DE102007041136A1 - LED-Gehäuse - Google Patents

LED-Gehäuse Download PDF

Info

Publication number
DE102007041136A1
DE102007041136A1 DE102007041136A DE102007041136A DE102007041136A1 DE 102007041136 A1 DE102007041136 A1 DE 102007041136A1 DE 102007041136 A DE102007041136 A DE 102007041136A DE 102007041136 A DE102007041136 A DE 102007041136A DE 102007041136 A1 DE102007041136 A1 DE 102007041136A1
Authority
DE
Germany
Prior art keywords
housing
led
led housing
connection
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102007041136A
Other languages
German (de)
English (en)
Inventor
Steffen Dr. Köhler
Stefan GRÖTSCH
Herbert Brunner
Rainer Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Priority to DE102007041136A priority Critical patent/DE102007041136A1/de
Priority to EP08801127.5A priority patent/EP2183794B1/de
Priority to PCT/DE2008/001293 priority patent/WO2009026876A1/de
Priority to CN2008801045110A priority patent/CN101790802B/zh
Priority to CN201210124304.XA priority patent/CN102664219B/zh
Priority to KR1020107006731A priority patent/KR20100047339A/ko
Priority to US12/675,009 priority patent/US8487323B2/en
Priority to JP2010522178A priority patent/JP2010537437A/ja
Priority to TW097131402A priority patent/TW200917533A/zh
Publication of DE102007041136A1 publication Critical patent/DE102007041136A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/113—Resilient sockets co-operating with pins or blades having a rectangular transverse section
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
DE102007041136A 2007-08-30 2007-08-30 LED-Gehäuse Withdrawn DE102007041136A1 (de)

Priority Applications (9)

Application Number Priority Date Filing Date Title
DE102007041136A DE102007041136A1 (de) 2007-08-30 2007-08-30 LED-Gehäuse
EP08801127.5A EP2183794B1 (de) 2007-08-30 2008-08-06 Led-gehäuse
PCT/DE2008/001293 WO2009026876A1 (de) 2007-08-30 2008-08-06 Led-gehäuse
CN2008801045110A CN101790802B (zh) 2007-08-30 2008-08-06 Led壳体
CN201210124304.XA CN102664219B (zh) 2007-08-30 2008-08-06 Led壳体
KR1020107006731A KR20100047339A (ko) 2007-08-30 2008-08-06 Ｌｅｄ 하우징
US12/675,009 US8487323B2 (en) 2007-08-30 2008-08-06 LED housing system
JP2010522178A JP2010537437A (ja) 2007-08-30 2008-08-06 Ｌｅｄケーシング
TW097131402A TW200917533A (en) 2007-08-30 2008-08-18 LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102007041136A DE102007041136A1 (de) 2007-08-30 2007-08-30 LED-Gehäuse

Publications (1)

Publication Number Publication Date
DE102007041136A1 true DE102007041136A1 (de) 2009-03-05

Family

ID=40085583

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102007041136A Withdrawn DE102007041136A1 (de) 2007-08-30 2007-08-30 LED-Gehäuse

Country Status (8)

Country Link
US (1) US8487323B2 (https=)
EP (1) EP2183794B1 (https=)
JP (1) JP2010537437A (https=)
KR (1) KR20100047339A (https=)
CN (2) CN102664219B (https=)
DE (1) DE102007041136A1 (https=)
TW (1) TW200917533A (https=)
WO (1) WO2009026876A1 (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011124689A1 (de) * 2010-04-09 2011-10-13 Ledon Oled Lighting Gmbh & Co. Kg Leuchtmodul und leuchte
WO2012052441A3 (de) * 2010-10-18 2012-07-05 Vossloh-Schwabe Deutschland Gmbh Fassung für eine leuchte mit oled-leuchtmittel
EP2381474A3 (en) * 2010-04-23 2013-10-02 Samsung Electronics Co., Ltd. Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
DE102013226721A1 (de) * 2013-12-19 2015-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit asymmetrischen Trägerarmen
CN108879242A (zh) * 2017-05-12 2018-11-23 中兴通讯股份有限公司 传输线及其发光线缆
US10288268B2 (en) 2010-10-18 2019-05-14 Panasonic Corporation OLED illuminant for a lamp
WO2020038678A1 (de) * 2018-08-21 2020-02-27 Robert Bosch Gmbh GEHÄUSERAHMEN FÜR EIN STEUERGERÄT, WELCHER ZUR ELEKTRISCHEN AUßENKONTAKTIERUNG EINES SCHALTUNGSTRÄGERS DES STEUERGERÄTS GEEIGNET IST
DE112013000768B4 (de) 2012-01-31 2023-11-16 Seoul Semiconductor Co., Ltd. Leuchtdiodeneinheit

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) * 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN101388161A (zh) * 2007-09-14 2009-03-18 科锐香港有限公司 Led表面安装装置和并入有此装置的led显示器
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US7956546B2 (en) * 2009-05-15 2011-06-07 Bridgelux, Inc. Modular LED light bulb
US9285089B2 (en) * 2010-12-21 2016-03-15 Bridgelux, Inc. Automatic electrical connection assembly for light modules
JP5841802B2 (ja) * 2011-10-24 2016-01-13 パナソニックＩｐマネジメント株式会社 照明器具
US8564004B2 (en) * 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US8759847B2 (en) * 2011-12-22 2014-06-24 Bridgelux, Inc. White LED assembly with LED string and intermediate node substrate terminals
US20130175704A1 (en) * 2012-01-05 2013-07-11 Ixys Corporation Discrete power transistor package having solderless dbc to leadframe attach
CN102937270B (zh) * 2012-11-23 2015-01-21 昆山博爱模具开发有限公司 一种led壳体
TWI598665B (zh) * 2013-03-15 2017-09-11 隆達電子股份有限公司 發光元件、長條狀發光元件及其應用
CN103236483A (zh) * 2013-03-15 2013-08-07 达亮电子（苏州）有限公司 发光二极管封装结构及封装方法
CH709337B1 (fr) * 2014-03-04 2016-12-30 Robert Alderton Unité d'éclairage LED et procédé de fabrication d'une telle unité.
JP6190746B2 (ja) * 2014-03-25 2017-08-30 エムテックスマツムラ株式会社 半導体素子実装用中空パッケージ
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
KR102233038B1 (ko) * 2014-07-30 2021-03-30 엘지이노텍 주식회사 광원 모듈
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
JP6484588B2 (ja) 2016-05-19 2019-03-13 日亜化学工業株式会社 発光装置及び発光装置用パッケージ
JP6880725B2 (ja) * 2016-12-27 2021-06-02 日亜化学工業株式会社 発光装置
RU172080U1 (ru) * 2017-01-09 2017-06-28 федеральное государственное бюджетное образовательное учреждение высшего образования "Новгородский государственный университет имени Ярослава Мудрого" Корпус светодиода для поверхностного монтажа

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device
JP2003179264A (ja) * 2001-12-10 2003-06-27 Nobuyoshi Imashiro Ｌｅｄの連続接続コネクタおよびその製造方法
US20040227146A1 (en) * 2003-05-14 2004-11-18 Jiahn-Chang Wu Solderless connection in LED module
DE112004001108T5 (de) * 2003-06-20 2006-10-26 Yazaki Corp. LED-Beleuchtungseinrichtung

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2927534A1 (de) 1979-07-07 1981-01-08 Bayer Ag Optisch reine heterocyclische aminosaeuren, verfahren zu ihrer herstellung und ihre verwendung
JPS5612368U (https=) * 1979-07-10 1981-02-02
US4423465A (en) * 1981-09-30 1983-12-27 Teng Ching Weng Combination electronic circuit element with multidirectionally adjustable joints
JPS6153807A (ja) 1984-08-23 1986-03-17 Toshiba Corp 電流源回路
JPS6346971Y2 (https=) * 1984-09-13 1988-12-05
JPS61195076A (ja) 1985-02-25 1986-08-29 Nec Corp フアクシミリ送信機
JPH083024Y2 (ja) * 1985-05-27 1996-01-29 タキロン株式会社 発光体素子保持ブロック
US4667277A (en) * 1985-09-20 1987-05-19 General Instrument Corporation Indicator lamp assembly
JPS63138537A (ja) * 1986-11-29 1988-06-10 Toshiba Corp 発光装置
DE19818402A1 (de) 1998-04-24 1999-10-28 Horn Hannes Schulze Einrichtung für Beleuchtungszwecke
DE19853424A1 (de) 1998-10-27 2000-06-08 Friedrich Hans Josef Leuchtdiode mit besonderen Fähigkeiten / Baustein - Leuchtdiode
JP3743186B2 (ja) * 1998-12-15 2006-02-08 松下電工株式会社 発光ダイオード
JP2001168400A (ja) * 1999-12-09 2001-06-22 Rohm Co Ltd ケース付チップ型発光装置およびその製造方法
DE10012734C1 (de) * 2000-03-16 2001-09-27 Bjb Gmbh & Co Kg Illuminationsbausatz für Beleuchtungs-, Anzeige- oder Hinweiszwecke sowie Steckverbinder für einen solchen Illuminationsbausatz
CN100338786C (zh) * 2002-06-19 2007-09-19 三垦电气株式会社 半导体发光装置及其制法和半导体发光装置用反射器
DE10242292A1 (de) 2002-09-12 2004-04-01 Sebastian Matthias Flächenlampe
DE10331574A1 (de) * 2003-07-11 2005-02-17 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Leistungshalbleitermodul
DE20311557U1 (de) 2003-07-26 2003-10-16 Neuhorst Paul Heinrich Leuchte für Beleuchtungszwecke
JP4711715B2 (ja) 2005-03-30 2011-06-29 株式会社東芝 半導体発光装置及び半導体発光ユニット
US20060262533A1 (en) 2005-05-18 2006-11-23 Para Light Electronics Co., Ltd. Modular light emitting diode
JP2006344420A (ja) 2005-06-07 2006-12-21 Alps Electric Co Ltd Ｌｅｄランプモジュール
US7230222B2 (en) * 2005-08-15 2007-06-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Calibrated LED light module
JP5033138B2 (ja) 2005-12-16 2012-09-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 相互接続可能な照明モジュールを備えた照明システム
JP2007208203A (ja) * 2006-02-06 2007-08-16 Matsushita Electric Ind Co Ltd 発光光源及び発光システム
US20070184722A1 (en) * 2006-02-07 2007-08-09 Dynatech Action, Inc. Powered modular building block toy
JP2007213881A (ja) 2006-02-08 2007-08-23 Aristo Engineering Pte Ltd 照明装置ユニット、照明装置及び照明装置機構
DE102006018668B4 (de) * 2006-04-21 2013-04-11 Osram Gmbh Modulares Beleuchtungssystem und Beleuchtungsanordnung
US7880283B2 (en) * 2006-04-25 2011-02-01 International Rectifier Corporation High reliability power module
KR100735432B1 (ko) 2006-05-18 2007-07-04 삼성전기주식회사 발광소자 패키지 및 발광소자 패키지 어레이
JP2008159394A (ja) 2006-12-22 2008-07-10 Koha Co Ltd 取付けユニットおよび面状発光装置
US7442070B2 (en) * 2007-02-15 2008-10-28 Super Link Electronics Co., Ltd. Light-emitting cell module
US7633055B2 (en) * 2007-03-08 2009-12-15 Lumination Llc Sealed light emitting diode assemblies including annular gaskets and methods of making same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device
JP2003179264A (ja) * 2001-12-10 2003-06-27 Nobuyoshi Imashiro Ｌｅｄの連続接続コネクタおよびその製造方法
US20040227146A1 (en) * 2003-05-14 2004-11-18 Jiahn-Chang Wu Solderless connection in LED module
DE112004001108T5 (de) * 2003-06-20 2006-10-26 Yazaki Corp. LED-Beleuchtungseinrichtung

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011124689A1 (de) * 2010-04-09 2011-10-13 Ledon Oled Lighting Gmbh & Co. Kg Leuchtmodul und leuchte
EP2381474A3 (en) * 2010-04-23 2013-10-02 Samsung Electronics Co., Ltd. Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
US8638037B2 (en) 2010-04-23 2014-01-28 Samsung Electronics Co., Ltd. Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
US9099332B2 (en) 2010-04-23 2015-08-04 Samsung Electronics Co., Ltd. Lead frame for light emitting device package, light emitting device package, and illumination apparatus employing the light emitting device package
WO2012052441A3 (de) * 2010-10-18 2012-07-05 Vossloh-Schwabe Deutschland Gmbh Fassung für eine leuchte mit oled-leuchtmittel
US10288268B2 (en) 2010-10-18 2019-05-14 Panasonic Corporation OLED illuminant for a lamp
DE112013000768B4 (de) 2012-01-31 2023-11-16 Seoul Semiconductor Co., Ltd. Leuchtdiodeneinheit
DE102013226721A1 (de) * 2013-12-19 2015-06-25 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit asymmetrischen Trägerarmen
US9876154B2 (en) 2013-12-19 2018-01-23 Osram Opto Semiconductors Gmbh Optoelectronic component with asymmetric carrier arms
CN108879242A (zh) * 2017-05-12 2018-11-23 中兴通讯股份有限公司 传输线及其发光线缆
WO2020038678A1 (de) * 2018-08-21 2020-02-27 Robert Bosch Gmbh GEHÄUSERAHMEN FÜR EIN STEUERGERÄT, WELCHER ZUR ELEKTRISCHEN AUßENKONTAKTIERUNG EINES SCHALTUNGSTRÄGERS DES STEUERGERÄTS GEEIGNET IST
US11343925B2 (en) 2018-08-21 2022-05-24 Robert Bosch Gmbh Housing frame for a control unit, which housing frame is suitable for externally electrically contacting a circuit carrier of the control unit

Also Published As

Publication number Publication date
US8487323B2 (en) 2013-07-16
EP2183794A1 (de) 2010-05-12
WO2009026876A1 (de) 2009-03-05
TW200917533A (en) 2009-04-16
CN101790802B (zh) 2012-06-20
EP2183794B1 (de) 2017-04-05
KR20100047339A (ko) 2010-05-07
CN102664219B (zh) 2016-07-06
JP2010537437A (ja) 2010-12-02
CN101790802A (zh) 2010-07-28
CN102664219A (zh) 2012-09-12
US20110186880A1 (en) 2011-08-04

Similar Documents

Publication Publication Date Title
EP2183794B1 (de) Led-gehäuse
DE112006000920B4 (de) LED-Einheit und LED-Beleuchtungslampe, die die LED-Einheit verwendet
EP3167224B1 (de) Halbleiterlampe
EP2198196B1 (de) Lampe
DE102010030702A1 (de) Halbleiterlampe
EP2815177B1 (de) Leuchtmodul
EP1923627A1 (de) Integrierte Ansteuerung von LED-Anordnungen
DE102009056115B4 (de) Retrofit LED-Lampe mit doppelschichtigem Kühlkörper
EP2347639A1 (de) Beleuchtungsvorrichtung mit zwei leiterplatten
DE102007043861A1 (de) Leuchtmodul
EP2732209B1 (de) Leuchtmittel mit wenigstens einer organischen, licht emittierenden diode
EP2815176A1 (de) Leuchtmodul-leiterplatte
WO2016091432A1 (de) Lampe mit treiberplatine und sockel
EP2613079A1 (de) LED-Leuchtmittel
WO2015007904A1 (de) Leuchtvorrichtung mit halbleiterlichtquelle und treiberplatine
DE102010023342A1 (de) Leuchtdiodenanordnung und Leuchtmittel insbesondere mit solch einer Leuchtdiodenanordnung
WO2009115063A1 (de) Anordnung, lampenanordnung und verfahren zum emittieren von licht
EP2927564B1 (de) Leuchteinrichtung für leuchtmittel
DE102012214490A1 (de) Leuchtmodul und Abdeckung davon
DE102010018253A1 (de) Lichtquellenmodul und Lichtquelle
DE102010000738A1 (de) LED-Lampe mit Stiftsockel für Halogenlampen (Bipin)
DE102022002837A1 (de) Beleuchtungsvorrichtung
DE102017103294A1 (de) Optoelektronische leuchtvorrichtung und verfahren zum betreiben einer optoelektronischen leuchtvorrichtung
DE102020133315A1 (de) Optoelektronische vorrichtung, leuchtanordnung und bestückungsgurt
DE102010001974A1 (de) Leuchtmittel sowie Verfahren zu dessen Herstellung

Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
R012 Request for examination validly filed
R012 Request for examination validly filed

Effective date: 20140728

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee