DE102013204565B4 - Halbleitervorrichtung und Verfahren zum Herstellen derselben - Google Patents

Halbleitervorrichtung und Verfahren zum Herstellen derselben Download PDF

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Publication number
DE102013204565B4
DE102013204565B4 DE102013204565.4A DE102013204565A DE102013204565B4 DE 102013204565 B4 DE102013204565 B4 DE 102013204565B4 DE 102013204565 A DE102013204565 A DE 102013204565A DE 102013204565 B4 DE102013204565 B4 DE 102013204565B4
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DE
Germany
Prior art keywords
printed circuit
circuit board
flat cable
semiconductor device
flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102013204565.4A
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German (de)
English (en)
Other versions
DE102013204565A1 (de
Inventor
Taichi Obara
Rei YONEYAMA
Hiroyuki Okabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE102013204565A1 publication Critical patent/DE102013204565A1/de
Application granted granted Critical
Publication of DE102013204565B4 publication Critical patent/DE102013204565B4/de
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/522—Multilayered bond wires, e.g. having a coating concentric around a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Pressure Sensors (AREA)
  • Wire Bonding (AREA)
DE102013204565.4A 2012-04-26 2013-03-15 Halbleitervorrichtung und Verfahren zum Herstellen derselben Active DE102013204565B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-101297 2012-04-26
JP2012101297A JP5660076B2 (ja) 2012-04-26 2012-04-26 半導体装置とその製造方法

Publications (2)

Publication Number Publication Date
DE102013204565A1 DE102013204565A1 (de) 2013-10-31
DE102013204565B4 true DE102013204565B4 (de) 2023-04-20

Family

ID=49323389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102013204565.4A Active DE102013204565B4 (de) 2012-04-26 2013-03-15 Halbleitervorrichtung und Verfahren zum Herstellen derselben

Country Status (4)

Country Link
US (1) US9125308B2 (https=)
JP (1) JP5660076B2 (https=)
CN (1) CN103379735B (https=)
DE (1) DE102013204565B4 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022127941A1 (de) * 2022-10-21 2024-05-02 Vega Grieshaber Kg Feldgerät und Verfahren zur kompakten Anordnung von elektronischen Baugruppen einer Elektronikschaltung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8413336U1 (de) 1984-05-02 1984-08-23 Gossen Gmbh, 8520 Erlangen Flachbandkabel
JPH08203351A (ja) 1995-01-24 1996-08-09 Hirose Electric Co Ltd 保持体付同軸セミリジッドケーブル組立体
WO2000065888A1 (fr) 1999-04-22 2000-11-02 Rohm Co., Ltd. Carte de circuit imprime, bloc batterie et procede de fabrication de carte de circuit imprime
JP2003100156A (ja) 2001-09-26 2003-04-04 Canon Inc ケーブル及び電子機器
US20060067066A1 (en) 2004-09-27 2006-03-30 Meier Pascal C Flexible cable for high-speed interconnect
DE112008002140T5 (de) 2007-09-21 2010-06-17 Mitsubishi Electric Corp. Struktur zum Befestigen einer flexiblen Leiterplatte
JP2010232254A (ja) 2009-03-26 2010-10-14 Kyocera Corp Ｅｃｕ用混成集積回路装置
JP2012101297A (ja) 2010-11-08 2012-05-31 Sandvik Kk 無端ベルトの製造方法及び装着方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4860075U (https=) * 1971-11-12 1973-07-31
JPS5340476U (https=) * 1976-09-10 1978-04-07
JPS5943593A (ja) 1982-09-06 1984-03-10 富士通株式会社 電子回路モジユ−ルの製造方法
US5288950A (en) * 1991-02-15 1994-02-22 Sumitomo Metal Mining Company Limited Flexible wiring board and method of preparing the same
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
JP3430192B2 (ja) * 1996-11-12 2003-07-28 株式会社日立産機システム インバータ装置
JPH10209594A (ja) * 1997-01-17 1998-08-07 Fuji Photo Optical Co Ltd フレキシブルプリント回路基板と硬質プリント回路基板との接続構造
JP3667176B2 (ja) * 1999-11-12 2005-07-06 平河ヒューテック株式会社 フラットケーブルおよびその製造方法
JP4667652B2 (ja) 2001-06-12 2011-04-13 ローム株式会社 電池パック、およびその製造方法
JP4330294B2 (ja) 2001-08-10 2009-09-16 三菱電機株式会社 電力用半導体装置
JP2004297972A (ja) * 2003-03-28 2004-10-21 Toyota Industries Corp 半導体装置
JP4265394B2 (ja) * 2003-12-17 2009-05-20 株式会社日立製作所 電力変換装置
JP4673211B2 (ja) * 2005-12-27 2011-04-20 日立オートモティブシステムズ株式会社 電力変換装置
JP2010105640A (ja) 2008-10-31 2010-05-13 Nsk Ltd 電動パワーステアリング装置
JP2010165914A (ja) 2009-01-16 2010-07-29 Toshiba Carrier Corp インバータ装置及びインバータ装置の製造方法
JP5375408B2 (ja) * 2009-07-24 2013-12-25 住友電気工業株式会社 同軸線ハーネス
WO2012039114A1 (ja) * 2010-09-24 2012-03-29 オンセミコンダクター・トレーディング・リミテッド 回路装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8413336U1 (de) 1984-05-02 1984-08-23 Gossen Gmbh, 8520 Erlangen Flachbandkabel
JPH08203351A (ja) 1995-01-24 1996-08-09 Hirose Electric Co Ltd 保持体付同軸セミリジッドケーブル組立体
WO2000065888A1 (fr) 1999-04-22 2000-11-02 Rohm Co., Ltd. Carte de circuit imprime, bloc batterie et procede de fabrication de carte de circuit imprime
JP2003100156A (ja) 2001-09-26 2003-04-04 Canon Inc ケーブル及び電子機器
US20060067066A1 (en) 2004-09-27 2006-03-30 Meier Pascal C Flexible cable for high-speed interconnect
DE112008002140T5 (de) 2007-09-21 2010-06-17 Mitsubishi Electric Corp. Struktur zum Befestigen einer flexiblen Leiterplatte
JP2010232254A (ja) 2009-03-26 2010-10-14 Kyocera Corp Ｅｃｕ用混成集積回路装置
JP2012101297A (ja) 2010-11-08 2012-05-31 Sandvik Kk 無端ベルトの製造方法及び装着方法

Also Published As

Publication number Publication date
JP5660076B2 (ja) 2015-01-28
JP2013229489A (ja) 2013-11-07
US20130286622A1 (en) 2013-10-31
CN103379735B (zh) 2016-06-08
US9125308B2 (en) 2015-09-01
CN103379735A (zh) 2013-10-30
DE102013204565A1 (de) 2013-10-31

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