DE102019112546B4 - Herstellungsverfahren für eine lichtemittierende Vorrichtung - Google Patents

Herstellungsverfahren für eine lichtemittierende Vorrichtung Download PDF

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Publication number
DE102019112546B4
DE102019112546B4 DE102019112546.4A DE102019112546A DE102019112546B4 DE 102019112546 B4 DE102019112546 B4 DE 102019112546B4 DE 102019112546 A DE102019112546 A DE 102019112546A DE 102019112546 B4 DE102019112546 B4 DE 102019112546B4
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light
substrate
emitting element
emitting elements
emitting
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DE102019112546.4A
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German (de)
English (en)
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DE102019112546A1 (de
Inventor
Min-Hsun Hsieh
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ENNOSTAR CORPORATION, TW
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Epistar Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Led Device Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Planar Illumination Modules (AREA)
DE102019112546.4A 2018-05-14 2019-05-14 Herstellungsverfahren für eine lichtemittierende Vorrichtung Active DE102019112546B4 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862670900P 2018-05-14 2018-05-14
US62/670,900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697,387 2018-07-12

Publications (2)

Publication Number Publication Date
DE102019112546A1 DE102019112546A1 (de) 2019-11-14
DE102019112546B4 true DE102019112546B4 (de) 2023-09-28

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DE102019112546.4A Active DE102019112546B4 (de) 2018-05-14 2019-05-14 Herstellungsverfahren für eine lichtemittierende Vorrichtung

Country Status (6)

Country Link
US (4) US10923641B2 (https=)
JP (2) JP7441612B2 (https=)
KR (2) KR102498453B1 (https=)
CN (3) CN116682923A (https=)
DE (1) DE102019112546B4 (https=)
TW (2) TWI878222B (https=)

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JP7321792B2 (ja) * 2019-06-26 2023-08-07 株式会社ジャパンディスプレイ 異方性導電膜及び表示装置
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WO2021182318A1 (ja) * 2020-03-09 2021-09-16 積水化学工業株式会社 電子部品の製造方法、及び、表示装置の製造方法
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WO2022021003A1 (zh) * 2020-07-27 2022-02-03 重庆康佳光电技术研究院有限公司 转接板、巨量转移方法及Micro-LED显示器
CN112967980B (zh) * 2020-08-13 2021-12-24 重庆康佳光电技术研究院有限公司 芯片转移组件及其制作方法、芯片转移方法
JP7522611B2 (ja) * 2020-08-28 2024-07-25 株式会社ジャパンディスプレイ 表示装置の製造方法
CN113808980B (zh) * 2020-09-30 2025-07-25 深圳市晶相技术有限公司 一种半导体外延结构及其应用
KR102436469B1 (ko) * 2020-11-27 2022-08-26 주식회사 아큐레이저 반도체 소자의 전사 장치 및 전사 방법
KR102899002B1 (ko) * 2020-12-02 2025-12-10 엘지디스플레이 주식회사 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법
JP7788849B2 (ja) * 2021-01-28 2025-12-19 東レエンジニアリング株式会社 転写装置および転写基板
CN118483848A (zh) * 2021-07-28 2024-08-13 群创光电股份有限公司 发光装置
US12446374B2 (en) * 2022-03-21 2025-10-14 GM Global Technology Operations LLC Transparent structural composites with encapsulated micro-LEDs
JP7733602B2 (ja) * 2022-03-28 2025-09-03 東レエンジニアリング株式会社 転写装置および転写方法
CN115763351B (zh) * 2022-04-01 2025-08-26 友达光电股份有限公司 发光元件阵列基板及其制造方法
US20230317497A1 (en) * 2022-04-01 2023-10-05 AUO Corporation Display apparatus
CN119384888A (zh) * 2022-09-01 2025-01-28 三星电子株式会社 包括连接发光二极管和基板的接合构件的显示模块
CN117476532B (zh) * 2023-03-09 2025-09-02 深圳市华星光电半导体显示技术有限公司 巨量转移方法
TWI873574B (zh) * 2023-03-22 2025-02-21 友達光電股份有限公司 電子裝置及電子裝置的製造方法

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Also Published As

Publication number Publication date
US20230187597A1 (en) 2023-06-15
TWI879686B (zh) 2025-04-01
US11621384B2 (en) 2023-04-04
JP2019201206A (ja) 2019-11-21
US10923641B2 (en) 2021-02-16
CN116682923A (zh) 2023-09-01
KR20230023696A (ko) 2023-02-17
KR102688372B1 (ko) 2024-07-24
CN110491987A (zh) 2019-11-22
TW201947737A (zh) 2019-12-16
CN116682924A (zh) 2023-09-01
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
US20190348588A1 (en) 2019-11-14
US11894507B2 (en) 2024-02-06
JP2023181464A (ja) 2023-12-21
US12317664B2 (en) 2025-05-27
DE102019112546A1 (de) 2019-11-14
US20240234660A1 (en) 2024-07-11
KR102498453B1 (ko) 2023-02-09
TWI878222B (zh) 2025-04-01
JP7441612B2 (ja) 2024-03-01
KR20190130518A (ko) 2019-11-22

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