CN2717014Y

CN2717014Y - Silicon slice holder correcting tool of semiconductor thermal technology

Info

Publication number: CN2717014Y
Application number: CN 200420021540
Authority: CN
Inventors: 汪政明
Original assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corp
Current assignee: Shanghai Huahong Grace Semiconductor Manufacturing Corp
Priority date: 2004-04-01
Filing date: 2004-04-01
Publication date: 2005-08-10
Anticipated expiration: 2014-04-01

Abstract

The utility model provides a correcting tool which is mainly applied to the centre point positioning of the silicon slice holder of semiconductor thermal technology. Because that the centre point positioning of the silicon slice holder is mostly detected visually at present is easy to cause error, the utility model provides a correcting tool which can look for the centre point. The tool comprises two sets of measuring flat rulers. The sliding bar movably arranged on the measuring flat ruler can be utilized to calibrate two utmost inner diameters of the object to be measured, and then the crossing point of the two utmost inner diameters is the centre point needed to be positioned.

Description

The silicon chip bearing aligning tool of semiconductor heat technology

Technical field

The utility model relates to a kind of orientation tool, particularly a kind of orientation tool that is used for semiconductor heat technology location silicon chip bearing central point.

Background technology

In semiconductor technology, rapid hot technics (RTP) is a considerable handling procedure, though the difference of itself and traditional hot boiler tube is rapid hot technics and only handles a slice silicon chip at every turn, but because of they can heating and cooling in the extremely short time, therefore treatment effeciency is very fast, and output efficiency outclass the processing of traditional hot boiler tube formula.

In rapid hot technics, silicon chip mainly is to carry out the roasting processing of heat on the silicon chip bearing that is positioned in the reaction chamber, because semiconductor industry has high precision to require to guarantee the quality of finished product to technology, so the position that silicon chip is placed on the bearing also must meet the requirements fully, if silicon chip places center of gravity inequality on the silicon chip bearing, after carrying out the roasting processing of heat, can feasible coat the photoresist layer skewness of silicon chip surface, influence follow-up etching technics, cause the finished product rate to reduce, therefore in semiconductor technology, all can be regularly the technology board be comprised the silicon chip bearing and safeguard and proofread and correct, to guarantee the accuracy of integral device.

With present maintenance correction program for the silicon chip bearing, because of semiconductor technology board equipment all quite expensive, do not injuring the structure that makes the silicon chip bearing and consider reaction chamber integral body, generally do not use the work of proofreading and correct as instruments such as mechanical arms, and check whether conformance with standard of silicon chip bearing in the range estimation mode by operating personnel, therefore foundation because of the artificial visually examine there is no judgement still can produce error at timing but thus.

For solving the above-mentioned disappearance that is caused of proofreading and correct with the artificial visually examine, the utility model proposes a kind of being applied in the semiconductor heat technology in order to proofread and correct the instrument of silicon chip bearing central point, with its easy design but the position that can quick and precisely make whole bearing central point solves above-mentioned disappearance with the auxiliary operation personnel.

Summary of the invention

Main purpose of the present utility model is to provide a kind of and can be used in the semiconductor heat technology, proofreaies and correct the instrument of silicon chip bearing central point, provides operating personnel can make things convenient for correctly the silicon chip bearing is proofreaied and correct.

Another purpose of the present utility model is to provide a kind of instrument that can accurately locate silicon chip bearing central point, to solve the problem that common utilization range estimation mode causes the correction accuracy deficiency.

Another purpose of the present utility model is to provide a kind of easy to operate central point orientation tool, can orient the central point of any circle and square type object fast.

The silicon chip bearing aligning tool of semiconductor heat technology of the present utility model comprises:

Two groups of one first group of measurement ruler and one second group of measurement rulers that constituent components is identical, wherein the measurement ruler of each group comprises a ruler and two slider bars, the both sides of described ruler are provided with scale, and the centre is provided with an elongated slotted eye, each slider bar of described two slider bars is that a square type piece and its down extend the T type structure that a cylinder with flange is constituted, described two slider bars with the flange of described cylinder respectively towards the two ends of described elongated slotted eye to be installed in the described elongated slotted eye, utilize the displacement of described slider bar on described elongated slotted eye to demarcate maximum diameter value position by a determinand.

Be mainly used in the location of central point according to silicon chip bearing aligning tool of the present utility model, utilize two groups to measure the intersection points that rulers are sought the maximum diameter value of determinands, can be easy to orient the central point of described determinand.

The beneficial effects of the utility model are: operating personnel can be made things convenient for correctly the silicon chip bearing is proofreaied and correct, and solved the problem that common utilization range estimation mode causes the correction accuracy deficiency, can also orient the central point of the object of any circle and square type fast.

Description of drawings

Fig. 1 is a structural representation of the present utility model.

Fig. 2 is the measurement ruler structural representation that the utility model comprised.

Fig. 3 is the measurement ruler STRUCTURE DECOMPOSITION schematic diagram that the utility model comprised

Fig. 4 is a structure vertical view of the present utility model.

Fig. 5 is a section of structure of the present utility model.

Label declaration

Measure ruler for 10 first groups

13 rulers

14,15 slider bars

140,150 square type pieces

142,152 flanges

144,154 cylinders

16 elongated slotted eyes

18,19 first cushion blocks

180,190 grooves

Measure ruler for 20 second groups

22 rulers

24,25 slider bars

26 elongated slotted eyes

28,29 second cushion blocks

280,290 grooves

30 objects under test

32 packing rings

34,35 internal diameters

Embodiment

The beneficial effect that further specifies architectural feature of the present utility model and reached below in conjunction with drawings and Examples.

The utility model is a kind of being applied in the semiconductor heat technology in order to proofread and correct the aligning tool of silicon chip bearing, mainly carrying out board when safeguarding in order to improve usually, need by manually with visual detection for the central point of silicon chip bearing, accuracy in calibration is lower, error is easily arranged, therefore the utility model proposes one can utilize two groups of measurement rulers that can calibrate determinand maximum diameter value in order to the aligning tool of centre of location point, and the intersection point of then measured maximum diameter value is the central point of institute desire location.

Fig. 1 is a perspective view of the present utility model, silicon chip bearing aligning tool of the present utility model utilizes two groups of measurement rulers that structure is identical in the use, be respectively first group and measure ruler 10 and second group of measurement ruler 20, because two

measure ruler

10,20 structure is identical, below only measure ruler 10 its structures of explanation with wherein first group, see also Fig. 2 and structural representation and exploded view shown in Figure 3, first group of structure of measuring ruler 10 comprises a ruler 12 and two

slider bars

14,15, have scale in the both sides of ruler 12 with foundation, and be provided with an elongated slotted eye 16 in the centre of ruler 12 as the sign distance; Slider bar 14, the 15th, by a square type piece 140,150 down extend and have flange 142 with it, 152 cylinder 144, the 154 T shape structures that constituted, with two

slider bars

14,15 with cylinder 144,154 downward modes are sheathed on respectively in the elongated slotted eye 16 of ruler 12, and with two

slider bars

14,15 cylinder 144,154 flange surfaces that had 142,152 respectively towards the two ends, the left and right sides of elongated slotted eye 16, the contact jaw that is abutted against the determinand edge when carrying out as measurement, because described cylinder 144,154 flange surface 142,152 mainly as with the contact jaw at determinand edge, therefore, described cylinder 144,154 except need can be installed in the described elongated slotted eye 16, structurally, as triangular prism, the cylinder that quadrangular prism or other have a flange all can.

And the formation that is contained in second group of measurement ruler 20 of the present utility model is identical with above-mentioned first group of measurement ruler 10, please consults Fig. 1 simultaneously, and its constituent components comprises a ruler 22 equally, and is located at elongated slotted eye 26 and two slider bars 24,25 on the ruler 22.

Because the silicon chip bearing that the utility model is mainly used in the semiconductor heat technology is proofreaied and correct usefulness, and the object under test 30 that desire is proofreaied and correct has the design as packing ring 32 usually, it is not a smooth surface, when carrying out, feasible correction measures the accuracy that

ruler

10,20 can't keep balance and then effect correction for two groups, therefore measure the design that ruler 10 more includes

first cushion block

18,19 for first group of the present utility model, measure the design that ruler 20 also includes second cushion block 26,26001 equally for second group.

Measure first cushion block 18 that ruler 10 is comprised for first group, 19 mainly in order to support described ruler 12, at

first cushion block

18,19 belows are provided with a groove that runs through 180,190, can be located at the packing ring 32 on object under test 30 surfaces so that ruler 12 keeps smooth in order to ccontaining, and second group of second cushion block 28 that measurement ruler 20 is comprised, 29, because of considering that first group of measurement ruler 10 and second group of measurement ruler 20 need in operation on the Different Plane in use to avoid the friction between ruler, therefore at

second cushion block

28,29 height design is gone up and

first cushion block

18,19 some difference, measure second cushion block 28 that ruler 20 is comprised for second group, 29 height is a little more than

first cushion block

18,19 add the height of ruler 12, so that this aligning tool is in timing smooth operation more, and at

second cushion block

28,29 lower end is provided with a groove that runs through 280 equally, 290, in order to the packing ring of ccontaining silicon chip bearing.

Because the utility model is mainly in order to locate the central point of silicon chip bearing, re-use in the explanation, please consult Fig. 1 simultaneously, Fig. 4 and Fig. 5, as shown in the figure, the use system of aligning tool of the present utility model measures ruler 10 with first group earlier and cooperates

cushion block

18,19 place on the object under test 30, one slider bar 14 is placed the scale zero place of ruler 12, and make it near the inner wall edge that is connected to described object under test 30, anti-phase another slider bar 15 that is comprised that moves makes it be close proximity to the inner wall edge of described determinand 30 opposite sides equally, and observe pairing scale until obtaining two

slider bars

14,15 apart from greatest measurement, then described measured value is the maximum diameter value 34 of described determinand 30, that is internal diameter, measure ruler 20 across placing described first group of top of measuring ruler 10 with second group in addition, and be located on the mid point of first group of measurement ruler 10 measured maximum diameter value 34 that get, or utilize and move the slider bar 24 that second group of measurement ruler 20 comprised, 25, according to same another internal diameter 35 that takes out described determinand 30 of aforementioned manner, then two measure ruler 10, the 20 measured internal diameters 34 that get, 35 intersection point, that is two elongated slotted eye 16,26 intersection point is the central point of the silicon chip bearing of being asked.

Design of the present utility model is operated easily, can fast the central point of a determinand be oriented, and on measuring operation, except the internal diameter that can measure determinand, also can utilize the external diameter of measuring determinand to carry out the location of central point, and therefore design and utilize the intersection point of two maximum diameter values in the geometry to decide central point, therefore for any symmetrical structure, as structure circular, the square type, all can be used to seek its central point.

The above only is a preferential execution mode of the present utility model, can not only limit the scope that the utility model is implemented with this embodiment.All equal variation or modifications of doing according to the described shape of the utility model application range, structure, feature and spirit still drop in the claim of the present utility model.

Claims

1. the silicon chip bearing aligning tool of a semiconductor heat technology is characterized in that comprising:

2. the silicon chip bearing aligning tool of semiconductor heat technology according to claim 1, it is characterized in that: after demarcating the maximum diameter value position of described determinand with described first group of measurement ruler, measuring ruler with described second group more vertically is across on described first group of measurement ruler, calibrate the maximum diameter value position of described determinand equally, then described first group of measurement ruler and described second group of measurement described elongated slotted eye intersection point place that ruler comprised are the central point of the described determinand of asking.

3. the silicon chip bearing aligning tool of semiconductor heat technology according to claim 1, it is characterized in that: described first group of measurement ruler comprises two first cushion blocks and measures ruler to support described first group, the described first cushion block lower end is provided with a groove that runs through, when the determinand surface was provided with a packing ring, described groove just can ccontaining described packing ring.

4. the silicon chip bearing aligning tool of semiconductor heat technology according to claim 3, it is characterized in that: described second group of measurement ruler comprises two second cushion blocks and measures ruler to support described second group, the described second cushion block lower end is provided with a groove that runs through, when the determinand surface is provided with a packing ring, described groove just can ccontaining described packing ring, smooth when keeping described measurement ruler to measure, and the height of described first cushion block of the aspect ratio of described second cushion block to add the above the first group height of measuring ruler slightly high.

5. the silicon chip bearing aligning tool of semiconductor heat technology according to claim 1 is characterized in that: described cylinder is a corner post.

6. the silicon chip bearing aligning tool of semiconductor heat technology according to claim 1 is characterized in that: described determinand is for circular.

7. the silicon chip bearing aligning tool of semiconductor heat technology according to claim 1 is characterized in that: described determinand is a rectangle.