CN108346595B - Macroscopic scratch length measuring device - Google Patents
Macroscopic scratch length measuring device Download PDFInfo
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- CN108346595B CN108346595B CN201710062812.2A CN201710062812A CN108346595B CN 108346595 B CN108346595 B CN 108346595B CN 201710062812 A CN201710062812 A CN 201710062812A CN 108346595 B CN108346595 B CN 108346595B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length-Measuring Instruments Using Mechanical Means (AREA)
Abstract
The invention provides a macroscopic scratch length measuring device, comprising: the top of the rotary clamp is provided with a sliding groove along the circumferential direction of the rotary clamp; a light source; the upper surface of the scale is provided with scales along the length direction of the scale, and one end of the scale is fixed at the sliding groove through a fixing device; one end of the fixing device is arranged in the sliding groove, and the scale can be driven to rotate in a plane parallel to the upper surface of the rotary clamp by taking the axial center line of the fixing device as a center and to slide along the length direction of the sliding groove. The macroscopic scratch length measuring device can accurately measure the macroscopic scratches at any positions on the surface of the wafer while visually inspecting; the macroscopic scratch length measuring device has the advantages of simple structure, convenience in operation, high measuring precision and the like.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a macroscopic scratch length measuring device.
Background
Visual Inspection (VI) is of great significance in the semiconductor field, and many defects generated in the semiconductor process can be detected by using Visual Inspection equipment. One important defect that can be detected by visual inspection is the macro scratch (macro scratch), which has a serious adverse effect on the performance of the chip. Visual inspection equipment is widely used to determine the total length of the macro scratches to meet the customer's requirements. Fig. 1 and 2 show a conventional visual inspection apparatus, wherein fig. 1 is a partial perspective view of the visual inspection apparatus, and fig. 2 is a top view of a rotary clamp holding a wafer to be inspected in the visual inspection apparatus. As can be seen from fig. 1 and 2, the conventional visual inspection apparatus includes: the wafer detection device comprises a rotary clamp 11 and a light source 13, wherein the rotary clamp 11 is suitable for clamping a wafer 14 to be detected, the lower surface of the rotary clamp 11 is connected with a driving device 12 and is suitable for rotating under the driving of the driving device 12, the light source 13 is located on one side of the upper surface of the rotary clamp 11 and is suitable for providing strong light during visual inspection, and an arrow in fig. 1 represents the strong light.
However, to obtain the length of the macro scratches requires a skilled engineer, which undoubtedly puts higher demands on the measurement, and the results measured by different personnel operations are different, which is not good for quality control. In addition, a large number of back defects exist on the back surface of the wafer after the epitaxial growth process, and an engineer generally observes the back defects by using a visual inspection device, but only the rough structure of the back defects can be observed by using the visual inspection device, and the precise size of the back defects cannot be obtained.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a length measuring device for a macro scratch, which is used to solve the problem that the visual inspection equipment in the prior art cannot accurately measure the total length of the macro scratch when detecting the macro scratch.
To achieve the above and other related objects, the present invention provides a macro scratch length measuring apparatus, comprising: the rotary fixture is suitable for clamping a wafer to be tested, the lower surface of the rotary fixture is connected with a first driving device and is suitable for rotating under the driving of the first driving device, and the light source is located on one side of the upper surface of the rotary fixture and is suitable for providing strong light; the top of the rotary clamp is provided with a sliding groove along the circumferential direction; the macro scratch length measuring apparatus further includes:
the upper surface of the scale is provided with scales along the length direction of the scale, and one end of the scale is fixed at the sliding groove through a fixing device; one end of the fixing device is arranged in the sliding groove, and the scale can be driven to rotate in a plane parallel to the upper surface of the rotary clamp by taking the axial center line of the fixing device as a center and to slide along the length direction of the sliding groove.
As a preferable aspect of the macro scratch length measuring apparatus of the present invention, the number of the scales is one, and the length of the scale is greater than or equal to the diameter of the wafer to be measured.
As a preferable aspect of the macro scratch length measuring apparatus of the present invention, the number of the scales is two, and the sum of the lengths of the two scales is greater than or equal to the diameter of the wafer to be measured.
As a preferable mode of the macro-scratch length measuring apparatus of the present invention, the end surface of the scale is circular in shape.
As a preferable aspect of the macro-scratch length measuring apparatus of the present invention, the scale may be rotated 360 ° in a plane parallel to the upper surface of the rotating jig.
As a preferable embodiment of the macro scratch length measuring device of the present invention, two parallel rows of corresponding scales are disposed on the upper surface of the scale, wherein one row of scales is located on one side of the upper surface of the scale, and the other row of scales is located on the other side of the upper surface of the scale.
As a preferable embodiment of the macro-scratch length measuring device of the present invention, the scale has a minimum unit of millimeter.
As a preferable mode of the macro-scratch length measuring device of the present invention, the material of the scale is a high temperature resistant transparent material.
As a preferable embodiment of the macro-scratch length measuring apparatus of the present invention, the material of the scale is quartz.
As a preferable mode of the macro-scratch length measuring device of the present invention, the fixing means is a screw.
As a preferable aspect of the macro scratch length measuring device of the present invention, the macro scratch length measuring device further includes a second driving device, and the second driving device is connected to the fixing device and adapted to drive the fixing device to drive the scale to rotate in a plane parallel to the upper surface of the rotating fixture with an axial center line of the fixing device as a center and to drive the scale to slide along the length direction of the sliding groove.
As described above, the macro scratch length measuring apparatus of the present invention has the following advantageous effects: the top of the rotary clamp is provided with the sliding groove along the circumferential direction, the scale with scales is additionally arranged, one end of the scale is fixed at the sliding groove through the fixing device, the scale can rotate in a plane parallel to the upper surface of the rotary clamp by taking the fixed point as the center, meanwhile, one end of the fixing device is arranged in the sliding groove and can drive the scale to slide along the length direction of the sliding groove, and the measuring device can accurately measure the macroscopic scratches at any position of the surface of the wafer during visual inspection; the macroscopic scratch length measuring device has the advantages of simple structure, convenience in operation, high measuring precision and the like.
Drawings
Fig. 1 and 2 are schematic structural views of a visual inspection apparatus in the prior art.
Fig. 3 is a schematic structural diagram of a macro-scratch length measuring apparatus according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a rotary jig and a scale in the macro-scratch length measuring apparatus according to an embodiment of the present invention for measuring macro-scratches on the surface of a wafer.
Fig. 5 is a schematic structural diagram of a scale in the macro-scratch length measuring apparatus according to the first embodiment of the present invention.
FIG. 6 is a schematic cross-sectional view along AA' of FIG. 5.
Fig. 7 is a schematic view illustrating a rotary jig and a scale in the macro-scratch length measuring apparatus according to the second embodiment of the present invention to measure the macro-scratches on the wafer surface.
Description of the element reference numerals
11 rotating clamp
12 drive device
13 light source
14 wafer to be tested
21 rotating clamp
211 sliding groove
22 first drive device
23 light source
24 staff gauge
241 graduation
242 through hole
25 fixing device
26 wafer to be tested
27 macroscopic scratch
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 3 to 7. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
Referring to fig. 3 and 4, the present invention provides a macro scratch length measuring apparatus, including: the wafer detection device comprises a rotary clamp 21 and a light source 23, wherein the rotary clamp 21 is suitable for clamping a wafer 26 to be detected, the lower surface of the rotary clamp 21 is connected with a first driving device 22 and is suitable for rotating under the driving of the first driving device 22, and the light source 23 is located on one side of the upper surface of the rotary clamp 21 and is suitable for providing strong light; the top of the rotary clamp 21 is provided with a sliding groove 211 along the circumferential direction; the macro scratch length measuring apparatus further includes: the scale 24, the upper surface of the scale 24 is provided with a scale 241 along the length direction thereof, and one end of the scale 24 is fixed at the sliding chute 211 through a fixing device 25; one end of the fixing device 25 is disposed in the sliding groove 211, and can drive the scale 24 to rotate in a plane parallel to the upper surface of the rotating fixture 21 with the axial center line of the fixing device 25 as the center and drive the scale 24 to slide along the length direction of the sliding groove 211. According to the invention, the top of the rotary clamp 21 is provided with the sliding groove 211 along the circumferential direction, the scale 24 with the scale 241 is additionally arranged, one end of the scale 24 is fixed at the sliding groove 211 through the fixing device 25, the scale 24 can rotate in a plane parallel to the upper surface of the rotary clamp 21 by taking a fixed point as a center, meanwhile, one end of the fixing device 25 is arranged in the sliding groove 211 and can drive the scale 24 to slide along the length direction of the sliding groove 211, and the measuring device can accurately measure the macroscopic scratch 27 at any position of the surface of the wafer 26 to be measured while performing visual inspection; the macroscopic scratch length measuring device has the advantages of simple structure, convenience in operation, high measuring precision and the like.
As an example, the number of the scales 24 is one, and the length of the scale 24 is greater than or equal to the diameter of the wafer 26 to be measured. The length of the scale 24 is greater than or equal to the diameter of the wafer 26 to be measured, so that the scale 24 can measure the length of the macro scratch at any position on the surface of the wafer 26 to be measured in the visual inspection process.
As an example, the scale 24 can rotate 360 ° in a plane parallel to the upper surface of the rotating fixture 21 to ensure that the scale 24 can measure the length of the macro-scratch of the wafer 26 to be measured at any angle.
For convenience of illustration, the scale 241 on the surface of the scale 24 in fig. 3 and 4 is not shown.
As an example, referring to fig. 5, two parallel rows of the scales 241 are provided on the upper surface of the scale 24, wherein one row of the scales 241 is located on one side of the upper surface of the scale 24, and the other row of the scales 241 is located on the other side of the upper surface of the scale 24. Of course, in other examples, the scale 241 may be provided in a row on the upper surface of the scale 24, and when the scale 241 is provided in a row, the scale may be located on one side of the upper surface of the scale 24, or may cross the scale 24 in the width direction of the scale 24.
As an example, the minimum unit of the scale 241 is millimeter to ensure the accuracy of the measurement; of course, in other examples, the smallest unit of the scale 241 may be centimeters, micrometers, and the like.
As an example, as shown in fig. 5, a fixed end of the scale 24 is provided with a through hole 242, one end of the fixing device 25 is inserted into the sliding groove 211 through the through hole 242, and the other end is located above the scale 24; i.e. one end of the scale 24 is fitted over the fixing means 25.
As an example, the end surface of the scale 24 may be circular in shape. The end face of the scale 24 is circular, so that the scale of the scale 24 can be read from any angle, and observation and measurement can be performed from any angle.
By way of example, the measuring range of the scale 24 may be, but is not limited to, 300 mm.
As an example, the material of the scale 24 may be a high temperature resistant transparent material; the high temperature resistance of the material of the scale 24 can ensure the normal use of the scale in a high-temperature environment, and the transparency of the material of the scale 24 is beneficial to observing measurement results from various angles, so that the scale 24 is prevented from blocking the sight of an observer.
As an example, the material of the scale 24 may be quartz, transparent ceramic, or the like.
By way of example, the fixing means 25 may be, but is not limited to, a screw.
As an example, the macro scratch length measuring device further includes a second driving device (not shown), which is connected to the fixing device 25 and adapted to drive the fixing device 25 to rotate the scale 24 around an axial center line of the fixing device 25 in a plane parallel to the upper surface of the rotating fixture 21 and to drive the scale 24 to slide along the length direction of the sliding groove 211.
The working principle of the macroscopic scratch length measuring device is as follows: in the process of visual inspection, if the surface of the wafer 26 to be detected is found to have the macro scratches 27, the second driving device is used to drive the fixing device 25 to slide to a proper position along the sliding groove 211, and preferably, the second driving device is used to drive the fixing device 25 to slide to one end of the macro scratches 27 to be detected along the sliding groove 211, so that the fixing device 25 is located near one side of a straight line where the macro scratches 27 are located; fixing the fixing device 25 in the sliding groove 211, and driving the scale 24 to rotate by using the second driving device so that the macro scratches 27 are parallel, and one side of the scale 24 is located near the macro scratches 27 or in contact with the macro scratches 27, as shown in fig. 4; read the scale 241 on the scale 24 that the macro scratch 27 corresponds, according to the macro scratch 27 corresponds the scale 241 can accurately determine the length of the macro scratch 27.
Example two
Referring to fig. 7, the present embodiment further provides a macro scratch length measuring device, the structure of the macro scratch length measuring device in the present embodiment is substantially the same as that of the macro scratch length measuring device in the first embodiment, and the difference between the two embodiments is: in the first embodiment, the number of the scales 24 is one, the length of the scale 24 is greater than or equal to the diameter of the wafer 26 to be measured, and during the measurement, the measurement of the macro scratches 27 on the surface of the wafer 26 to be measured is completed by using one scale 24; in this embodiment, the number of the scales 24 is two, the sum of the lengths of the two scales 24 is greater than or equal to the diameter of the wafer 26 to be measured, and in the measuring process, the second driving device is used to drive the fixing devices 25 connected to the two scales 24 to move along the sliding grooves 211 at the same time, preferably, the second driving device is used to drive the fixing devices 25 connected to the two scales 24 to slide along the sliding grooves 211 to two ends of the macro scratch 27 to be measured, so that the two fixing devices 25 are located near one side of a straight line where the macro scratch 27 is located, and the two scales 24 are located on the same straight line, and the length of the macro scratch 27 can be accurately determined according to the scales 241 on the two scales 24 corresponding to the macro scratch 27.
In summary, the present invention provides a macro scratch length measuring apparatus, including: the rotary fixture is suitable for clamping a wafer to be tested, the lower surface of the rotary fixture is connected with a first driving device and is suitable for rotating under the driving of the first driving device, and the light source is located on one side of the upper surface of the rotary fixture and is suitable for providing strong light; the top of the rotary clamp is provided with a sliding groove along the circumferential direction; the macro scratch length measuring apparatus further includes: the upper surface of the scale is provided with scales along the length direction of the scale, and one end of the scale is fixed at the sliding groove through a fixing device; one end of the fixing device is arranged in the sliding groove, and the scale can be driven to rotate in a plane parallel to the upper surface of the rotary clamp by taking the axial center line of the fixing device as a center and to slide along the length direction of the sliding groove. The top of the rotary clamp is provided with the sliding groove along the circumferential direction, the scale with scales is additionally arranged, one end of the scale is fixed at the sliding groove through the fixing device, the scale can rotate in a plane parallel to the upper surface of the rotary clamp by taking the fixed point as the center, meanwhile, one end of the fixing device is arranged in the sliding groove and can drive the scale to slide along the length direction of the sliding groove, and the measuring device can accurately measure the macroscopic scratches at any position of the surface of the wafer during visual inspection; the macroscopic scratch length measuring device has the advantages of simple structure, convenience in operation, high measuring precision and the like.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (11)
1. A macro scribe length measuring apparatus comprising: the rotary fixture is suitable for clamping a wafer to be tested, the lower surface of the rotary fixture is connected with a first driving device and is suitable for rotating under the driving of the first driving device, and the light source is located on one side of the upper surface of the rotary fixture and is suitable for providing strong light; the rotary fixture is characterized in that a sliding groove is formed in the top of the rotary fixture along the circumferential direction of the rotary fixture; the macro scratch length measuring apparatus further includes:
the upper surface of the scale is provided with scales along the length direction of the scale, and one end of the scale is fixed at the sliding groove through a fixing device; one end of the fixing device is arranged in the sliding groove, and the scale can be driven to rotate in a plane parallel to the upper surface of the rotary clamp by taking the axial center line of the fixing device as a center and to slide along the length direction of the sliding groove.
2. The macro scribe length measuring apparatus according to claim 1, wherein: the number of the scales is one, and the length of each scale is larger than or equal to the diameter of the wafer to be measured.
3. The macro scribe length measuring apparatus according to claim 1, wherein: the number of the scales is two, and the sum of the lengths of the two scales is larger than the diameter of the wafer to be measured.
4. The macro scribe length measuring apparatus according to claim 1, wherein: the end surface of the scale is circular.
5. The macro scribe length measuring apparatus according to claim 1, wherein: the scale can be rotated 360 ° in a plane parallel to the upper surface of the rotating fixture.
6. The macro scribe length measuring apparatus according to claim 1, wherein: the upper surface of scale is equipped with two rows of parallel corresponding scales, and one of them row of scale is located one side of scale upper surface, another row of scale is located the opposite side of scale upper surface.
7. The macro scribe length measuring apparatus according to claim 1, wherein: the scale has a minimum unit of millimeters.
8. The macro scribe length measuring apparatus according to claim 1, wherein: the scale is made of high-temperature-resistant transparent material.
9. The macro scribe length measuring apparatus according to claim 8, wherein: the scale is made of quartz.
10. The macro scribe length measuring apparatus according to claim 1, wherein: the fixing device is a screw.
11. The macro scribe length measuring apparatus according to claim 1, wherein: macroscopic scratch length measurement device still includes second drive arrangement, second drive arrangement with fixing device is connected, is suitable for the drive fixing device drives the scale use fixing device's axial direction is in as the center at a parallel to the in-plane internal rotation of rotary fixture upper surface and drive the scale is followed the length direction of spout slides.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710062812.2A CN108346595B (en) | 2017-01-25 | 2017-01-25 | Macroscopic scratch length measuring device |
| TW106126978A TWI668780B (en) | 2017-01-25 | 2017-08-09 | An apparatus for measuring the length of macro scratches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710062812.2A CN108346595B (en) | 2017-01-25 | 2017-01-25 | Macroscopic scratch length measuring device |
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| CN108346595A CN108346595A (en) | 2018-07-31 |
| CN108346595B true CN108346595B (en) | 2020-08-18 |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201841283A (en) | 2018-11-16 |
| CN108346595A (en) | 2018-07-31 |
| TWI668780B (en) | 2019-08-11 |
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