CS209193B1 - Přípravek k nanášení pájky na spájené místo - Google Patents
Přípravek k nanášení pájky na spájené místo Download PDFInfo
- Publication number
- CS209193B1 CS209193B1 CS486974A CS486974A CS209193B1 CS 209193 B1 CS209193 B1 CS 209193B1 CS 486974 A CS486974 A CS 486974A CS 486974 A CS486974 A CS 486974A CS 209193 B1 CS209193 B1 CS 209193B1
- Authority
- CS
- Czechoslovakia
- Prior art keywords
- recesses
- solder
- edge
- segments
- tip
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 18
- 238000005476 soldering Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 description 7
- 238000009472 formulation Methods 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating With Molten Metal (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD17747274A DD110784A2 (enrdf_load_html_response) | 1974-03-27 | 1974-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CS209193B1 true CS209193B1 (cs) | 1981-11-30 |
Family
ID=5495164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CS486974A CS209193B1 (cs) | 1974-03-27 | 1974-07-09 | Přípravek k nanášení pájky na spájené místo |
Country Status (3)
| Country | Link |
|---|---|
| CS (1) | CS209193B1 (enrdf_load_html_response) |
| DD (1) | DD110784A2 (enrdf_load_html_response) |
| SU (1) | SU638638A1 (enrdf_load_html_response) |
-
1974
- 1974-03-27 DD DD17747274A patent/DD110784A2/xx unknown
- 1974-07-09 CS CS486974A patent/CS209193B1/cs unknown
- 1974-07-10 SU SU742044503A patent/SU638638A1/ru active
Also Published As
| Publication number | Publication date |
|---|---|
| DD110784A2 (enrdf_load_html_response) | 1975-01-12 |
| SU638638A1 (ru) | 1978-12-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5803340A (en) | Composite solder paste for flip chip bumping | |
| KR100297120B1 (ko) | 범프의형성방법및도금장치 | |
| TW494038B (en) | Method of forming metal bumps | |
| WO2001069990A1 (en) | Bonded structure and electronic circuit board | |
| CN103492112B (zh) | 焊接装置、焊接方法以及所制造的基板及电子部件 | |
| RU2179912C2 (ru) | Способ и устройство повышения стабильности капель в системе разлива расплавленного припоя | |
| DE2842136A1 (de) | Verbesserung der messvorrichtung fuer die bestimmung des aktivsauerstoffgehaltes von metallschmelzen | |
| US3815806A (en) | Desoldering fixture | |
| JPH06125169A (ja) | 予備はんだ法 | |
| US4509994A (en) | Solder composition for high-density circuits | |
| CS209193B1 (cs) | Přípravek k nanášení pájky na spájené místo | |
| JP4892340B2 (ja) | はんだ組成物及びこれを用いたバンプ形成方法 | |
| KR20050062646A (ko) | 땜납 공급 방법 | |
| KR20190126438A (ko) | 솔더 페이스트용 플럭스, 솔더 페이스트, 솔더 페이스트를 사용한 솔더 범프의 형성 방법 및 접합체의 제조 방법 | |
| US4531986A (en) | Solder composition | |
| US11007569B2 (en) | Method for tilt casting and tilt casting device | |
| JPH06305272A (ja) | メタルマスク | |
| EP3923686B1 (en) | Method for forming bump electrode substrate | |
| RU2116173C1 (ru) | Способ пайки деталей из алюминия и его сплавов | |
| JP2007268565A (ja) | 金合金はんだボールの製造方法 | |
| JP2903711B2 (ja) | フラットパッケージの予備半田方法 | |
| JPH0235763A (ja) | 端子ピン付き基板 | |
| JPS5964162A (ja) | はんだ付け方法およびその装置 | |
| JP2002368401A (ja) | フラックス塗布方法およびそれに用いるフラックス塗布装置 | |
| JPH11207493A (ja) | 半田ボールおよびその製造方法。 |