DE102004057057A1 - Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation - Google Patents

Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation Download PDF

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Publication number
DE102004057057A1
DE102004057057A1 DE200410057057 DE102004057057A DE102004057057A1 DE 102004057057 A1 DE102004057057 A1 DE 102004057057A1 DE 200410057057 DE200410057057 DE 200410057057 DE 102004057057 A DE102004057057 A DE 102004057057A DE 102004057057 A1 DE102004057057 A1 DE 102004057057A1
Authority
DE
Germany
Prior art keywords
substrate
additional module
interface
workstation
substrate workstation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE200410057057
Other languages
German (de)
English (en)
Inventor
Thomas Krieg
Henning Backhauss
Thomas Groos
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Tencor MIE GmbH
Original Assignee
Leica Microsystems CMS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems CMS GmbH filed Critical Leica Microsystems CMS GmbH
Priority to DE200410057057 priority Critical patent/DE102004057057A1/de
Priority to PCT/EP2005/056126 priority patent/WO2006056567A1/fr
Publication of DE102004057057A1 publication Critical patent/DE102004057057A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE200410057057 2004-11-25 2004-11-25 Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation Withdrawn DE102004057057A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE200410057057 DE102004057057A1 (de) 2004-11-25 2004-11-25 Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation
PCT/EP2005/056126 WO2006056567A1 (fr) 2004-11-25 2005-11-21 Station de travail pour substrat et module supplementaire destine a cette derniere

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410057057 DE102004057057A1 (de) 2004-11-25 2004-11-25 Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation

Publications (1)

Publication Number Publication Date
DE102004057057A1 true DE102004057057A1 (de) 2006-06-01

Family

ID=35610236

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200410057057 Withdrawn DE102004057057A1 (de) 2004-11-25 2004-11-25 Substrat-Arbeitsstation und Zusatzmodul für eine Substrat-Arbeitsstation

Country Status (2)

Country Link
DE (1) DE102004057057A1 (fr)
WO (1) WO2006056567A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661326A (ja) * 1992-03-27 1994-03-04 Toshiba Corp 基板処理装置
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
DE10134755A1 (de) * 2001-07-17 2003-02-06 Infineon Technologies Ag Meßanordnung zur Messung einer charakteristischen Abmessung wenigstens einer Struktur auf einem Halbleiterwafer
US20030202178A1 (en) * 2001-09-19 2003-10-30 Olympus Optical Co., Ltd. Semiconductor wafer inspection apparatus
US20040086171A1 (en) * 2002-10-30 2004-05-06 Jun Chung-Sam Apparatus and method for inspecting a substrate
DE10332572A1 (de) * 2003-07-11 2005-02-17 Nanophotonics Ag Fertigungsanlage für Halbleiterbauelemente und Messkammern für Fertigungsanlagen für Halbleiterbauelemente

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020187024A1 (en) * 2001-06-12 2002-12-12 Applied Materials, Inc. Apparatus for storing and moving a carrier
JP2005520321A (ja) * 2001-07-16 2005-07-07 アシスト テクノロジーズ インコーポレイテッド ツールのフロントエンド加工物処理のための統合システム
US7217076B2 (en) * 2001-08-31 2007-05-15 Asyst Technologies, Inc. Semiconductor material handling system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661326A (ja) * 1992-03-27 1994-03-04 Toshiba Corp 基板処理装置
US6420864B1 (en) * 2000-04-13 2002-07-16 Nanophotonics Ag Modular substrate measurement system
DE10134755A1 (de) * 2001-07-17 2003-02-06 Infineon Technologies Ag Meßanordnung zur Messung einer charakteristischen Abmessung wenigstens einer Struktur auf einem Halbleiterwafer
US20030202178A1 (en) * 2001-09-19 2003-10-30 Olympus Optical Co., Ltd. Semiconductor wafer inspection apparatus
US20040086171A1 (en) * 2002-10-30 2004-05-06 Jun Chung-Sam Apparatus and method for inspecting a substrate
DE10332572A1 (de) * 2003-07-11 2005-02-17 Nanophotonics Ag Fertigungsanlage für Halbleiterbauelemente und Messkammern für Fertigungsanlagen für Halbleiterbauelemente

Also Published As

Publication number Publication date
WO2006056567A1 (fr) 2006-06-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: VISTEC SEMICONDUCTOR SYSTEMS GMBH, 35578 WETZLAR,

8130 Withdrawal