TWI878222B - 一種發光裝置及其製造方法 - Google Patents

一種發光裝置及其製造方法 Download PDF

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Publication number
TWI878222B
TWI878222B TW108116535A TW108116535A TWI878222B TW I878222 B TWI878222 B TW I878222B TW 108116535 A TW108116535 A TW 108116535A TW 108116535 A TW108116535 A TW 108116535A TW I878222 B TWI878222 B TW I878222B
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TW
Taiwan
Prior art keywords
substrate
light
emitting element
light emitting
emitting diode
Prior art date
Application number
TW108116535A
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English (en)
Chinese (zh)
Other versions
TW201947737A (zh
Inventor
謝明勳
Original Assignee
晶元光電股份有限公司
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Publication of TW201947737A publication Critical patent/TW201947737A/zh
Application granted granted Critical
Publication of TWI878222B publication Critical patent/TWI878222B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H10W72/07207—Temporary substrates, e.g. removable substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Planar Illumination Modules (AREA)
TW108116535A 2018-05-14 2019-05-14 一種發光裝置及其製造方法 TWI878222B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862670900P 2018-05-14 2018-05-14
US62/670900 2018-05-14
US201862697387P 2018-07-12 2018-07-12
US62/697387 2018-07-12

Publications (2)

Publication Number Publication Date
TW201947737A TW201947737A (zh) 2019-12-16
TWI878222B true TWI878222B (zh) 2025-04-01

Family

ID=68337028

Family Applications (2)

Application Number Title Priority Date Filing Date
TW108116535A TWI878222B (zh) 2018-05-14 2019-05-14 一種發光裝置及其製造方法
TW113138203A TWI879686B (zh) 2018-05-14 2019-05-14 一種發光裝置及其製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW113138203A TWI879686B (zh) 2018-05-14 2019-05-14 一種發光裝置及其製造方法

Country Status (6)

Country Link
US (4) US10923641B2 (https=)
JP (2) JP7441612B2 (https=)
KR (2) KR102498453B1 (https=)
CN (3) CN116682924A (https=)
DE (1) DE102019112546B4 (https=)
TW (2) TWI878222B (https=)

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JP7522611B2 (ja) * 2020-08-28 2024-07-25 株式会社ジャパンディスプレイ 表示装置の製造方法
CN113871332A (zh) * 2020-09-30 2021-12-31 苏州辰华半导体技术有限公司 一种半导体设备
KR102436469B1 (ko) * 2020-11-27 2022-08-26 주식회사 아큐레이저 반도체 소자의 전사 장치 및 전사 방법
KR102899002B1 (ko) * 2020-12-02 2025-12-10 엘지디스플레이 주식회사 발광 소자의 전사 방법 및 이를 이용한 표시 장치의 제조 방법
JP7788849B2 (ja) * 2021-01-28 2025-12-19 東レエンジニアリング株式会社 転写装置および転写基板
CN120595514A (zh) * 2021-07-28 2025-09-05 群创光电股份有限公司 发光装置
US12446374B2 (en) * 2022-03-21 2025-10-14 GM Global Technology Operations LLC Transparent structural composites with encapsulated micro-LEDs
JP7733602B2 (ja) * 2022-03-28 2025-09-03 東レエンジニアリング株式会社 転写装置および転写方法
US20230317497A1 (en) * 2022-04-01 2023-10-05 AUO Corporation Display apparatus
CN115763351B (zh) * 2022-04-01 2025-08-26 友达光电股份有限公司 发光元件阵列基板及其制造方法
EP4489077A4 (en) * 2022-09-01 2025-10-15 Samsung Electronics Co Ltd DISPLAY MODULE COMPRISING A CONNECTING ELEMENT FOR CONNECTING LIGHT-EMITTING DIODES TO A SUBSTRATE
CN117476532B (zh) * 2023-03-09 2025-09-02 深圳市华星光电半导体显示技术有限公司 巨量转移方法
TWI873574B (zh) * 2023-03-22 2025-02-21 友達光電股份有限公司 電子裝置及電子裝置的製造方法

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CN101859728A (zh) * 2009-04-10 2010-10-13 索尼公司 转移器件的方法
CN103597589A (zh) * 2011-04-11 2014-02-19 北达科他州立大学研究基金会 分立元件的选择性激光辅助的转移
TW201340290A (zh) * 2012-03-22 2013-10-01 光芯科技股份有限公司 發光裝置
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Also Published As

Publication number Publication date
US11621384B2 (en) 2023-04-04
KR20190130518A (ko) 2019-11-22
US20190348588A1 (en) 2019-11-14
JP2023181464A (ja) 2023-12-21
TW202508018A (zh) 2025-02-16
US20210159379A1 (en) 2021-05-27
DE102019112546A1 (de) 2019-11-14
CN116682924A (zh) 2023-09-01
JP7441612B2 (ja) 2024-03-01
US11894507B2 (en) 2024-02-06
JP2019201206A (ja) 2019-11-21
CN110491987A (zh) 2019-11-22
KR102688372B1 (ko) 2024-07-24
KR20230023696A (ko) 2023-02-17
KR102498453B1 (ko) 2023-02-09
US10923641B2 (en) 2021-02-16
CN116682923A (zh) 2023-09-01
US20230187597A1 (en) 2023-06-15
US12317664B2 (en) 2025-05-27
DE102019112546B4 (de) 2023-09-28
TW201947737A (zh) 2019-12-16
US20240234660A1 (en) 2024-07-11
TWI879686B (zh) 2025-04-01

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