DE112015004033A5 - Optoelektronisches Halbleiterbauteil und Blitzlicht - Google Patents

Optoelektronisches Halbleiterbauteil und Blitzlicht Download PDF

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Publication number
DE112015004033A5
DE112015004033A5 DE112015004033.1T DE112015004033T DE112015004033A5 DE 112015004033 A5 DE112015004033 A5 DE 112015004033A5 DE 112015004033 T DE112015004033 T DE 112015004033T DE 112015004033 A5 DE112015004033 A5 DE 112015004033A5
Authority
DE
Germany
Prior art keywords
flashlight
semiconductor device
optoelectronic semiconductor
optoelectronic
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112015004033.1T
Other languages
English (en)
Other versions
DE112015004033B4 (de
Inventor
Ion Stoll
David Racz
Markus Schneider
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015004033A5 publication Critical patent/DE112015004033A5/de
Application granted granted Critical
Publication of DE112015004033B4 publication Critical patent/DE112015004033B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/507Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/21Combinations with auxiliary equipment, e.g. with clocks or memoranda pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/105Controlling the light source in response to determined parameters
    • H05B47/11Controlling the light source in response to determined parameters by determining the brightness or colour temperature of ambient light

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
DE112015004033.1T 2014-09-03 2015-08-27 Optoelektronisches Halbleiterbauteil und Blitzlicht Active DE112015004033B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014112681.5A DE102014112681A1 (de) 2014-09-03 2014-09-03 Optoelektronisches Halbleiterbauteil und Blitzlicht
DE102014112681.5 2014-09-03
PCT/EP2015/069605 WO2016034480A1 (de) 2014-09-03 2015-08-27 Optoelektronisches halbleiterbauteil und blitzlicht

Publications (2)

Publication Number Publication Date
DE112015004033A5 true DE112015004033A5 (de) 2017-05-24
DE112015004033B4 DE112015004033B4 (de) 2020-08-20

Family

ID=54007721

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014112681.5A Withdrawn DE102014112681A1 (de) 2014-09-03 2014-09-03 Optoelektronisches Halbleiterbauteil und Blitzlicht
DE112015004033.1T Active DE112015004033B4 (de) 2014-09-03 2015-08-27 Optoelektronisches Halbleiterbauteil und Blitzlicht

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014112681.5A Withdrawn DE102014112681A1 (de) 2014-09-03 2014-09-03 Optoelektronisches Halbleiterbauteil und Blitzlicht

Country Status (6)

Country Link
US (1) US10020292B2 (de)
JP (1) JP6695327B2 (de)
CN (1) CN106796935B (de)
DE (2) DE102014112681A1 (de)
TW (1) TWI621283B (de)
WO (1) WO2016034480A1 (de)

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EP4024454B1 (de) * 2014-10-28 2023-08-30 Seoul Semiconductor Co., Ltd. Weisslichtquellensystem
DE102016104875A1 (de) 2016-03-16 2017-09-21 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Blitzlichtbeleuchtung für ein tragbares Gerät
DE102016107497B4 (de) 2016-03-24 2020-01-30 Tdk Electronics Ag Multi-LED System und Verfahren zu seiner Herstellung
DE102016117594A1 (de) * 2016-09-19 2018-03-22 Osram Opto Semiconductors Gmbh Licht emittierende Vorrichtung
DE102017103884A1 (de) 2017-02-24 2018-08-30 Osram Opto Semiconductors Gmbh Beleuchtungseinrichtung, elektronisches Gerät mit einer Beleuchtungseinrichtung und Verwendung einer Beleuchtungseinrichtung
CN110612610A (zh) * 2017-02-27 2019-12-24 朱伽努有限责任公司 可调白光照明系统
US10700245B2 (en) 2017-07-04 2020-06-30 Nichia Corporation Light-emitting device
JP6705476B2 (ja) * 2017-09-29 2020-06-03 日亜化学工業株式会社 発光装置
US11257990B2 (en) * 2017-09-29 2022-02-22 Nichia Corporation Light emitting device
DE102017122936A1 (de) * 2017-10-04 2019-04-04 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
KR102516217B1 (ko) * 2017-11-30 2023-04-03 서울반도체 주식회사 발광 다이오드들을 포함하는 발광 장치
KR102440864B1 (ko) * 2017-12-22 2022-09-07 루미레즈 엘엘씨 광 산란을 튜닝하기 위한 다공성 미크론 크기의 입자들
US10761246B2 (en) 2017-12-22 2020-09-01 Lumileds Llc Light emitting semiconductor device having polymer-filled sub-micron pores in porous structure to tune light scattering
US10349484B1 (en) * 2018-05-31 2019-07-09 Cree, Inc. Solid state lighting devices with reduced melatonin suppression characteristics
DE102018119462A1 (de) * 2018-08-09 2020-02-13 Osram Opto Semiconductors Gmbh Sichtbares licht und ir-strahlung emittierendes optoelektronisches bauelement
TWI675239B (zh) * 2018-08-13 2019-10-21 友達光電股份有限公司 顯示裝置
CN111213006A (zh) * 2018-09-12 2020-05-29 首尔半导体株式会社 发光装置
JP6959548B2 (ja) 2018-10-04 2021-11-02 日亜化学工業株式会社 発光装置およびその製造方法
JP7089181B2 (ja) 2018-10-12 2022-06-22 日亜化学工業株式会社 発光装置
JP7248939B2 (ja) * 2018-10-12 2023-03-30 日亜化学工業株式会社 発光装置
WO2020114463A1 (zh) * 2018-12-07 2020-06-11 海迪科(南通)光电科技有限公司 一种封装体及其制备方法
CN112203377B (zh) * 2019-06-21 2023-04-14 四川联恺照明有限公司 一种色温调节方法、色温调节装置以及光源组件
JP7323787B2 (ja) * 2019-07-31 2023-08-09 日亜化学工業株式会社 照明装置及び赤外線カメラ付き照明装置
DE102019125268A1 (de) * 2019-09-19 2021-03-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Betriebsverfahren für ein optoelektronischen halbleiterbauteil und optoelektronisches halbleiterbauteil
CN111766712B (zh) * 2020-07-23 2022-02-01 深圳市锐思华创技术有限公司 一种高亮度宽色域低光斑的激光扫描投影模组

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JP2008218486A (ja) 2007-02-28 2008-09-18 Toshiba Lighting & Technology Corp 発光装置
JP2008283155A (ja) * 2007-05-14 2008-11-20 Sharp Corp 発光装置、照明機器および液晶表示装置
US8339029B2 (en) 2009-02-19 2012-12-25 Cree, Inc. Light emitting devices and systems having tunable chromaticity
DE102009015313B4 (de) * 2009-03-27 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Anzeigeeinrichtung
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Also Published As

Publication number Publication date
US20170278829A1 (en) 2017-09-28
JP6695327B2 (ja) 2020-05-20
US10020292B2 (en) 2018-07-10
DE102014112681A1 (de) 2016-03-03
TWI621283B (zh) 2018-04-11
TW201624771A (zh) 2016-07-01
JP2017531315A (ja) 2017-10-19
CN106796935B (zh) 2019-09-27
WO2016034480A1 (de) 2016-03-10
DE112015004033B4 (de) 2020-08-20
CN106796935A (zh) 2017-05-31

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R020 Patent grant now final