DE102009058962B4 - Verfahren und Vorrichtung zum Behandeln von Substraten - Google Patents

Verfahren und Vorrichtung zum Behandeln von Substraten Download PDF

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Publication number
DE102009058962B4
DE102009058962B4 DE102009058962A DE102009058962A DE102009058962B4 DE 102009058962 B4 DE102009058962 B4 DE 102009058962B4 DE 102009058962 A DE102009058962 A DE 102009058962A DE 102009058962 A DE102009058962 A DE 102009058962A DE 102009058962 B4 DE102009058962 B4 DE 102009058962B4
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DE
Germany
Prior art keywords
radiation
substrate
liquid
contraption
radiation source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102009058962A
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German (de)
English (en)
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DE102009058962A1 (de
Inventor
Uwe Dietze
Dr. Dress Peter
Dr. Sing Sherjang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUSS MicroTec Photomask Equipment GmbH and Co KG
Original Assignee
SUSS MicroTec Photomask Equipment GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUSS MicroTec Photomask Equipment GmbH and Co KG filed Critical SUSS MicroTec Photomask Equipment GmbH and Co KG
Priority to SG10201407169UA priority Critical patent/SG10201407169UA/en
Priority to PCT/EP2010/001629 priority patent/WO2011054405A2/en
Priority to EP10710543.9A priority patent/EP2496367B1/en
Priority to US13/505,385 priority patent/US9662684B2/en
Priority to KR1020127014173A priority patent/KR20120101427A/ko
Priority to CN201080050483.6A priority patent/CN102791391B/zh
Priority to HK13102212.3A priority patent/HK1175141B/xx
Priority to CA2778288A priority patent/CA2778288C/en
Priority to JP2012537306A priority patent/JP5766197B2/ja
Publication of DE102009058962A1 publication Critical patent/DE102009058962A1/de
Application granted granted Critical
Publication of DE102009058962B4 publication Critical patent/DE102009058962B4/de
Priority to US15/598,344 priority patent/US20170320108A1/en
Priority to US15/598,361 priority patent/US10265739B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B6/00—Cleaning by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Physical Water Treatments (AREA)
DE102009058962A 2009-11-03 2009-12-18 Verfahren und Vorrichtung zum Behandeln von Substraten Active DE102009058962B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
HK13102212.3A HK1175141B (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates
EP10710543.9A EP2496367B1 (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates
US13/505,385 US9662684B2 (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates
KR1020127014173A KR20120101427A (ko) 2009-11-03 2010-03-15 기판을 처리하기 위한 방법 및 장치
CN201080050483.6A CN102791391B (zh) 2009-11-03 2010-03-15 处理基片的方法和装置
CA2778288A CA2778288C (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates
SG10201407169UA SG10201407169UA (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates
JP2012537306A JP5766197B2 (ja) 2009-11-03 2010-03-15 基板を処理するための方法及び装置
PCT/EP2010/001629 WO2011054405A2 (en) 2009-11-03 2010-03-15 Method and apparatus for treating substrates
US15/598,344 US20170320108A1 (en) 2009-11-03 2017-05-18 Method and apparatus for treating substrates
US15/598,361 US10265739B2 (en) 2009-11-03 2017-05-18 Method and apparatus for treating substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25763309P 2009-11-03 2009-11-03
US61/257,633 2009-11-03

Publications (2)

Publication Number Publication Date
DE102009058962A1 DE102009058962A1 (de) 2011-05-05
DE102009058962B4 true DE102009058962B4 (de) 2012-12-27

Family

ID=43828929

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102009058962A Active DE102009058962B4 (de) 2009-11-03 2009-12-18 Verfahren und Vorrichtung zum Behandeln von Substraten

Country Status (9)

Country Link
US (3) US9662684B2 (https=)
EP (1) EP2496367B1 (https=)
JP (1) JP5766197B2 (https=)
KR (1) KR20120101427A (https=)
CN (1) CN102791391B (https=)
CA (1) CA2778288C (https=)
DE (1) DE102009058962B4 (https=)
SG (1) SG10201407169UA (https=)
WO (1) WO2011054405A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108816870A (zh) * 2018-04-08 2018-11-16 苏州珮凯科技有限公司 半导体8寸晶元制造薄膜制程的WxZ工艺的陶瓷环状零部件再生方法
RU2680112C1 (ru) * 2015-08-27 2019-02-15 Зюсс Микротек Фотомаск Эквипмент Гмбх Унд Ко.Кг Устройство для нанесения жидкой среды, подвергаемой ультрафиолетовому облучению, на подложку

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JP2013045961A (ja) * 2011-08-25 2013-03-04 Dainippon Screen Mfg Co Ltd 基板洗浄方法、基板洗浄液および基板処理装置
DE102012008220A1 (de) * 2012-04-25 2013-10-31 Süss Microtec Photomask Equipment Gmbh & Co. Kg Verfahren zum Reinigen von Fotomasken unter Verwendung von Megaschall
US9339853B2 (en) 2012-12-04 2016-05-17 The Boeing Company Surface materials for decontamination with decontaminants
US8764905B1 (en) * 2013-03-14 2014-07-01 Intel Corporation Cleaning organic residues from EUV optics and masks
CN103691714B (zh) * 2013-12-19 2015-12-02 合肥京东方光电科技有限公司 一种清洗装置和清洗方法
US9857680B2 (en) 2014-01-14 2018-01-02 Taiwan Semiconductor Manufacturing Company, Ltd. Cleaning module, cleaning apparatus and method of cleaning photomask
JP6357319B2 (ja) * 2014-02-17 2018-07-11 株式会社プレテック 被洗浄基板の洗浄方法及び洗浄装置
CN104007610B (zh) * 2014-06-12 2018-03-06 深圳市华星光电技术有限公司 掩模版的清洗方法及装置
KR102296739B1 (ko) * 2014-10-27 2021-09-01 삼성전자 주식회사 포토마스크용 세정 조성물을 이용한 집적회로 소자 제조 방법
DE102015011177B4 (de) 2015-08-27 2017-09-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
DE102015011228B4 (de) * 2015-08-27 2017-06-14 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
US11358172B2 (en) * 2015-09-24 2022-06-14 Suss Microtec Photomask Equipment Gmbh & Co. Kg Method for treating substrates with an aqueous liquid medium exposed to UV-radiation
US9966266B2 (en) 2016-04-25 2018-05-08 United Microelectronics Corp. Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
KR101961326B1 (ko) 2016-10-19 2019-07-18 세메스 주식회사 기판을 처리하는 장치의 부품 세정 방법 및 장치
US10416575B2 (en) * 2016-11-16 2019-09-17 Suss Microtec Photomask Equipment Gmbh & Co. Kg Apparatus and method for cleaning a partial area of a substrate
DE102017203351B4 (de) * 2017-03-01 2021-08-05 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
JP2018163980A (ja) 2017-03-24 2018-10-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2017113753A (ja) * 2017-03-30 2017-06-29 株式会社トクヤマ 洗浄方法および洗浄装置
CN107203094B (zh) * 2017-07-03 2020-07-24 京东方科技集团股份有限公司 掩膜版清理装置及方法
CN108380569A (zh) * 2018-03-02 2018-08-10 常州瑞择微电子科技有限公司 高浓度oh自由基发生装置
US10896824B2 (en) * 2018-12-14 2021-01-19 Tokyo Electron Limited Roughness reduction methods for materials using illuminated etch solutions
US12112959B2 (en) 2018-09-04 2024-10-08 Tokyo Electron Limited Processing systems and platforms for roughness reduction of materials using illuminated etch solutions
CN110112084A (zh) * 2019-05-22 2019-08-09 长江存储科技有限责任公司 半导体器件清洗装置
WO2021001092A1 (en) * 2019-07-01 2021-01-07 Asml Netherlands B.V. Surface treatment apparatus and method for surface treatment of patterning devices and other substrates
CN111906093A (zh) * 2020-07-15 2020-11-10 常州瑞择微电子科技有限公司 一种大面积光子发生喷头
CN112435938A (zh) * 2020-11-11 2021-03-02 深圳市华星光电半导体显示技术有限公司 基板清洗设备及基板清洗方法
US11798799B2 (en) * 2021-08-09 2023-10-24 Applied Materials, Inc. Ultraviolet and ozone clean system

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DE19825033A1 (de) * 1997-10-09 1999-04-22 Mitsubishi Electric Corp System zum Behandeln von Halbleitersubstraten und Behandlungsverfahren von Halbleitersubstraten
US20020000019A1 (en) * 2000-06-29 2002-01-03 Park Yong Seok Multi functional cleaning module of manufacturing apparatus for flat panel display and cleaning apparatus using the same
US20060207629A1 (en) * 2004-12-16 2006-09-21 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
JP2008108997A (ja) * 2006-10-27 2008-05-08 Shibuya Kogyo Co Ltd 洗浄装置
US20080113518A1 (en) * 2003-03-25 2008-05-15 Renesas Technology Corp. Wet etching method using ultraviolet light and method of manufacturing semiconductor device
WO2008107933A1 (ja) * 2007-03-07 2008-09-12 Fujitsu Limited 洗浄装置および洗浄方法

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JP4038557B2 (ja) 2002-04-16 2008-01-30 リアライズ・アドバンストテクノロジ株式会社 レジスト除去装置及びレジスト除去方法
JP5140916B2 (ja) * 2005-10-07 2013-02-13 富士通株式会社 光化学処理装置及び光化学処理方法
US20070093406A1 (en) * 2005-10-24 2007-04-26 Omoregie Henryson Novel cleaning process for masks and mask blanks
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DE19825033A1 (de) * 1997-10-09 1999-04-22 Mitsubishi Electric Corp System zum Behandeln von Halbleitersubstraten und Behandlungsverfahren von Halbleitersubstraten
US20020000019A1 (en) * 2000-06-29 2002-01-03 Park Yong Seok Multi functional cleaning module of manufacturing apparatus for flat panel display and cleaning apparatus using the same
US20080113518A1 (en) * 2003-03-25 2008-05-15 Renesas Technology Corp. Wet etching method using ultraviolet light and method of manufacturing semiconductor device
US20060207629A1 (en) * 2004-12-16 2006-09-21 Sematech, Inc. Method and apparatus for an in-situ ultraviolet cleaning tool
JP2008108997A (ja) * 2006-10-27 2008-05-08 Shibuya Kogyo Co Ltd 洗浄装置
WO2008107933A1 (ja) * 2007-03-07 2008-09-12 Fujitsu Limited 洗浄装置および洗浄方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2680112C1 (ru) * 2015-08-27 2019-02-15 Зюсс Микротек Фотомаск Эквипмент Гмбх Унд Ко.Кг Устройство для нанесения жидкой среды, подвергаемой ультрафиолетовому облучению, на подложку
CN108816870A (zh) * 2018-04-08 2018-11-16 苏州珮凯科技有限公司 半导体8寸晶元制造薄膜制程的WxZ工艺的陶瓷环状零部件再生方法
CN108816870B (zh) * 2018-04-08 2021-05-25 苏州珮凯科技有限公司 半导体8寸晶元制造薄膜制程的WxZ工艺的陶瓷环状零部件再生方法

Also Published As

Publication number Publication date
CA2778288C (en) 2016-01-19
DE102009058962A1 (de) 2011-05-05
EP2496367B1 (en) 2016-02-10
JP2013510332A (ja) 2013-03-21
SG10201407169UA (en) 2014-12-30
JP5766197B2 (ja) 2015-08-19
CN102791391A (zh) 2012-11-21
CA2778288A1 (en) 2011-05-12
US9662684B2 (en) 2017-05-30
US20170320108A1 (en) 2017-11-09
US20170252781A1 (en) 2017-09-07
US20120211024A1 (en) 2012-08-23
EP2496367A2 (en) 2012-09-12
US10265739B2 (en) 2019-04-23
HK1175141A1 (zh) 2013-06-28
WO2011054405A3 (en) 2012-06-28
WO2011054405A2 (en) 2011-05-12
KR20120101427A (ko) 2012-09-13
CN102791391B (zh) 2016-05-25

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