DE102008026974A1 - Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene - Google Patents
Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene Download PDFInfo
- Publication number
- DE102008026974A1 DE102008026974A1 DE102008026974A DE102008026974A DE102008026974A1 DE 102008026974 A1 DE102008026974 A1 DE 102008026974A1 DE 102008026974 A DE102008026974 A DE 102008026974A DE 102008026974 A DE102008026974 A DE 102008026974A DE 102008026974 A1 DE102008026974 A1 DE 102008026974A1
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- gas
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- 238000000034 method Methods 0.000 title claims abstract description 75
- 238000000151 deposition Methods 0.000 title description 11
- 239000007789 gas Substances 0.000 claims abstract description 180
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000012159 carrier gas Substances 0.000 claims abstract description 41
- 238000000197 pyrolysis Methods 0.000 claims abstract description 31
- 238000000354 decomposition reaction Methods 0.000 claims abstract description 26
- 239000007858 starting material Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 18
- 230000008021 deposition Effects 0.000 claims abstract description 13
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims abstract description 6
- 238000001704 evaporation Methods 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims description 33
- 239000000539 dimer Substances 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 9
- 238000005496 tempering Methods 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 230000008014 freezing Effects 0.000 claims 1
- 238000007710 freezing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 229920000052 poly(p-xylylene) Polymers 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000012071 phase Substances 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- VRBFTYUMFJWSJY-UHFFFAOYSA-N 28804-46-8 Chemical compound ClC1CC(C=C2)=CC=C2C(Cl)CC2=CC=C1C=C2 VRBFTYUMFJWSJY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/60—Deposition of organic layers from vapour phase
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008026974A DE102008026974A1 (de) | 2008-06-03 | 2008-06-03 | Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene |
| CN200980120900.7A CN102056679B (zh) | 2008-06-03 | 2009-06-03 | 聚对苯二亚甲基或聚取代的对苯二亚甲基薄层的沉积方法和装置 |
| PCT/EP2009/056768 WO2009147156A1 (de) | 2008-06-03 | 2009-06-03 | Verfahren und vorrichtung zum abscheiden dünner schichten aus polymeren para-xylylene oder substituiertem para-xylylene |
| TW098118342A TWI463031B (zh) | 2008-06-03 | 2009-06-03 | 聚對二甲苯或經取代之對二甲苯薄膜的沉積方法及裝置 |
| EP09757537.7A EP2293883B1 (de) | 2008-06-03 | 2009-06-03 | Verfahren und vorrichtung zum abscheiden dünner schichten aus polymeren para-xylylene oder substituiertem para-xylylene |
| JP2011512105A JP2011522130A (ja) | 2008-06-03 | 2009-06-03 | 重合パラキシリレンまたは置換パラキシリレンの薄い層を堆積させるための堆積方法および堆積装置 |
| US12/995,170 US20110293832A1 (en) | 2008-06-03 | 2009-06-03 | Method and apparatus for depositing thin layers of polymeric para-xylylene or substituted para-xylylene |
| KR1020107029891A KR101967778B1 (ko) | 2008-06-03 | 2009-06-03 | 폴리머 파라-자일릴렌 또는 치환된 파라-자일릴렌의 얇은 층을 증착시키기 위한 방법 및 장치 |
| RU2010154436/05A RU2481901C2 (ru) | 2008-06-03 | 2009-06-03 | Способ и устройство осаждения тонких слоев полипараксилилена или замещенного полипараксилилена |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008026974A DE102008026974A1 (de) | 2008-06-03 | 2008-06-03 | Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102008026974A1 true DE102008026974A1 (de) | 2009-12-10 |
Family
ID=41203865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102008026974A Withdrawn DE102008026974A1 (de) | 2008-06-03 | 2008-06-03 | Verfahren und Vorrichtung zum Abscheiden dünner Schichten aus polymeren Para-Xylylene oder substituiertem Para-Xylylene |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20110293832A1 (https=) |
| EP (1) | EP2293883B1 (https=) |
| JP (1) | JP2011522130A (https=) |
| KR (1) | KR101967778B1 (https=) |
| CN (1) | CN102056679B (https=) |
| DE (1) | DE102008026974A1 (https=) |
| RU (1) | RU2481901C2 (https=) |
| TW (1) | TWI463031B (https=) |
| WO (1) | WO2009147156A1 (https=) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010000447A1 (de) | 2010-02-17 | 2011-08-18 | Aixtron Ag, 52134 | Beschichtungsvorrichtung sowie Verfahren zum Betrieb einer Beschichtungsvorrichtung mit einer Schirmplatte |
| WO2011101361A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Se | Gasmischer für dampfabscheidung |
| DE102010000480A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zum Abscheiden einer organischen Schicht, insbesondere einer Polymerschicht mit einem Aerosolerzeuger sowie ein hierzu geeigneter Aerosolerzeuger |
| DE102010010819A1 (de) * | 2010-03-10 | 2011-09-15 | Osram Opto Semiconductors Gmbh | Verfahren und Vorrichtung zur Herstellung einer Parylen-Beschichtung |
| CN114277359A (zh) * | 2021-12-28 | 2022-04-05 | 新美光(苏州)半导体科技有限公司 | 进气管道、化学气相沉积炉及向其通入前驱体的方法 |
| WO2024047216A1 (de) * | 2022-09-02 | 2024-03-07 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e. V. | Verfahren und vorrichtung zur herstellung einer tragstruktur, tragstruktur und optisches gerät mit einer tragstruktur |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
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| RU2461429C2 (ru) * | 2010-09-03 | 2012-09-20 | Российская Федерация, от имени которой выступает Министерство образования и науки РФ (Минобрнаука РФ) | Способ получения пленок полипараксилилена и его производных |
| TWI427839B (zh) * | 2010-12-03 | 2014-02-21 | Ind Tech Res Inst | 薄膜圖案的沉積裝置與方法 |
| EP2702184B1 (en) * | 2011-04-29 | 2018-12-05 | Applied Materials, Inc. | Gas system for reactive deposition process |
| DE102011051261A1 (de) * | 2011-06-22 | 2012-12-27 | Aixtron Se | Verfahren und Vorrichtung zum Abscheiden von OLEDs insbesondere Verdampfungsvorrichtung dazu |
| TWI458843B (zh) | 2011-10-06 | 2014-11-01 | Ind Tech Res Inst | 蒸鍍裝置與有機薄膜的形成方法 |
| US9238865B2 (en) * | 2012-02-06 | 2016-01-19 | Asm Ip Holding B.V. | Multiple vapor sources for vapor deposition |
| EP2828004B1 (en) * | 2012-03-23 | 2019-11-20 | hZo, Inc. | Apparatuses, systems and methods for applying protective coatings to electronic device assemblies |
| JP5953906B2 (ja) * | 2012-04-26 | 2016-07-20 | 旭硝子株式会社 | 光学素子の成形装置及び成形方法 |
| DE102013101534A1 (de) * | 2013-02-15 | 2014-08-21 | Aixtron Se | Gasverteiler für einen CVD-Reaktor |
| KR102150625B1 (ko) * | 2013-03-15 | 2020-10-27 | 삼성디스플레이 주식회사 | 코팅장치 |
| TW201540772A (zh) * | 2014-04-24 | 2015-11-01 | 美樺興業股份有限公司 | 高分子粒子及其製備方法 |
| DE102014115497A1 (de) * | 2014-10-24 | 2016-05-12 | Aixtron Se | Temperierte Gaszuleitung mit an mehreren Stellen eingespeisten Verdünnungsgasströmen |
| KR101709344B1 (ko) * | 2014-12-11 | 2017-03-08 | 한국과학기술원 | 종이기판 및 그 제조방법과 종이기판을 이용하는 센서 및 그 제조방법 |
| US10743421B2 (en) * | 2016-06-17 | 2020-08-11 | Hzo, Inc. | Mixing dimers for moisture resistant materials |
| CN108355855B (zh) * | 2018-03-23 | 2020-05-29 | 德淮半导体有限公司 | 增粘剂涂布装置 |
| GB201814231D0 (en) * | 2018-08-31 | 2018-10-17 | Univ Surrey | Apparatus for forming a poly(p-xylylene) film on a component |
| WO2020251696A1 (en) | 2019-06-10 | 2020-12-17 | Applied Materials, Inc. | Processing system for forming layers |
| US11788190B2 (en) | 2019-07-05 | 2023-10-17 | Asm Ip Holding B.V. | Liquid vaporizer |
| GB201913140D0 (en) * | 2019-09-12 | 2019-10-30 | Ucl Business Plc | Methods and apparatuses for fabricating polymeric conformal coatings, parts coated with polymeric conformal coatings, and optical apparatus |
| US11946136B2 (en) | 2019-09-20 | 2024-04-02 | Asm Ip Holding B.V. | Semiconductor processing device |
| KR102433553B1 (ko) * | 2020-07-30 | 2022-08-18 | 연세대학교 산학협력단 | 폴리머 증착기 및 폴리머 증착 방법 |
| CN115572946B (zh) * | 2022-09-16 | 2024-09-24 | 华为数字能源技术有限公司 | 一种钙钛矿的制备方法、制备设备及光电转换器 |
| CN116394484A (zh) * | 2022-10-12 | 2023-07-07 | 广东三绿科技有限公司 | 提高首层打印成功率的3d打印耗材制备方法 |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US3288728A (en) | 1966-02-18 | 1966-11-29 | Union Carbide Corp | Para-xylylene copolymers |
| US3325628A (en) * | 1966-02-16 | 1967-06-13 | Union Carbide Corp | Vapor generator |
| US3908046A (en) * | 1974-02-25 | 1975-09-23 | Xerox Corp | P-xylene vapor phase polymerization coating of electrostatographic particles |
| US4945856A (en) | 1988-06-23 | 1990-08-07 | Jeffrey Stewart | Parylene deposition chamber |
| US5000113A (en) * | 1986-12-19 | 1991-03-19 | Applied Materials, Inc. | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process |
| US5264039A (en) * | 1992-02-24 | 1993-11-23 | Union Carbide Chemicals & Plastics Technology Corporation | Vapor deposition apparatus |
| US5268033A (en) * | 1991-07-01 | 1993-12-07 | Jeffrey Stewart | Table top parylene deposition chamber |
| US5709753A (en) * | 1995-10-27 | 1998-01-20 | Specialty Coating Sysetms, Inc. | Parylene deposition apparatus including a heated and cooled dimer crucible |
| US5958510A (en) * | 1996-01-08 | 1999-09-28 | Applied Materials, Inc. | Method and apparatus for forming a thin polymer layer on an integrated circuit structure |
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| US6362115B1 (en) * | 1998-12-09 | 2002-03-26 | Applied Materials, Inc. | In-situ generation of p-xylyiene from liquid precursors |
| DE10136858A1 (de) * | 2001-02-15 | 2002-09-05 | Aixtron Ag | Beschichtungsvorrichtung |
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| US6709715B1 (en) * | 1999-06-17 | 2004-03-23 | Applied Materials Inc. | Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds |
| US20060113507A1 (en) * | 2004-10-28 | 2006-06-01 | Teleshov Eduard N | Method of liquid-crystal polymer film production |
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| SU1840423A1 (ru) * | 1982-04-15 | 2007-03-20 | НПО "Астрофизика", Институт неорганической химии СО АН СССР | Способ получения покрытий из металлов |
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-
2008
- 2008-06-03 DE DE102008026974A patent/DE102008026974A1/de not_active Withdrawn
-
2009
- 2009-06-03 JP JP2011512105A patent/JP2011522130A/ja active Pending
- 2009-06-03 US US12/995,170 patent/US20110293832A1/en not_active Abandoned
- 2009-06-03 TW TW098118342A patent/TWI463031B/zh not_active IP Right Cessation
- 2009-06-03 KR KR1020107029891A patent/KR101967778B1/ko not_active Expired - Fee Related
- 2009-06-03 EP EP09757537.7A patent/EP2293883B1/de not_active Not-in-force
- 2009-06-03 RU RU2010154436/05A patent/RU2481901C2/ru not_active IP Right Cessation
- 2009-06-03 WO PCT/EP2009/056768 patent/WO2009147156A1/de not_active Ceased
- 2009-06-03 CN CN200980120900.7A patent/CN102056679B/zh not_active Expired - Fee Related
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010000447A1 (de) | 2010-02-17 | 2011-08-18 | Aixtron Ag, 52134 | Beschichtungsvorrichtung sowie Verfahren zum Betrieb einer Beschichtungsvorrichtung mit einer Schirmplatte |
| WO2011101273A1 (de) | 2010-02-17 | 2011-08-25 | Aixtron Se | Beschichtungsvorrichtung sowie verfahren zum betrieb einer beschichtungsvorrichtung mit einer schirmplatte |
| WO2011101361A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Se | Gasmischer für dampfabscheidung |
| DE102010000480A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zum Abscheiden einer organischen Schicht, insbesondere einer Polymerschicht mit einem Aerosolerzeuger sowie ein hierzu geeigneter Aerosolerzeuger |
| DE102010000479A1 (de) | 2010-02-19 | 2011-08-25 | Aixtron Ag, 52134 | Vorrichtung zur Homogenisierung eines verdampften Aerosols sowie Vorrichtung zum Abscheiden einer organischen Schicht auf einem Substrat mit einer derartigen Homogenisierungseinrichtung |
| DE102010010819A1 (de) * | 2010-03-10 | 2011-09-15 | Osram Opto Semiconductors Gmbh | Verfahren und Vorrichtung zur Herstellung einer Parylen-Beschichtung |
| US8883268B2 (en) | 2010-03-10 | 2014-11-11 | Osram Opto Semiconductors Gmbh | Method and device for producing a parylene coating |
| CN114277359A (zh) * | 2021-12-28 | 2022-04-05 | 新美光(苏州)半导体科技有限公司 | 进气管道、化学气相沉积炉及向其通入前驱体的方法 |
| CN114277359B (zh) * | 2021-12-28 | 2023-11-28 | 新美光(苏州)半导体科技有限公司 | 进气管道、化学气相沉积炉及向其通入前驱体的方法 |
| WO2024047216A1 (de) * | 2022-09-02 | 2024-03-07 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e. V. | Verfahren und vorrichtung zur herstellung einer tragstruktur, tragstruktur und optisches gerät mit einer tragstruktur |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011522130A (ja) | 2011-07-28 |
| EP2293883A1 (de) | 2011-03-16 |
| EP2293883B1 (de) | 2018-03-21 |
| RU2010154436A (ru) | 2012-07-20 |
| TW201009109A (en) | 2010-03-01 |
| CN102056679B (zh) | 2015-01-14 |
| WO2009147156A1 (de) | 2009-12-10 |
| TWI463031B (zh) | 2014-12-01 |
| RU2481901C2 (ru) | 2013-05-20 |
| US20110293832A1 (en) | 2011-12-01 |
| KR101967778B1 (ko) | 2019-08-13 |
| KR20110015661A (ko) | 2011-02-16 |
| CN102056679A (zh) | 2011-05-11 |
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