DE112015004033A5 - Optoelektronisches Halbleiterbauteil und Blitzlicht - Google Patents
Optoelektronisches Halbleiterbauteil und Blitzlicht Download PDFInfo
- Publication number
- DE112015004033A5 DE112015004033A5 DE112015004033.1T DE112015004033T DE112015004033A5 DE 112015004033 A5 DE112015004033 A5 DE 112015004033A5 DE 112015004033 T DE112015004033 T DE 112015004033T DE 112015004033 A5 DE112015004033 A5 DE 112015004033A5
- Authority
- DE
- Germany
- Prior art keywords
- flashlight
- semiconductor device
- optoelectronic semiconductor
- optoelectronic
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005693 optoelectronics Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/21—Combinations with auxiliary equipment, e.g. with clocks or memoranda pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
- H05B47/10—Controlling the light source
- H05B47/105—Controlling the light source in response to determined parameters
- H05B47/11—Controlling the light source in response to determined parameters by determining the brightness or colour temperature of ambient light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014112681.5A DE102014112681A1 (de) | 2014-09-03 | 2014-09-03 | Optoelektronisches Halbleiterbauteil und Blitzlicht |
DE102014112681.5 | 2014-09-03 | ||
PCT/EP2015/069605 WO2016034480A1 (de) | 2014-09-03 | 2015-08-27 | Optoelektronisches halbleiterbauteil und blitzlicht |
Publications (2)
Publication Number | Publication Date |
---|---|
DE112015004033A5 true DE112015004033A5 (de) | 2017-05-24 |
DE112015004033B4 DE112015004033B4 (de) | 2020-08-20 |
Family
ID=54007721
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102014112681.5A Withdrawn DE102014112681A1 (de) | 2014-09-03 | 2014-09-03 | Optoelektronisches Halbleiterbauteil und Blitzlicht |
DE112015004033.1T Active DE112015004033B4 (de) | 2014-09-03 | 2015-08-27 | Optoelektronisches Halbleiterbauteil und Blitzlicht |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102014112681.5A Withdrawn DE102014112681A1 (de) | 2014-09-03 | 2014-09-03 | Optoelektronisches Halbleiterbauteil und Blitzlicht |
Country Status (6)
Country | Link |
---|---|
US (1) | US10020292B2 (de) |
JP (1) | JP6695327B2 (de) |
CN (1) | CN106796935B (de) |
DE (2) | DE102014112681A1 (de) |
TW (1) | TWI621283B (de) |
WO (1) | WO2016034480A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4024454B1 (de) * | 2014-10-28 | 2023-08-30 | Seoul Semiconductor Co., Ltd. | Weisslichtquellensystem |
DE102016104875A1 (de) | 2016-03-16 | 2017-09-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Blitzlichtbeleuchtung für ein tragbares Gerät |
DE102016107497B4 (de) | 2016-03-24 | 2020-01-30 | Tdk Electronics Ag | Multi-LED System und Verfahren zu seiner Herstellung |
DE102016117594A1 (de) * | 2016-09-19 | 2018-03-22 | Osram Opto Semiconductors Gmbh | Licht emittierende Vorrichtung |
DE102017103884A1 (de) | 2017-02-24 | 2018-08-30 | Osram Opto Semiconductors Gmbh | Beleuchtungseinrichtung, elektronisches Gerät mit einer Beleuchtungseinrichtung und Verwendung einer Beleuchtungseinrichtung |
CN110612610A (zh) * | 2017-02-27 | 2019-12-24 | 朱伽努有限责任公司 | 可调白光照明系统 |
US10700245B2 (en) | 2017-07-04 | 2020-06-30 | Nichia Corporation | Light-emitting device |
JP6705476B2 (ja) * | 2017-09-29 | 2020-06-03 | 日亜化学工業株式会社 | 発光装置 |
US11257990B2 (en) * | 2017-09-29 | 2022-02-22 | Nichia Corporation | Light emitting device |
DE102017122936A1 (de) * | 2017-10-04 | 2019-04-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
KR102516217B1 (ko) * | 2017-11-30 | 2023-04-03 | 서울반도체 주식회사 | 발광 다이오드들을 포함하는 발광 장치 |
KR102440864B1 (ko) * | 2017-12-22 | 2022-09-07 | 루미레즈 엘엘씨 | 광 산란을 튜닝하기 위한 다공성 미크론 크기의 입자들 |
US10761246B2 (en) | 2017-12-22 | 2020-09-01 | Lumileds Llc | Light emitting semiconductor device having polymer-filled sub-micron pores in porous structure to tune light scattering |
US10349484B1 (en) * | 2018-05-31 | 2019-07-09 | Cree, Inc. | Solid state lighting devices with reduced melatonin suppression characteristics |
DE102018119462A1 (de) * | 2018-08-09 | 2020-02-13 | Osram Opto Semiconductors Gmbh | Sichtbares licht und ir-strahlung emittierendes optoelektronisches bauelement |
TWI675239B (zh) * | 2018-08-13 | 2019-10-21 | 友達光電股份有限公司 | 顯示裝置 |
CN111213006A (zh) * | 2018-09-12 | 2020-05-29 | 首尔半导体株式会社 | 发光装置 |
JP6959548B2 (ja) | 2018-10-04 | 2021-11-02 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP7089181B2 (ja) | 2018-10-12 | 2022-06-22 | 日亜化学工業株式会社 | 発光装置 |
JP7248939B2 (ja) * | 2018-10-12 | 2023-03-30 | 日亜化学工業株式会社 | 発光装置 |
WO2020114463A1 (zh) * | 2018-12-07 | 2020-06-11 | 海迪科(南通)光电科技有限公司 | 一种封装体及其制备方法 |
CN112203377B (zh) * | 2019-06-21 | 2023-04-14 | 四川联恺照明有限公司 | 一种色温调节方法、色温调节装置以及光源组件 |
JP7323787B2 (ja) * | 2019-07-31 | 2023-08-09 | 日亜化学工業株式会社 | 照明装置及び赤外線カメラ付き照明装置 |
DE102019125268A1 (de) * | 2019-09-19 | 2021-03-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Betriebsverfahren für ein optoelektronischen halbleiterbauteil und optoelektronisches halbleiterbauteil |
CN111766712B (zh) * | 2020-07-23 | 2022-02-01 | 深圳市锐思华创技术有限公司 | 一种高亮度宽色域低光斑的激光扫描投影模组 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6414426B1 (en) * | 1997-02-13 | 2002-07-02 | Matsushita Electric Industrial Co., Ltd. | High-efficiency light source |
KR100441595B1 (ko) | 2001-10-15 | 2004-07-23 | 삼성전자주식회사 | 색온도 변환장치 및 방법 |
US7679672B2 (en) * | 2004-10-14 | 2010-03-16 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Electronic flash, imaging device and method for producing a flash of light having a wavelength spectrum in the visible range and the infrared range using a fluorescent material |
US7404652B2 (en) | 2004-12-15 | 2008-07-29 | Avago Technologies Ecbu Ip Pte Ltd | Light-emitting diode flash module with enhanced spectral emission |
EP2549330B1 (de) | 2006-05-05 | 2017-08-30 | Prysm, Inc. | Phosphorzusammensetzungen und andere Leuchtstoffmaterialien für Anzeigesysteme und -vorrichtungen |
JP2008218486A (ja) | 2007-02-28 | 2008-09-18 | Toshiba Lighting & Technology Corp | 発光装置 |
JP2008283155A (ja) * | 2007-05-14 | 2008-11-20 | Sharp Corp | 発光装置、照明機器および液晶表示装置 |
US8339029B2 (en) | 2009-02-19 | 2012-12-25 | Cree, Inc. | Light emitting devices and systems having tunable chromaticity |
DE102009015313B4 (de) * | 2009-03-27 | 2022-02-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Anzeigeeinrichtung |
US8426871B2 (en) | 2009-06-19 | 2013-04-23 | Honeywell International Inc. | Phosphor converting IR LEDs |
FR2956407B1 (fr) | 2010-02-17 | 2013-03-08 | Saint Gobain | Composes luminescents |
US8411025B2 (en) | 2010-04-10 | 2013-04-02 | Lg Innotek Co., Ltd. | Lighting apparauts |
KR101821727B1 (ko) * | 2010-04-16 | 2018-01-24 | 플렉스 라이팅 투 엘엘씨 | 필름 기반 라이트가이드를 포함하는 프론트 조명 디바이스 |
JP2012199218A (ja) | 2010-09-09 | 2012-10-18 | Mitsubishi Chemicals Corp | 発光装置、照明システム及び照明方法 |
CN102458019B (zh) * | 2010-10-26 | 2014-01-22 | 财团法人工业技术研究院 | 光色调制方法及发光二极管光源模块 |
US20120326627A1 (en) * | 2011-06-14 | 2012-12-27 | Luminus Devices, Inc. | Systems and methods for controlling white light |
US8870617B2 (en) * | 2013-01-03 | 2014-10-28 | Xicato, Inc. | Color tuning of a multi-color LED based illumination device |
WO2016093076A1 (ja) * | 2014-12-09 | 2016-06-16 | 信越化学工業株式会社 | 波長変換部材及び発光装置 |
-
2014
- 2014-09-03 DE DE102014112681.5A patent/DE102014112681A1/de not_active Withdrawn
-
2015
- 2015-08-27 WO PCT/EP2015/069605 patent/WO2016034480A1/de active Application Filing
- 2015-08-27 US US15/508,511 patent/US10020292B2/en active Active
- 2015-08-27 JP JP2017512681A patent/JP6695327B2/ja active Active
- 2015-08-27 DE DE112015004033.1T patent/DE112015004033B4/de active Active
- 2015-08-27 CN CN201580047698.5A patent/CN106796935B/zh active Active
- 2015-09-01 TW TW104128772A patent/TWI621283B/zh active
Also Published As
Publication number | Publication date |
---|---|
US20170278829A1 (en) | 2017-09-28 |
JP6695327B2 (ja) | 2020-05-20 |
US10020292B2 (en) | 2018-07-10 |
DE102014112681A1 (de) | 2016-03-03 |
TWI621283B (zh) | 2018-04-11 |
TW201624771A (zh) | 2016-07-01 |
JP2017531315A (ja) | 2017-10-19 |
CN106796935B (zh) | 2019-09-27 |
WO2016034480A1 (de) | 2016-03-10 |
DE112015004033B4 (de) | 2020-08-20 |
CN106796935A (zh) | 2017-05-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R016 | Response to examination communication | ||
R016 | Response to examination communication | ||
R018 | Grant decision by examination section/examining division | ||
R020 | Patent grant now final |