DE10028381A1 - Sondenspitzenabschlussvorrichtung für einen leicht änderbaren Durchführungabschluss - Google Patents

Sondenspitzenabschlussvorrichtung für einen leicht änderbaren Durchführungabschluss

Info

Publication number
DE10028381A1
DE10028381A1 DE10028381A DE10028381A DE10028381A1 DE 10028381 A1 DE10028381 A1 DE 10028381A1 DE 10028381 A DE10028381 A DE 10028381A DE 10028381 A DE10028381 A DE 10028381A DE 10028381 A1 DE10028381 A1 DE 10028381A1
Authority
DE
Germany
Prior art keywords
probe tip
circuit
probe
substrate
adapter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10028381A
Other languages
German (de)
English (en)
Inventor
Donald A Whiteman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of DE10028381A1 publication Critical patent/DE10028381A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06766Input circuits therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
DE10028381A 1999-07-29 2000-06-08 Sondenspitzenabschlussvorrichtung für einen leicht änderbaren Durchführungabschluss Withdrawn DE10028381A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/354,759 US6407562B1 (en) 1999-07-29 1999-07-29 Probe tip terminating device providing an easily changeable feed-through termination

Publications (1)

Publication Number Publication Date
DE10028381A1 true DE10028381A1 (de) 2001-03-01

Family

ID=23394800

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10028381A Withdrawn DE10028381A1 (de) 1999-07-29 2000-06-08 Sondenspitzenabschlussvorrichtung für einen leicht änderbaren Durchführungabschluss

Country Status (4)

Country Link
US (1) US6407562B1 (enExample)
JP (1) JP2001066324A (enExample)
DE (1) DE10028381A1 (enExample)
GB (1) GB2352884B (enExample)

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US7015709B2 (en) * 2004-05-12 2006-03-21 Delphi Technologies, Inc. Ultra-broadband differential voltage probes
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US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
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US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
EP1932003A2 (en) 2005-06-13 2008-06-18 Cascade Microtech, Inc. Wideband active-passive differential signal probe
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US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
CN201303164Y (zh) * 2008-07-24 2009-09-02 富士康(昆山)电脑接插件有限公司 射频同轴连接器
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US8593156B2 (en) 2010-11-22 2013-11-26 General Electric Company Sensor assembly and microwave emitter for use in a sensor assembly
US8624603B2 (en) 2010-11-22 2014-01-07 General Electric Company Sensor assembly and methods of adjusting the operation of a sensor
US8531191B2 (en) 2010-11-22 2013-09-10 General Electric Company Sensor assembly and methods of measuring a proximity of a machine component to a sensor
US8854052B2 (en) 2010-11-22 2014-10-07 General Electric Company Sensor assembly and method of measuring the proximity of a machine component to a sensor
US8482456B2 (en) 2010-12-16 2013-07-09 General Electric Company Sensor assembly and method of measuring the proximity of a machine component to an emitter
US8742319B2 (en) 2011-12-13 2014-06-03 General Electric Company Sensor and inspection system deploying an optical conduit
US20130328549A1 (en) * 2012-06-07 2013-12-12 Chung Instrument Electronics Industrial Co., Ltd. Rotating mobile probe and probing rod using the same
CN104122417B (zh) * 2013-04-26 2018-09-25 苏州普源精电科技有限公司 一种一体式探头及具有一体式探头的测试测量仪器
US9188606B2 (en) 2013-04-29 2015-11-17 Keysight Technologies, Inc. Oscilloscope current probe with interchangeable range and sensitivity setting modules
US9417266B2 (en) 2014-01-16 2016-08-16 International Business Machines Corporation Implementing handheld transfer impedance probe
JP6455451B2 (ja) * 2015-03-24 2019-01-23 三菱電機株式会社 同軸プローブ
US10451515B2 (en) * 2016-09-19 2019-10-22 Electro Scan, Inc. Electric field expansion system for low voltage conductivity inspection
US10816431B1 (en) 2017-09-18 2020-10-27 Electro Scan, Inc. Leak detection system for underground access chambers using conductivity
CN111541072B (zh) * 2020-03-31 2021-10-26 深圳三星通信技术研究有限公司 一种测试转接器
US12174243B2 (en) * 2022-12-14 2024-12-24 Tron Future Tech Inc. Probe assembly, system and method for testing rf device of phased array antenna

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Also Published As

Publication number Publication date
US6407562B1 (en) 2002-06-18
JP2001066324A (ja) 2001-03-16
GB2352884B (en) 2003-03-05
GB2352884A (en) 2001-02-07
GB0017053D0 (en) 2000-08-30

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OP8 Request for examination as to paragraph 44 patent law
8130 Withdrawal