CN112820686A - Wafer teaching device and teaching method - Google Patents
Wafer teaching device and teaching method Download PDFInfo
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- CN112820686A CN112820686A CN202110256006.5A CN202110256006A CN112820686A CN 112820686 A CN112820686 A CN 112820686A CN 202110256006 A CN202110256006 A CN 202110256006A CN 112820686 A CN112820686 A CN 112820686A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract
The invention provides a wafer teaching device and a wafer teaching method, wherein the wafer teaching device comprises a wafer bearing table, a plurality of supporting pieces, a first sliding groove, a second sliding groove, a first sliding piece corresponding to the first sliding groove and a second sliding piece corresponding to the second sliding groove are arranged on the top surface of the wafer bearing table, a wafer is conveyed to the wafer bearing table along a straight line, the top surface of each supporting piece supports the wafer, the wafer pushes the first sliding piece to move to a first termination position along the first sliding groove from a first initial position and pushes the second sliding piece to move to a second termination position from a second initial position along the second sliding groove, and therefore the positioning position of the wafer on the supporting piece is obtained visually.
Description
Technical Field
The present invention relates to the field of semiconductor technology, and more particularly, to a wafer teaching device and a wafer teaching method.
Background
At present, a manipulator is widely used in the technical field of semiconductor integrated circuit manufacturing, and the manipulator is an important device in a silicon wafer transmission system, is used for storing, fetching and transporting silicon wafers before and after process treatment, and can receive instructions and be accurately positioned to a certain point on a three-dimensional or two-dimensional space for fetching and placing the silicon wafers. When an EFEM-Equipment front-End Module (EFEM-End Module) is installed, Equipment needs to be factory set and tested, wherein the Equipment needs to be factory set and tested, and the Equipment comprises a load port (load port) which is used for measuring levelness and a robot which is used for teaching a wafer to take and place.
At present, when a load port is installed, the installation levelness is roughly ensured mainly by means of plumb and human eye observation, and the problems of low accuracy and low efficiency exist. In the teaching process, the position of the wafer is positioned by two methods, wherein the first method is visual observation, the position accuracy cannot be ensured due to visual observation, secondly, the working efficiency of the visual positioning is low, the long time is consumed, and meanwhile, due to the shielding of the wafer box, the visual observation has certain difficulty. And the second method is to indirectly determine the position of the wafer by measuring the position of the robot finger. Fig. 1 is a schematic diagram illustrating indirect determination of a wafer position in the prior art, which requires at least two to three measurements and continuous adjustment to reach a position that is relatively satisfactory.
The wafer conveying device has the advantages that the wafer conveying device is carried out through visual inspection of operators or through semi-automatic auxiliary equipment, the problem that time is consumed, meanwhile, the precision is low is solved, and the phenomenon that a wafer cannot be conveyed to a specified position or a manipulator collides easily due to the fact that a teaching position is not proper. Furthermore, since production stoppages cause a large economic loss to the production side, it is required that the teaching work be accurately completed in as short a time as possible.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a wafer teaching device and a teaching method.
To achieve the above object, a first aspect of the present invention provides a wafer teaching apparatus comprising: wafer plummer, the top surface of wafer plummer is equipped with a plurality of support piece, first spout, second spout, corresponds the first slider of first spout and correspond the second slider of second spout, wherein:
the supporting piece is detachably connected with the wafer bearing table; the first sliding groove vertically extends into the wafer bearing table from the middle of the first side face of the wafer bearing table, the bottom end of the first sliding piece is connected with the first sliding groove in a sliding mode, and a first graduated scale corresponding to the position of the first sliding piece is arranged on one side of the first sliding groove; the second sliding groove vertically extends into the wafer bearing table from a second side surface perpendicular to the first side surface, an extension line of the second sliding groove is orthogonal to an extension line of the first sliding groove, the bottom end of the second sliding piece is connected with the second sliding groove in a sliding mode, and a second graduated scale corresponding to the position of the second sliding piece is arranged on one side of the second sliding groove;
and the wafer is linearly conveyed to the wafer bearing platform from the opposite direction of the first side surface, the top surface of the supporting piece supports the wafer, and the wafer pushes the first sliding piece to linearly move from a first initial position to a first termination position along the first sliding groove and pushes the second sliding piece to linearly move from a second initial position to a second termination position along the second sliding groove.
Preferably, the first sliding part and the second sliding part each include a cross sliding block, the bottom of the cross of each cross sliding block is correspondingly slidably connected with the corresponding first sliding groove or the second sliding groove, the bottom surface of the middle of the cross is flush with the top surface of the wafer bearing table, and the wafer pushes the top of the cross sliding block to move along the corresponding first sliding groove or the first sliding groove.
Preferably, the cross slide block of the first sliding part is further provided with a supporting table, the supporting table is fixedly connected with the corresponding cross middle part of the cross slide block, the bottom surface of the supporting table is flush with the bottom surface of the cross middle part, the top surface of the supporting table is higher than the top surface of the cross middle part, and the supporting table is flush with the top surface of the supporting piece.
Preferably, the wafer is also supported on a top surface of the support table.
Preferably, the top surface of the wafer bearing table is provided with a plurality of groups of mounting holes, each group of mounting holes is symmetrically distributed along the middle of the first side surface, the bottom ends of the supporting pieces are detachably connected with the mounting holes, and the number of the supporting pieces is less than that of the mounting holes.
Preferably, the number of the supporting members is 2.
Preferably, the material of the support, the first slide and the second slide each comprises POM.
Preferably, the wafer bearing table is further provided with a group of mounting ports, and the mounting ports are symmetrically distributed along the middle of the first side face and penetrate through the wafer bearing table.
A second aspect of the present invention provides a method for teaching a wafer teaching apparatus, including:
step S01: the wafer bearing table is placed on a loading platform of equipment, the first sliding part and the second sliding part are respectively arranged at a first initial position and a second initial position, the first initial position corresponds to a first scale value of the first scale, and the second initial position corresponds to a second scale value of the second scale;
step S02: the wafer pushes the first sliding piece to move linearly along the first sliding groove from a first initial position to a first end position and pushes the second sliding piece to move linearly along the second sliding groove from a second initial position to a second end position;
step S03: and reading a third scale value corresponding to the first termination position and a fourth scale value corresponding to the second termination position, and correcting the manipulator according to the difference between the third scale value and the first scale value and the difference between the fourth scale value and the second scale value.
Preferably, before the step S02, the method further includes: and placing a horizontal measuring instrument to the top surface of the wafer bearing table, and adjusting the levelness of the loading platform according to the horizontal measuring instrument.
According to the technical scheme, the wafer bearing table of the invention creates a plane capable of directly measuring levelness, and meanwhile, the wafer pushes the first sliding part to move linearly from the first initial position to the first end position along the first sliding groove and pushes the second sliding part to move linearly from the second initial position to the second end position along the second sliding groove, so that the positioning position of the wafer on the supporting piece can be intuitively obtained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic diagram of a wafer teaching apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic top view of a first slide and a first chute of a wafer teaching apparatus according to an embodiment of the present invention;
fig. 3 is a schematic top view of a second slide and a second chute of a wafer teaching device according to an embodiment of the present invention.
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
In the following detailed description of the embodiments of the present invention, in order to clearly illustrate the structure of the present invention and to facilitate explanation, the structure shown in the drawings is not drawn to a general scale and is partially enlarged, deformed and simplified, so that the present invention should not be construed as limited thereto.
To make the objects, technical solutions and advantages of the present invention clearer, the following description further refers to the accompanying drawings, and fig. 1 shows a schematic structural diagram of a wafer teaching apparatus according to an embodiment of the present invention. As shown in fig. 1, a wafer teaching apparatus according to the present invention includes a wafer stage 100, wherein a plurality of supporting members 133, a first sliding groove 121, a second sliding groove, a first sliding member 111 corresponding to the first sliding groove 121, and a second sliding member 112 corresponding to the second sliding groove 122 are disposed on a top surface of the wafer stage 100.
The first sliding groove 121 vertically extends into the wafer carrier 100 from the middle of the first side surface of the wafer carrier 100, and a first scale corresponding to the position of the first sliding member 111 is disposed on one side of the first sliding groove 121, as shown in fig. 1, the first scale is located on the right side of the first sliding groove 121. The bottom end of the first sliding member 111 is slidably connected to the first sliding groove 121, and the position of the first sliding member 111 relative to the first sliding groove 121 can be read through the scale of the first scale, so that the moving distance of the first sliding member 111 can be conveniently and intuitively obtained.
The second sliding groove 122 extends vertically into the wafer carrying stage 100 from a second side perpendicular to the first side, an extension line of the second sliding groove 122 is orthogonal to an extension line of the first sliding groove 121, a bottom end of the second sliding member 112 is slidably connected to the second sliding groove 122, a second scale corresponding to a position of the second sliding member 112 is disposed on one side of the second sliding groove 122, and as shown in fig. 1, the second scale is located on a right side of the second sliding groove 122. Likewise, the position of the second slider 112 relative to the second sliding chute 122 can be read through the scale of the second scale, so that the moving distance of the second slider 112 can be conveniently and intuitively obtained.
The robot linearly transfers the wafer from the opposite direction of the first side surface to the top surface of the supporting member 133, and the robot linearly transfers the wafer to the wafer bearing table 100 along the opposite direction of the first sliding member 111, because the wafer is circular, during the transfer process, the front end of the wafer abuts against the first sliding member 111 and pushes the first sliding member 111 to move relative to the first sliding groove 121, and the side end abuts against the second sliding member 112 and pushes the second sliding member 112 to move relative to the second sliding groove 122, so as to intuitively determine whether the positioning position of the wafer on the supporting member 133 reaches a predetermined position.
Specifically, the wafer pushes the first sliding member 111 to move linearly along the first sliding slot 121 from a first initial position to a first end position and pushes the second sliding member 112 to move linearly along the second sliding slot 122 from a second initial position to a second end position. The first initial position corresponds to a first scale value of the first scale, the first end position corresponds to a third scale value of the first scale, and the moving distance of the wafer along the conveying direction is obtained according to the difference between the third scale value and the first scale value. The second initial position corresponds to a second scale value of the second scale, the second end position corresponds to a fourth scale value of the second scale, and the moving distance of the wafer along the direction perpendicular to the conveying direction is obtained according to the difference between the fourth scale value and the second scale value. According to the invention, the front-back movement direction and the left-right movement direction of the wafer are limited by the first sliding part 111 and the second sliding part 112, so that the effect of complete positioning is achieved, and the mounting position of the wafer is finally determined.
The first and second sliding grooves 121 and 122 each have a shape including one of a rectangular groove, a dovetail groove, or a T-shaped groove.
In this embodiment, considering that the cost of milling a special-shaped groove is high, considering the size of a general tool, and considering the economical and practical aspects of the jig, the shapes of the first sliding groove 121 and the second sliding groove 122 are rectangular grooves, the first slider 111 and the second slider 112 are both cross sliders corresponding to the T-shaped grooves, and by providing the cross sliders, the first slider 111 or the second slider 112 can be prevented from being pushed down when the wafer moves.
The bottom of the cross of each crosshead shoe is correspondingly slidably connected to the corresponding first sliding slot 121 or the second sliding slot 122, the bottom surface of the middle of the cross is flush with the top surface of the wafer carrier 100, and the wafer pushes the top of the cross of the crosshead shoe to move along the corresponding first sliding slot 121 or the first sliding slot 121.
As shown in fig. 2, fig. 2 is a schematic top view of a first slide groove 121 and a first slide 111 of a wafer teaching apparatus according to an embodiment of the present invention, the crosshead of the first slide 111 is further provided with a support table, and the wafer is further supported on a top surface of the support table. The supporting table is fixedly connected with the middle part of the cross slide block correspondingly, the bottom surface of the supporting table is flush with the bottom surface of the middle part of the cross, the top surface of the supporting table is higher than the top surface of the middle part of the cross, and the supporting table is flush with the top surface of the supporting piece 133. Fig. 3 is a schematic top view of the second chute 122 and the second slider 112 of a wafer teaching apparatus according to an embodiment of the present invention, which realizes 3-point coplanar support of a wafer by providing the support stage and the support 133. The wafer bearing table 100 creates a plane for measuring levelness, places a levelness measuring instrument on the top surface of the wafer bearing table 100, and adjusts the levelness of the loading platform according to the levelness measuring instrument. The wafer bearing table 100 of the invention is used for adjusting the levelness of the loading platform, and the levelness deviation of the loading platform can be controlled within 0.02 mm.
The top surface of wafer plummer 100 is equipped with a plurality of groups mounting hole 132, and each group mounting hole 132 is followed the middle part of first side, the extension line symmetric distribution of first spout promptly, the connection can be dismantled to support piece 133's bottom mounting hole 132, just support piece 133's quantity is less than the quantity of mounting hole, support piece 133's quantity is 2, is more than through setting up the quantity support piece 133's mounting hole, thereby adjusts in a flexible way according to the size of wafer support piece 133's position.
In this embodiment, the mounting holes extend into the wafer carrier 100 from the top surface of the wafer carrier 100, and the bottom ends of the supporting members 133 are in interference fit with the mounting holes. Since the height of the support 133 is designed according to the desired plane height of the wafer, the error in the horizontal positioning direction of the wafer is negligible during the wafer teaching process.
The supporting member 133, the first sliding member 111 and the second sliding member 112 are made of POM, the POM has the advantages of low processing cost, easy replacement after abrasion and the like, and the POM is lighter than a metal material, has smaller friction and is beneficial to sliding.
The wafer bearing table 100 is further provided with a set of mounting ports 131, the mounting ports 131 are parallel to and arranged on two sides of the first sliding groove 121 and penetrate through the wafer bearing table 100, and the wafer bearing table 100 can be conveniently taken and placed through the mounting ports 131.
A method for teaching a wafer teaching apparatus according to the present invention will be described in detail with reference to fig. 1.
Step S01: the wafer bearing table 100 is placed on a loading platform of the equipment, and the first sliding part 111 and the second sliding part 112 are respectively arranged at a first initial position and a second initial position, wherein the first initial position corresponds to a first scale value of the first scale, and the second initial position corresponds to a second scale value of the second scale;
step S02: the robot linearly transfers the wafer to the top surface of the support 133 from the opposite direction of the first side surface, the wafer pushes the first slider 111 to linearly move from the first initial position along the first sliding slot 121 to the first end position and pushes the second slider 112 to linearly move from the second initial position along the second sliding slot 122 to the second end position;
step S03: and reading a third scale value corresponding to the first termination position and a fourth scale value corresponding to the second termination position, and correcting the manipulator according to the difference between the third scale value and the first scale value and the difference between the fourth scale value and the second scale value.
As a preferred embodiment, before the step S02, the method further includes: a level gauge is placed on the top surface of the wafer carrier 100 and the levelness of the device platform is adjusted according to the level gauge. By introducing the wafer teaching device of the invention, the adjustment time of each loading platform is about 30 minutes averagely in the visual adjustment and installation method of the prior art, and the invention shortens the adjustment time to be less than 10 minutes. Meanwhile, the more accurate position can be obtained only by 1-2 times of adjustment during the teaching of the wafer, and the installation efficiency of the loading platform and the wafer teaching efficiency are improved.
The above description is only for the preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all the equivalent structural changes made by using the contents of the description and the drawings of the present invention should be included in the scope of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A wafer teaching apparatus, comprising:
wafer plummer, the top surface of wafer plummer is equipped with a plurality of support piece, first spout, second spout, corresponds the first slider of first spout and correspond the second slider of second spout, wherein:
the supporting piece is detachably connected with the wafer bearing table; the first sliding groove vertically extends into the wafer bearing table from the middle of the first side face of the wafer bearing table, the bottom end of the first sliding piece is connected with the first sliding groove in a sliding mode, and a first graduated scale corresponding to the position of the first sliding piece is arranged on one side of the first sliding groove; the second sliding groove vertically extends into the wafer bearing table from a second side surface perpendicular to the first side surface, an extension line of the second sliding groove is orthogonal to an extension line of the first sliding groove, the bottom end of the second sliding piece is connected with the second sliding groove in a sliding mode, and a second graduated scale corresponding to the position of the second sliding piece is arranged on one side of the second sliding groove;
and the wafer is linearly conveyed to the wafer bearing platform from the opposite direction of the first side surface, the top surface of the supporting piece supports the wafer, and the wafer pushes the first sliding piece to linearly move from a first initial position to a first termination position along the first sliding groove and pushes the second sliding piece to linearly move from a second initial position to a second termination position along the second sliding groove.
2. The wafer teaching device according to claim 1, wherein the first sliding member and the second sliding member each include a cross slide block, a bottom of a cross of each cross slide block is correspondingly slidably connected to the corresponding first sliding slot or the second sliding slot, a bottom surface of a middle portion of the cross is flush with a top surface of the wafer stage, and the wafer pushes a top of the cross slide block to move along the corresponding first sliding slot or the first sliding slot.
3. The wafer teaching apparatus according to claim 1, wherein the crosshead of the first slider is further provided with a supporting table, the supporting table is fixedly connected to a corresponding cross middle portion of the crosshead, a bottom surface of the supporting table is flush with a bottom surface of the cross middle portion, a top surface of the supporting table is higher than a top surface of the cross middle portion, and the supporting table is flush with a top surface of the supporting member.
4. The wafer teaching apparatus of claim 3, wherein the wafer is further supported on a top surface of the support stage.
5. The wafer teaching device according to claim 1, wherein the top surface of the wafer stage has a plurality of sets of mounting holes, each set of mounting holes is symmetrically distributed along the middle of the first side surface, the bottom ends of the supporting members are detachably connected with the mounting holes, and the number of the supporting members is less than the number of the mounting holes.
6. The wafer teaching apparatus according to claim 5, wherein the number of the supports is 2.
7. The wafer teaching apparatus according to claim 1, wherein the material of the support, the first slide member and the second slide member includes POM.
8. The wafer teaching apparatus according to claim 1, wherein the wafer stage further has a set of mounting openings, the mounting openings being symmetrically distributed along a middle portion of the first side surface and penetrating the wafer stage.
9. A method for teaching a wafer teaching apparatus according to any of claims 1-8, comprising:
step S01: the wafer bearing table is placed on a loading platform of equipment, the first sliding part and the second sliding part are respectively arranged at a first initial position and a second initial position, the first initial position corresponds to a first scale value of the first scale, and the second initial position corresponds to a second scale value of the second scale;
step S02: the wafer pushes the first sliding piece to move linearly along the first sliding groove from a first initial position to a first end position and pushes the second sliding piece to move linearly along the second sliding groove from a second initial position to a second end position;
step S03: and reading a third scale value corresponding to the first termination position and a fourth scale value corresponding to the second termination position, and correcting the manipulator according to the difference between the third scale value and the first scale value and the difference between the fourth scale value and the second scale value.
10. The method for teaching a wafer teaching apparatus according to claim 9, further comprising, before step S02: and placing a horizontal measuring instrument to the top surface of the wafer bearing table, and adjusting the levelness of the loading platform according to the horizontal measuring instrument.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110256006.5A CN112820686A (en) | 2021-03-09 | 2021-03-09 | Wafer teaching device and teaching method |
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| CN202110256006.5A CN112820686A (en) | 2021-03-09 | 2021-03-09 | Wafer teaching device and teaching method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116190294A (en) * | 2023-04-24 | 2023-05-30 | 上海果纳半导体技术有限公司 | Crown block teaching device and teaching method |
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Application publication date: 20210518 |