DE102006052753A1 - Wärmeableitmodul und Verfahren zu dessen Herstellung - Google Patents
Wärmeableitmodul und Verfahren zu dessen Herstellung Download PDFInfo
- Publication number
- DE102006052753A1 DE102006052753A1 DE200610052753 DE102006052753A DE102006052753A1 DE 102006052753 A1 DE102006052753 A1 DE 102006052753A1 DE 200610052753 DE200610052753 DE 200610052753 DE 102006052753 A DE102006052753 A DE 102006052753A DE 102006052753 A1 DE102006052753 A1 DE 102006052753A1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- heat dissipation
- dissipation module
- groove
- dissipation plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000003801 milling Methods 0.000 claims description 2
- 238000002788 crimping Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095123535 | 2006-06-29 | ||
| TW95123535A TW200803706A (en) | 2006-06-29 | 2006-06-29 | Heat conduction module and fabrication method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102006052753A1 true DE102006052753A1 (de) | 2008-01-03 |
Family
ID=38777070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE200610052753 Withdrawn DE102006052753A1 (de) | 2006-06-29 | 2006-11-08 | Wärmeableitmodul und Verfahren zu dessen Herstellung |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2008010828A (enrdf_load_stackoverflow) |
| DE (1) | DE102006052753A1 (enrdf_load_stackoverflow) |
| TW (1) | TW200803706A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202008006125U1 (de) * | 2008-05-05 | 2009-11-12 | Ledon Lighting Gmbh | Heatpipe |
| EP2325592A1 (en) * | 2009-10-23 | 2011-05-25 | Cpumate Inc. | Method and fixture for manufacturing coplanar evaporators with multiple heat pipes and evaporator obtained by this method |
| CN113179560A (zh) * | 2021-05-06 | 2021-07-27 | 江苏天宝陶瓷股份有限公司 | 一种用于陶瓷加热器的导热结构 |
| CN114061342A (zh) * | 2020-07-31 | 2022-02-18 | 昇业科技股份有限公司 | 多热管并排型散热模块的制法 |
| EP3909711A4 (en) * | 2019-01-09 | 2022-09-28 | Furukawa Electric Co., Ltd. | HEATING TUBE STRUCTURE, HEAT Sink, PRODUCING METHOD OF HEATING TUBE STRUCTURE AND METHOD OF PRODUCING HEAT Sink |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009270750A (ja) * | 2008-05-05 | 2009-11-19 | Golden Sun News Technics Co Ltd | 放熱器に埋め込んだヒートパイプ蒸発部の平坦化法とヒートパイプ付き放熱器 |
| CN102218487B (zh) * | 2011-03-04 | 2016-01-13 | 东莞汉旭五金塑胶科技有限公司 | 导热座供多热管密合排列之组配方法及其结构 |
| KR200469061Y1 (ko) | 2011-03-28 | 2013-09-13 | 충-시엔 후앙 | 바닥블록이 없는 히트 싱크 |
| JP2015169390A (ja) * | 2014-03-07 | 2015-09-28 | 古河電気工業株式会社 | ヒートパイプの固定構造およびヒートパイプの固定方法 |
| CN112213830A (zh) * | 2019-07-10 | 2021-01-12 | 海思光电子有限公司 | 一种光模块及通信系统 |
| CN114923354B (zh) * | 2022-06-09 | 2025-03-28 | 马虹霞 | 一种热传导转接模块及其应用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5811388A (ja) * | 1981-07-10 | 1983-01-22 | Fujikura Ltd | ヒ−トパイプ用素管の製造方法 |
| JPH03108301U (enrdf_load_stackoverflow) * | 1990-02-21 | 1991-11-07 | ||
| JPH04225790A (ja) * | 1990-12-27 | 1992-08-14 | Furukawa Electric Co Ltd:The | ヒートパイプ式放熱器およびその製造方法 |
| JPH05315781A (ja) * | 1992-05-07 | 1993-11-26 | Fujitsu Ltd | 印刷配線板搭載部品の放熱構造 |
| JP2940363B2 (ja) * | 1993-10-27 | 1999-08-25 | 株式会社ダイフク | ローラ支持構造 |
| JPH0743021U (ja) * | 1993-12-28 | 1995-08-11 | 古河電気工業株式会社 | 電子機器用ヒートパイプ式放熱ユニット |
| JPH10122125A (ja) * | 1996-10-15 | 1998-05-12 | Sumitomo Densetsu Corp | 太陽エネルギー利用設備取付け架台 |
| CN1175239C (zh) * | 1998-01-30 | 2004-11-10 | 株式会社日立制作所 | 热管型冷却装置及其制造方法 |
| JP2001135966A (ja) * | 1999-11-10 | 2001-05-18 | Diamond Electric Mfg Co Ltd | ヒートパイプとプレートの接合方法 |
| TW591363B (en) * | 2001-10-10 | 2004-06-11 | Aavid Thermalloy Llc | Heat collector with mounting plate |
| JP4435524B2 (ja) * | 2003-09-12 | 2010-03-17 | 株式会社 正和 | 冷却板の製造方法 |
| JP2007218439A (ja) * | 2006-02-14 | 2007-08-30 | Sumitomo Light Metal Ind Ltd | ヒートパイプの固定方法 |
-
2006
- 2006-06-29 TW TW95123535A patent/TW200803706A/zh not_active IP Right Cessation
- 2006-11-08 DE DE200610052753 patent/DE102006052753A1/de not_active Withdrawn
-
2007
- 2007-04-18 JP JP2007109422A patent/JP2008010828A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202008006125U1 (de) * | 2008-05-05 | 2009-11-12 | Ledon Lighting Gmbh | Heatpipe |
| EP2325592A1 (en) * | 2009-10-23 | 2011-05-25 | Cpumate Inc. | Method and fixture for manufacturing coplanar evaporators with multiple heat pipes and evaporator obtained by this method |
| EP3909711A4 (en) * | 2019-01-09 | 2022-09-28 | Furukawa Electric Co., Ltd. | HEATING TUBE STRUCTURE, HEAT Sink, PRODUCING METHOD OF HEATING TUBE STRUCTURE AND METHOD OF PRODUCING HEAT Sink |
| CN114061342A (zh) * | 2020-07-31 | 2022-02-18 | 昇业科技股份有限公司 | 多热管并排型散热模块的制法 |
| CN113179560A (zh) * | 2021-05-06 | 2021-07-27 | 江苏天宝陶瓷股份有限公司 | 一种用于陶瓷加热器的导热结构 |
| CN113179560B (zh) * | 2021-05-06 | 2022-07-29 | 江苏天宝陶瓷股份有限公司 | 一种用于陶瓷加热器的导热结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200803706A (en) | 2008-01-01 |
| TWI308052B (enrdf_load_stackoverflow) | 2009-03-21 |
| JP2008010828A (ja) | 2008-01-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| 8139 | Disposal/non-payment of the annual fee |