies, Inc. | Fluid-based switch |
| US6794591B1 (en) * | 2003-04-14 | 2004-09-21 | Agilent Technologies, Inc. | Fluid-based switches |
| US6750413B1 (en) * | 2003-04-25 | 2004-06-15 | Agilent Technologies, Inc. | Liquid metal micro switches using patterned thick film dielectric as channels and a thin ceramic or glass cover plate |
| US6777630B1 (en) * | 2003-04-30 | 2004-08-17 | Agilent Technologies, Inc. | Liquid metal micro switches using as channels and heater cavities matching patterned thick film dielectric layers on opposing thin ceramic plates |
| US6759610B1 (en) * | 2003-06-05 | 2004-07-06 | Agilent Technologies, Inc. | Multi-layer assembly of stacked LIMMS devices with liquid metal vias |
| US6759611B1 (en) * | 2003-06-16 | 2004-07-06 | Agilent Technologies, Inc. | Fluid-based switches and methods for producing the same |
| US6781074B1 (en) * | 2003-07-30 | 2004-08-24 | Agilent Technologies, Inc. | Preventing corrosion degradation in a fluid-based switch |
| US6787720B1 (en) * | 2003-07-31 | 2004-09-07 | Agilent Technologies, Inc. | Gettering agent and method to prevent corrosion in a fluid switch |
| US6774327B1 (en) * | 2003-09-24 | 2004-08-10 | Agilent Technologies, Inc. | Hermetic seals for electronic components |
| US6884951B1 (en) * | 2003-10-29 | 2005-04-26 | Agilent Technologies, Inc. | Fluid-based switches and methods for manufacturing and sealing fluid-based switches |
| US8172375B2 (en) * | 2004-12-17 | 2012-05-08 | Brother Kogyo Kabushiki Kaisha | Valve and actuator employing capillary electrowetting phenomenon |
| KR101237474B1 (ko) | 2007-01-10 | 2013-02-26 | 에어로플렉스 리미티드 | 스펙트럼 분석기의 감쇄기 |
| US20090085579A1 (en) * | 2007-09-28 | 2009-04-02 | Advantest Corporation | Attenuation apparatus and test apparatus |
| DE112009000842T5 (de) * | 2008-04-15 | 2011-05-19 | Coto Technology, Inc. | Verbessertes Relais der Form C und Baustein unter Verwendung desselben |
| US9673867B2 (en) * | 2012-03-14 | 2017-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Power transmission device and power feeding system |
| DE102013221442B4 (de) * | 2013-10-22 | 2021-06-24 | Sts Spezial-Transformatoren-Stockach Gmbh & Co. Kg | Induktives Bauteil mit reduziertem Leerraum |
| CN115084811B (zh) * | 2022-08-03 | 2023-07-21 | 成都威频科技有限公司 | 一种超宽带悬置薄膜衰减器 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3600537A (en) * | 1969-04-15 | 1971-08-17 | Mechanical Enterprises Inc | Switch |
| US6323447B1 (en) * | 1998-12-30 | 2001-11-27 | Agilent Technologies, Inc. | Electrical contact breaker switch, integrated electrical contact breaker switch, and electrical contact switching method |
| US6373356B1 (en) * | 1999-05-21 | 2002-04-16 | Interscience, Inc. | Microelectromechanical liquid metal current carrying system, apparatus and method |
| EP1254474B1 (en) * | 2000-02-02 | 2004-03-24 | Raytheon Company | Microelectromechanical micro-relay with liquid metal contacts |
-
2002
- 2002-04-30 US US10/136,147 patent/US6646527B1/en not_active Expired - Fee Related
- 2002-11-25 TW TW091134209A patent/TWI258782B/zh not_active IP Right Cessation
-
2003
- 2003-02-27 DE DE10308530A patent/DE10308530A1/de not_active Withdrawn
- 2003-03-17 JP JP2003071926A patent/JP2003346629A/ja active Pending
- 2003-04-23 GB GB0309227A patent/GB2388253B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI258782B (en) | 2006-07-21 |
| JP2003346629A (ja) | 2003-12-05 |
| GB2388253B (en) | 2005-08-10 |
| US6646527B1 (en) | 2003-11-11 |
| TW200305905A (en) | 2003-11-01 |
| GB0309227D0 (en) | 2003-06-04 |
| GB2388253A (en) | 2003-11-05 |
| US20030201854A1 (en) | 2003-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8127 | New person/name/address of the applicant |
Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US |
|
| 8139 | Disposal/non-payment of the annual fee |