DE102010014667A1 - Leuchtdiodenchip mit Stromaufweitungsschicht - Google Patents
Leuchtdiodenchip mit Stromaufweitungsschicht Download PDFInfo
- Publication number
- DE102010014667A1 DE102010014667A1 DE102010014667A DE102010014667A DE102010014667A1 DE 102010014667 A1 DE102010014667 A1 DE 102010014667A1 DE 102010014667 A DE102010014667 A DE 102010014667A DE 102010014667 A DE102010014667 A DE 102010014667A DE 102010014667 A1 DE102010014667 A1 DE 102010014667A1
- Authority
- DE
- Germany
- Prior art keywords
- layer
- current spreading
- light
- emitting diode
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/28—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices being characterised by field-effect operation, e.g. junction field-effect phototransistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/8242—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
- H10H20/8312—Electrodes characterised by their shape extending at least partially through the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010014667A DE102010014667A1 (de) | 2010-04-12 | 2010-04-12 | Leuchtdiodenchip mit Stromaufweitungsschicht |
| JP2013504213A JP5943904B2 (ja) | 2010-04-12 | 2011-04-08 | 電流拡散層を有する発光ダイオードチップ |
| CN201180018587.3A CN102834937B (zh) | 2010-04-12 | 2011-04-08 | 具有电流扩展层的发光二极管芯片 |
| US13/640,037 US20130126920A1 (en) | 2010-04-12 | 2011-04-08 | Light-Emitting Diode Chip with Current Spreading Layer |
| KR1020127029623A KR20130060189A (ko) | 2010-04-12 | 2011-04-08 | 전류 확산 층을 구비한 발광 다이오드 칩 |
| PCT/EP2011/055566 WO2011128277A1 (de) | 2010-04-12 | 2011-04-08 | Leuchtdiodenchip mit stromaufweitungsschicht |
| CN201510504954.0A CN105206731B (zh) | 2010-04-12 | 2011-04-08 | 具有电流扩展层的发光二极管芯片 |
| EP11714027.7A EP2559076B1 (de) | 2010-04-12 | 2011-04-08 | Leuchtdiodenchip mit stromaufweitungsschicht |
| EP16181773.9A EP3131127B1 (de) | 2010-04-12 | 2011-04-08 | Leuchtdiodenchip mit stromaufweitungsschicht |
| US14/830,616 US9853188B2 (en) | 2010-04-12 | 2015-08-19 | Light-emitting diode chip with current spreading layer |
| JP2015206284A JP6124973B2 (ja) | 2010-04-12 | 2015-10-20 | 電流拡散層を有する発光ダイオードチップ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010014667A DE102010014667A1 (de) | 2010-04-12 | 2010-04-12 | Leuchtdiodenchip mit Stromaufweitungsschicht |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102010014667A1 true DE102010014667A1 (de) | 2011-10-13 |
Family
ID=44123194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102010014667A Withdrawn DE102010014667A1 (de) | 2010-04-12 | 2010-04-12 | Leuchtdiodenchip mit Stromaufweitungsschicht |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20130126920A1 (https=) |
| EP (2) | EP3131127B1 (https=) |
| JP (2) | JP5943904B2 (https=) |
| KR (1) | KR20130060189A (https=) |
| CN (2) | CN102834937B (https=) |
| DE (1) | DE102010014667A1 (https=) |
| WO (1) | WO2011128277A1 (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014114524A1 (de) * | 2013-01-28 | 2014-07-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer halbleiterchip mit einer ald-schicht verkapselt und entsprechendes verfahren zur herstellung |
| EP2903027A1 (de) * | 2014-01-30 | 2015-08-05 | AZUR SPACE Solar Power GmbH | LED-Halbleiterbauelement |
| DE102015011635A1 (de) | 2015-09-11 | 2017-03-16 | Azur Space Solar Power Gmbh | lnfrarot-LED |
| DE102015118041A1 (de) * | 2015-10-22 | 2017-04-27 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip und Verfahren zur Herstellung eines Leuchtdiodenchips |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010014667A1 (de) * | 2010-04-12 | 2011-10-13 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip mit Stromaufweitungsschicht |
| JP2016054260A (ja) | 2014-09-04 | 2016-04-14 | 株式会社東芝 | 半導体発光素子 |
| DE102017101637A1 (de) * | 2017-01-27 | 2018-08-02 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| DE102017104144B9 (de) * | 2017-02-28 | 2022-03-10 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung von Leuchtdioden |
| TWI635626B (zh) * | 2017-10-19 | 2018-09-11 | 友達光電股份有限公司 | 發光裝置 |
| US20210288222A1 (en) * | 2020-03-11 | 2021-09-16 | Lumileds Llc | Light Emitting Diode Devices With Common Electrode |
| US11942507B2 (en) | 2020-03-11 | 2024-03-26 | Lumileds Llc | Light emitting diode devices |
| US11735695B2 (en) * | 2020-03-11 | 2023-08-22 | Lumileds Llc | Light emitting diode devices with current spreading layer |
| US11848402B2 (en) | 2020-03-11 | 2023-12-19 | Lumileds Llc | Light emitting diode devices with multilayer composite film including current spreading layer |
| US11569415B2 (en) | 2020-03-11 | 2023-01-31 | Lumileds Llc | Light emitting diode devices with defined hard mask opening |
| CN113793887B (zh) * | 2021-08-24 | 2025-03-25 | 天津三安光电有限公司 | Led外延结构及其制备方法、led芯片及其制备方法 |
| CN116978999B (zh) * | 2023-09-22 | 2024-01-02 | 南昌凯捷半导体科技有限公司 | 一种电流限域Micro-LED芯片及其制作方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6426518B1 (en) | 1999-01-05 | 2002-07-30 | Rohm Co., Ltd. | Semiconductor light emitting device |
| DE102007022947A1 (de) * | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| DE102007023878A1 (de) * | 2007-05-23 | 2008-11-27 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
| DE102008010296A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | LED mit Stromaufweitungsschicht |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPS51149784A (en) | 1975-06-17 | 1976-12-22 | Matsushita Electric Ind Co Ltd | Solid state light emission device |
| JPS52124885A (en) | 1976-04-12 | 1977-10-20 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device |
| NZ201460A (en) | 1981-08-17 | 1986-11-12 | Allware Agencies Ltd | Multipurpose microprocessor controlled heating and cooling fan |
| US4901330A (en) * | 1988-07-20 | 1990-02-13 | Amoco Corporation | Optically pumped laser |
| JP3290672B2 (ja) | 1990-08-20 | 2002-06-10 | 株式会社東芝 | 半導体発光ダイオード |
| JPH07307489A (ja) | 1994-05-13 | 1995-11-21 | Toshiba Corp | 半導体発光素子及びその製造方法 |
| JP3797748B2 (ja) | 1997-05-30 | 2006-07-19 | シャープ株式会社 | 発光ダイオードアレイ |
| JP2000101133A (ja) | 1998-09-21 | 2000-04-07 | Hitachi Cable Ltd | 発光素子用エピタキシャルウェハ及びその製造方法 |
| JP2000307185A (ja) | 1999-04-20 | 2000-11-02 | Rohm Co Ltd | 半導体発光素子およびその製法 |
| JP2001077411A (ja) | 1999-08-31 | 2001-03-23 | Oki Electric Ind Co Ltd | 発光ダイオードアレイおよびその製造方法 |
| US6424669B1 (en) * | 1999-10-29 | 2002-07-23 | E20 Communications, Inc. | Integrated optically pumped vertical cavity surface emitting laser |
| JP4773597B2 (ja) | 1999-12-24 | 2011-09-14 | ローム株式会社 | 半導体発光素子 |
| US20020017652A1 (en) | 2000-08-08 | 2002-02-14 | Stefan Illek | Semiconductor chip for optoelectronics |
| JP2002190619A (ja) | 2000-12-22 | 2002-07-05 | Toshiba Corp | 半導体発光素子及びその製造方法 |
| JP3814151B2 (ja) * | 2001-01-31 | 2006-08-23 | 信越半導体株式会社 | 発光素子 |
| US6555405B2 (en) * | 2001-03-22 | 2003-04-29 | Uni Light Technology, Inc. | Method for forming a semiconductor device having a metal substrate |
| US6618418B2 (en) * | 2001-11-15 | 2003-09-09 | Xerox Corporation | Dual III-V nitride laser structure with reduced thermal cross-talk |
| US20040021142A1 (en) | 2002-07-30 | 2004-02-05 | Li-Hsin Kuo | Light emitting diode device |
| US7041529B2 (en) * | 2002-10-23 | 2006-05-09 | Shin-Etsu Handotai Co., Ltd. | Light-emitting device and method of fabricating the same |
| JP2004281559A (ja) | 2003-03-13 | 2004-10-07 | Toshiba Corp | 半導体発光素子 |
| JP3788444B2 (ja) * | 2003-03-31 | 2006-06-21 | 日立電線株式会社 | 発光ダイオード及びその製造方法 |
| JP4178410B2 (ja) | 2003-11-26 | 2008-11-12 | サンケン電気株式会社 | 半導体発光素子 |
| JP2005276899A (ja) | 2004-03-23 | 2005-10-06 | Shin Etsu Handotai Co Ltd | 発光素子 |
| US7512167B2 (en) * | 2004-09-24 | 2009-03-31 | Sanyo Electric Co., Ltd. | Integrated semiconductor laser device and method of fabricating the same |
| DE102005029272A1 (de) * | 2005-03-31 | 2006-10-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip und Verfahren zur Herstellung eines Halbleiterkörpers für einen derartigen Halbleiterchip |
| JP4830356B2 (ja) | 2005-06-08 | 2011-12-07 | ソニー株式会社 | 半導体発光素子及び半導体発光装置 |
| US7368759B2 (en) * | 2005-09-30 | 2008-05-06 | Hitachi Cable, Ltd. | Semiconductor light-emitting device |
| JP4320653B2 (ja) | 2005-09-30 | 2009-08-26 | 日立電線株式会社 | 半導体発光素子 |
| JP2007103725A (ja) | 2005-10-05 | 2007-04-19 | Toshiba Corp | 半導体発光装置 |
| KR100849826B1 (ko) * | 2007-03-29 | 2008-07-31 | 삼성전기주식회사 | 발광소자 및 이를 포함하는 패키지 |
| KR100891761B1 (ko) * | 2007-10-19 | 2009-04-07 | 삼성전기주식회사 | 반도체 발광소자, 그의 제조방법 및 이를 이용한 반도체발광소자 패키지 |
| DE102010014667A1 (de) * | 2010-04-12 | 2011-10-13 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip mit Stromaufweitungsschicht |
-
2010
- 2010-04-12 DE DE102010014667A patent/DE102010014667A1/de not_active Withdrawn
-
2011
- 2011-04-08 WO PCT/EP2011/055566 patent/WO2011128277A1/de not_active Ceased
- 2011-04-08 KR KR1020127029623A patent/KR20130060189A/ko not_active Withdrawn
- 2011-04-08 CN CN201180018587.3A patent/CN102834937B/zh active Active
- 2011-04-08 CN CN201510504954.0A patent/CN105206731B/zh active Active
- 2011-04-08 EP EP16181773.9A patent/EP3131127B1/de active Active
- 2011-04-08 JP JP2013504213A patent/JP5943904B2/ja active Active
- 2011-04-08 US US13/640,037 patent/US20130126920A1/en not_active Abandoned
- 2011-04-08 EP EP11714027.7A patent/EP2559076B1/de active Active
-
2015
- 2015-08-19 US US14/830,616 patent/US9853188B2/en active Active
- 2015-10-20 JP JP2015206284A patent/JP6124973B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6426518B1 (en) | 1999-01-05 | 2002-07-30 | Rohm Co., Ltd. | Semiconductor light emitting device |
| DE102007022947A1 (de) * | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen |
| DE102007023878A1 (de) * | 2007-05-23 | 2008-11-27 | Osram Opto Semiconductors Gmbh | Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips |
| DE102008010296A1 (de) * | 2007-11-30 | 2009-06-04 | Osram Opto Semiconductors Gmbh | LED mit Stromaufweitungsschicht |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014114524A1 (de) * | 2013-01-28 | 2014-07-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer halbleiterchip mit einer ald-schicht verkapselt und entsprechendes verfahren zur herstellung |
| US9761770B2 (en) | 2013-01-28 | 2017-09-12 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip encapsulated with an ALD layer and corresponding method for production |
| EP2903027A1 (de) * | 2014-01-30 | 2015-08-05 | AZUR SPACE Solar Power GmbH | LED-Halbleiterbauelement |
| US9299886B2 (en) | 2014-01-30 | 2016-03-29 | Azur Space Solar Power Gmbh | LED semiconductor component |
| DE102015011635A1 (de) | 2015-09-11 | 2017-03-16 | Azur Space Solar Power Gmbh | lnfrarot-LED |
| US10211370B2 (en) | 2015-09-11 | 2019-02-19 | Azur Space Solar Power Gmbh | Infrared LED |
| DE102015011635B4 (de) * | 2015-09-11 | 2020-10-08 | Azur Space Solar Power Gmbh | lnfrarot-LED |
| DE102015118041A1 (de) * | 2015-10-22 | 2017-04-27 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip und Verfahren zur Herstellung eines Leuchtdiodenchips |
| US10283676B2 (en) | 2015-10-22 | 2019-05-07 | Osram Opto Semiconductors Gmbh | Light-emitting diode chip with one of a mirror layer and an adhesion-promoting layer for high efficiency and long service life |
| DE102015118041B4 (de) * | 2015-10-22 | 2026-01-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016048785A (ja) | 2016-04-07 |
| CN102834937B (zh) | 2015-08-26 |
| JP5943904B2 (ja) | 2016-07-05 |
| US9853188B2 (en) | 2017-12-26 |
| US20130126920A1 (en) | 2013-05-23 |
| CN102834937A (zh) | 2012-12-19 |
| CN105206731A (zh) | 2015-12-30 |
| JP2013524547A (ja) | 2013-06-17 |
| EP3131127A1 (de) | 2017-02-15 |
| EP2559076B1 (de) | 2016-09-21 |
| KR20130060189A (ko) | 2013-06-07 |
| WO2011128277A1 (de) | 2011-10-20 |
| US20150357516A1 (en) | 2015-12-10 |
| CN105206731B (zh) | 2018-01-19 |
| JP6124973B2 (ja) | 2017-05-10 |
| EP3131127B1 (de) | 2018-01-31 |
| EP2559076A1 (de) | 2013-02-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
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