DE102014116082A8 - Halbleitervorrichtung mit einer spannungskompensierten Chipelektrode - Google Patents

Halbleitervorrichtung mit einer spannungskompensierten Chipelektrode Download PDF

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Publication number
DE102014116082A8
DE102014116082A8 DE102014116082.7A DE102014116082A DE102014116082A8 DE 102014116082 A8 DE102014116082 A8 DE 102014116082A8 DE 102014116082 A DE102014116082 A DE 102014116082A DE 102014116082 A8 DE102014116082 A8 DE 102014116082A8
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Prior art keywords
voltage
semiconductor device
chip electrode
compensated chip
compensated
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DE102014116082.7A
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DE102014116082A1 (de
Inventor
Stephan Henneck
Stefan KRIVEC
Kurt Matoy
Florian Weilnböck
Dirk Ahlers
Karl-Heinz Gasser
Petra Fischer
Ulrike Fastner
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Infineon Technologies AG
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Infineon Technologies AG
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Priority to DE102014116082.7A priority Critical patent/DE102014116082A1/de
Priority to CN201510739122.7A priority patent/CN105575926A/zh
Priority to US14/932,548 priority patent/US20160126197A1/en
Publication of DE102014116082A1 publication Critical patent/DE102014116082A1/de
Publication of DE102014116082A8 publication Critical patent/DE102014116082A8/de
Ceased legal-status Critical Current

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    • H01L2924/37001—Yield

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
DE102014116082.7A 2014-11-04 2014-11-04 Halbleitervorrichtung mit einer spannungskompensierten Chipelelektrode Ceased DE102014116082A1 (de)

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CN201510739122.7A CN105575926A (zh) 2014-11-04 2015-11-04 具有应力补偿的芯片电极的半导体器件
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CN106531821A (zh) * 2016-11-17 2017-03-22 苏州元昱新能源有限公司 一种二极管、配置二极管的光伏电池串及光伏组件
DE102016122162B4 (de) 2016-11-17 2022-05-05 Infineon Technologies Ag Halbleitervorrichtung mit metallisierungsstrukturen auf gegenüberliegenden seiten eines halbleiterbereichs, halbleiterschaltanordnung und verfahren
CN106908970B (zh) * 2017-03-06 2019-09-13 中国电子科技集团公司第二十六研究所 声光晶体与换能器键合结构
JP6895834B2 (ja) * 2017-07-21 2021-06-30 三菱電機株式会社 パワーデバイス
CN109979825A (zh) * 2017-12-15 2019-07-05 胡志良 阵列批次式封装元件晶粒的电路元件制作方法
US11605608B2 (en) 2019-11-11 2023-03-14 Infineon Technologies Austria Ag Preform diffusion soldering
US11158602B2 (en) * 2019-11-11 2021-10-26 Infineon Technologies Austria Ag Batch diffusion soldering and electronic devices produced by batch diffusion soldering
US20230040727A1 (en) * 2020-05-13 2023-02-09 Mitsubishi Electric Corporation Semiconductor device
US11798924B2 (en) * 2020-06-16 2023-10-24 Infineon Technologies Ag Batch soldering of different elements in power module
US11610861B2 (en) * 2020-09-14 2023-03-21 Infineon Technologies Austria Ag Diffusion soldering with contaminant protection
CN112968007B (zh) * 2021-02-03 2023-03-24 重庆大学 功率半导体结构及断路器转移支路组件

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