DE102011010118A8 - Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements - Google Patents

Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements Download PDF

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Publication number
DE102011010118A8
DE102011010118A8 DE102011010118A DE102011010118A DE102011010118A8 DE 102011010118 A8 DE102011010118 A8 DE 102011010118A8 DE 102011010118 A DE102011010118 A DE 102011010118A DE 102011010118 A DE102011010118 A DE 102011010118A DE 102011010118 A8 DE102011010118 A8 DE 102011010118A8
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DE
Germany
Prior art keywords
conversion element
ceramic conversion
producing
semiconductor chip
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102011010118A
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English (en)
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DE102011010118A1 (de
Inventor
Dominik Eisert
Ute Liepold
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102011010118A priority Critical patent/DE102011010118A1/de
Priority to KR1020137020233A priority patent/KR101552780B1/ko
Priority to PCT/EP2012/050624 priority patent/WO2012104141A1/de
Priority to US13/981,370 priority patent/US9076933B2/en
Priority to CN201280007472.9A priority patent/CN103339223B/zh
Priority to CN201510460432.5A priority patent/CN105118913B/zh
Priority to JP2013552147A priority patent/JP5738438B2/ja
Publication of DE102011010118A1 publication Critical patent/DE102011010118A1/de
Publication of DE102011010118A8 publication Critical patent/DE102011010118A8/de
Priority to JP2015086705A priority patent/JP6223381B2/ja
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00Layered products essentially comprising ceramics, e.g. refractory products
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774Aluminates
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0095Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/341Silica or silicates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/366Aluminium nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/368Silicon nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
DE102011010118A 2011-02-02 2011-02-02 Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements Pending DE102011010118A1 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE102011010118A DE102011010118A1 (de) 2011-02-02 2011-02-02 Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements
KR1020137020233A KR101552780B1 (ko) 2011-02-02 2012-01-17 세라믹 변환 소자, 세라믹 변환 소자를 포함하는 반도체 칩 및 세라믹 변환 소자의 제조 방법
PCT/EP2012/050624 WO2012104141A1 (de) 2011-02-02 2012-01-17 Keramisches konversionselement, halbleiterchip mit einem keramischen konversionselement und verfahren zur herstellung eines keramischen konversionselements
US13/981,370 US9076933B2 (en) 2011-02-02 2012-01-17 Ceramic conversion element, semiconductor chip comprising a ceramic conversion element and method for producing a ceramic conversion element
CN201280007472.9A CN103339223B (zh) 2011-02-02 2012-01-17 陶瓷变换元件、具有陶瓷变换元件的半导体芯片和用于制造陶瓷变换元件的方法
CN201510460432.5A CN105118913B (zh) 2011-02-02 2012-01-17 陶瓷变换元件、具有它的半导体芯片及其制造方法
JP2013552147A JP5738438B2 (ja) 2011-02-02 2012-01-17 セラミック変換素子、セラミック変換素子を備えた半導体チップおよびセラミック変換素子の製造方法
JP2015086705A JP6223381B2 (ja) 2011-02-02 2015-04-21 セラミック変換素子、セラミック変換素子を備えた半導体チップおよびセラミック変換素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011010118A DE102011010118A1 (de) 2011-02-02 2011-02-02 Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements

Publications (2)

Publication Number Publication Date
DE102011010118A1 DE102011010118A1 (de) 2012-08-02
DE102011010118A8 true DE102011010118A8 (de) 2012-12-13

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011010118A Pending DE102011010118A1 (de) 2011-02-02 2011-02-02 Keramisches Konversionselement, Halbleiterchip mit einem keramischen Konversionselement und Verfahren zur Herstellung eines keramischen Konversionselements

Country Status (6)

Country Link
US (1) US9076933B2 (de)
JP (2) JP5738438B2 (de)
KR (1) KR101552780B1 (de)
CN (2) CN105118913B (de)
DE (1) DE102011010118A1 (de)
WO (1) WO2012104141A1 (de)

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Publication number Priority date Publication date Assignee Title
DE102012202927B4 (de) * 2012-02-27 2021-06-10 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
DE102012104274A1 (de) 2012-05-16 2013-11-21 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines keramischen Konversionselements, keramisches Konversionselement und optoelektronisches Halbleiterbauelement
DE102012109650A1 (de) 2012-10-10 2014-04-10 Osram Opto Semiconductors Gmbh Keramisches Konversionselement, optoelektronisches Halbleiterelement und Verfahren zur Herstellung eines keramischen Konversionselements
DE102013104132A1 (de) * 2013-04-24 2014-10-30 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und optoelektronisches Halbleiterbauteil
DE102013105533A1 (de) 2013-05-29 2014-12-04 Osram Opto Semiconductors Gmbh Anorganisches optisches Element und Verfahren zur Herstellung eines anorganischen optischen Elements
DE102013218451A1 (de) 2013-09-14 2015-03-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Konversionselement für ein optisches oder optoelektronisches Bauelement und Verfahren zu seiner Herstellung
DE102014100771A1 (de) * 2014-01-23 2015-07-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines keramischen Konversionselements und Licht emittierendes Bauelement
MY177277A (en) 2014-03-03 2020-09-10 Covalent Mat Corporation Wavelength converting member
DE102014112883A1 (de) 2014-09-08 2016-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil
DE102015105474A1 (de) * 2015-04-10 2016-10-13 Osram Opto Semiconductors Gmbh Konverterbauteil für eine optoelektronische Leuchtvorrichtung
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
CN110094647A (zh) * 2018-01-29 2019-08-06 深圳市绎立锐光科技开发有限公司 一种波长转换装置、发光组件及照明装置
DE102018204163A1 (de) 2018-03-19 2019-09-19 Osram Opto Semiconductors Gmbh Konversionselement für LED-Anwendungen mit hoher Leistung und hoher Farbwiedergabe
DE102018128753A1 (de) * 2018-11-15 2020-05-20 Osram Opto Semiconductors Gmbh Verfahren zur herstellung eines konversionselements, konversionselement und strahlungsemittierendes bauelement
US10873009B2 (en) * 2018-11-21 2020-12-22 Osram Opto Semiconductors Gmbh Barrier layer functioned novel-structure ceramic converter materials and light emitting devices

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DE102005030128A1 (de) * 2004-06-28 2006-03-23 Kyocera Corp. Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
DE102006037730A1 (de) * 2006-08-11 2008-02-14 Merck Patent Gmbh LED-Konversionsleuchtstoffe in Form von keramischen Körpern
DE102008054029A1 (de) * 2008-10-30 2010-05-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
US20100276717A1 (en) * 2008-01-15 2010-11-04 Koninklijke Philips Electronics N.V. Light scattering by controlled porosity in optical ceramics for leds
US20100289044A1 (en) * 2009-05-12 2010-11-18 Koninklijke Philips Electronics N.V. Wavelength conversion for producing white light from high power blue led

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JP2009524914A (ja) * 2006-01-24 2009-07-02 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 発光装置
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JP5107882B2 (ja) * 2008-12-11 2012-12-26 日東電工株式会社 光半導体封止用シート
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DE102005030128A1 (de) * 2004-06-28 2006-03-23 Kyocera Corp. Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung
DE102006037730A1 (de) * 2006-08-11 2008-02-14 Merck Patent Gmbh LED-Konversionsleuchtstoffe in Form von keramischen Körpern
US20100276717A1 (en) * 2008-01-15 2010-11-04 Koninklijke Philips Electronics N.V. Light scattering by controlled porosity in optical ceramics for leds
DE102008054029A1 (de) * 2008-10-30 2010-05-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
US20100289044A1 (en) * 2009-05-12 2010-11-18 Koninklijke Philips Electronics N.V. Wavelength conversion for producing white light from high power blue led

Also Published As

Publication number Publication date
WO2012104141A1 (de) 2012-08-09
US9076933B2 (en) 2015-07-07
US20130320384A1 (en) 2013-12-05
CN103339223B (zh) 2015-09-09
JP5738438B2 (ja) 2015-06-24
KR20130115342A (ko) 2013-10-21
DE102011010118A1 (de) 2012-08-02
JP2015165588A (ja) 2015-09-17
CN105118913A (zh) 2015-12-02
CN103339223A (zh) 2013-10-02
JP2014504807A (ja) 2014-02-24
KR101552780B1 (ko) 2015-09-11
JP6223381B2 (ja) 2017-11-01
CN105118913B (zh) 2018-03-30

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