TWI668780B - An apparatus for measuring the length of macro scratches - Google Patents
An apparatus for measuring the length of macro scratches Download PDFInfo
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- TWI668780B TWI668780B TW106126978A TW106126978A TWI668780B TW I668780 B TWI668780 B TW I668780B TW 106126978 A TW106126978 A TW 106126978A TW 106126978 A TW106126978 A TW 106126978A TW I668780 B TWI668780 B TW I668780B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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Abstract
本發明提供一種宏觀劃痕長度測量裝置，包括：旋轉夾具，所述旋轉夾具的頂部沿其周向設有滑槽；光源；尺規，所述尺規的上表面沿其長度方向設有刻度，所述尺規的一端經由一固定裝置固定於所述滑槽處；所述固定裝置一端置於所述滑槽內，且可帶動所述尺規以所述固定裝置的軸向中心線為中心在平行於所述旋轉夾具上表面的平面內旋轉及帶動所述尺規沿所述滑槽的長度方向滑動。本發明的宏觀劃痕長度測量裝置可以在目檢的同時精確測量晶圓表面任意位置處的宏觀劃痕；本發明的宏觀劃痕長度測量裝置具有結構簡單、操作方便及測量精度高等優點。 The invention provides a macro scratch length measuring device, comprising: a rotating fixture, a top of the rotating fixture is provided with a chute along its circumferential direction; a light source; a ruler, and an upper surface of the ruler is provided with a scale along its length direction. One end of the ruler is fixed to the chute via a fixing device; one end of the fixing device is placed in the chute, and the ruler can be driven to center on the axial centerline of the fixing device. The plane parallel to the upper surface of the rotating fixture rotates and drives the ruler to slide along the length direction of the chute. The macro scratch length measuring device of the present invention can accurately measure the macro scratches at any position on the wafer surface at the same time as the visual inspection; the macro scratch length measuring device of the present invention has the advantages of simple structure, convenient operation and high measurement accuracy.
Description
本發明屬於半導體設備技術領域，特別是涉及一種宏觀劃痕長度測量裝置。 The invention belongs to the technical field of semiconductor equipment, and particularly relates to a macro scratch length measurement device.
目檢(Visual Inspection，VI)在半導體領域具有重要的意義，使用目檢設備可以檢測出半導體製程中產生的很多種缺陷。其中一種目檢可以檢測到的重要缺陷為宏觀劃痕(macro scratch)，宏觀劃痕對晶片的性能會產生嚴重的不良影響。目檢設備被廣泛應用於確定宏觀劃痕的總長度以滿足客戶的需求。現有的目檢設備如圖1及圖2所示，其中圖1為所述目檢設備的局部立體圖，圖2為所述目檢設備中的夾持有待測晶圓的旋轉夾具的俯視圖。由圖1及圖2可知，現有的目檢設備包括：旋轉夾具11及光源13，所述旋轉夾具11適於夾持待測晶圓14，所述旋轉夾具11的下表面與一驅動裝置12相連接，適於在所述驅動裝置12的驅動下旋轉，所述光源13位於所述旋轉夾具11上表面的一側，適於在目檢時提供強光，其中，圖1中的箭頭表示強光。 Visual inspection (VI) is of great significance in the semiconductor field. Using visual inspection equipment can detect many kinds of defects generated in the semiconductor process. One of the important defects that can be detected by visual inspection is macro scratches, which can have a serious adverse effect on the performance of the wafer. Visual inspection equipment is widely used to determine the total length of macro scratches to meet customer needs. Existing visual inspection equipment is shown in FIG. 1 and FIG. 2, wherein FIG. 1 is a partial perspective view of the visual inspection equipment, and FIG. 2 is a top view of a rotating jig holding the wafer to be tested in the visual inspection equipment. As can be seen from FIG. 1 and FIG. 2, the existing visual inspection equipment includes: a rotating fixture 11 and a light source 13. The rotating fixture 11 is adapted to hold the wafer 14 to be tested, a lower surface of the rotating fixture 11 and a driving device 12. They are connected to each other and adapted to rotate under the driving of the driving device 12. The light source 13 is located on one side of the upper surface of the rotating jig 11 and is suitable for providing strong light during visual inspection. The arrows in FIG. 1 indicate glare.
然而，要想得到宏觀劃痕的長度，需要熟練的工程師操作，這無疑對測量提出更高的要求，並且不同的人員操作量測出來的結果也會不盡相同，從而不利於品質的控制。另外，在磊晶生長製程後晶圓的背面 會存在大量的背部缺陷，工程師一般會使用目檢設備對這些背部缺陷進行觀測，但使用目檢設備只能觀測到這些背部缺陷的大致結構，而不能得到這些背部缺陷的精確尺寸。 However, in order to obtain the length of the macro scratches, skilled engineers need to operate it. This will undoubtedly place higher requirements on the measurement, and the measurement results obtained by different personnel will be different, which is not conducive to quality control. In addition, after the epitaxial growth process, there will be a large number of back defects on the back of the wafer. Engineers generally use visual inspection equipment to observe these back defects, but using visual inspection equipment can only observe the approximate structure of these back defects, and The exact dimensions of these back defects cannot be obtained.
鑒於以上所述現有技術的缺點，本發明的目的在於提供一種宏觀劃痕長度測量裝置，用於解決現有技術中的目檢設備在對宏觀劃痕進行檢測時存在的不能精確量測宏觀劃痕的總長度的問題。 In view of the shortcomings of the prior art described above, an object of the present invention is to provide a macro scratch length measurement device, which is used to solve the inability to accurately measure macro scratches when the macro inspection is performed by a visual inspection device in the prior art. The problem of the total length.
為實現上述目的及其他相關目的，本發明提供一種宏觀劃痕長度測量裝置，所述宏觀劃痕長度測量裝置包括：旋轉夾具及光源，所述旋轉夾具適於夾持待測晶圓，所述旋轉夾具的下表面與一第一驅動裝置相連接，適於在所述第一驅動裝置的驅動下旋轉，所述光源位於所述旋轉夾具上表面的一側，適於提供強光；所述旋轉夾具的頂部沿其周向設有滑槽；所述宏觀劃痕長度測量裝置還包括： 尺規，所述尺規的上表面沿其長度方向設有刻度，所述尺規的一端經由一固定裝置固定於所述滑槽處；所述固定裝置一端置於所述滑槽內，且可帶動所述尺規以所述固定裝置的軸向中心線為中心在平行於所述旋轉夾具上表面的平面內旋轉及帶動所述尺規沿所述滑槽的長度方向滑動。 In order to achieve the above object and other related objects, the present invention provides a macro scratch length measurement device. The macro scratch length measurement device includes a rotating fixture and a light source, and the rotating fixture is suitable for holding a wafer to be tested. The lower surface of the rotating jig is connected to a first driving device and is adapted to rotate under the driving of the first driving device. The light source is located on one side of the upper surface of the rotating jig and is suitable for providing strong light. The top of the rotating fixture is provided with a chute along its circumferential direction; the macro scratch length measuring device further includes: a ruler, the upper surface of the ruler is provided with a scale along its length direction, and one end of the ruler is passed through a fixing device Fixed at the chute; one end of the fixing device is placed in the chute, and the ruler can be driven by the ruler to be centered on the axial centerline of the fixing device and parallel to the upper surface of the rotating fixture The plane rotates and drives the ruler to slide along the length direction of the chute.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規的數量為一個，所述尺規的長度大於或等於所述待測晶圓的直徑。 As a preferred solution of the macro scratch length measuring device of the present invention, the number of the ruler is one, and the length of the ruler is greater than or equal to the diameter of the wafer to be measured.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規的數量為兩個，兩個所述尺規的長度之和大於或等於所述待測晶圓的 直徑。 As a preferred solution of the macro scratch length measuring device of the present invention, the number of the rulers is two, and the sum of the lengths of the two rulers is greater than or equal to the diameter of the wafer to be measured.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規的端面形狀為圓形。 As a preferred solution of the macro scratch length measuring device of the present invention, an end surface shape of the ruler is circular.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規可在平行於所述旋轉夾具上表面的平面內360°旋轉。 As a preferred solution of the macro scratch length measuring device of the present invention, the ruler can be rotated 360 ° in a plane parallel to the upper surface of the rotating jig.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規的上表面設有兩排平行對應的刻度，其中一排刻度位於所述尺規上表面的一側，另一排刻度位於所述尺規上表面的另一側。 As a preferred solution of the macro scratch length measuring device of the present invention, the upper surface of the ruler is provided with two rows of parallel corresponding scales, wherein one row of scales is located on one side of the upper surface of the ruler and the other row of scales Located on the other side of the upper surface of the ruler.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述刻度的最小單位為毫米。 As a preferred solution of the macro scratch length measuring device of the present invention, the minimum unit of the scale is millimeter.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規的材料為耐高溫透明材料。 As a preferred solution of the macro scratch length measuring device of the present invention, the material of the ruler is a high-temperature-resistant transparent material.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述尺規的材料為石英。 As a preferred solution of the macro scratch length measuring device of the present invention, the material of the ruler is quartz.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述固定裝置為螺釘。 As a preferred solution of the macro scratch length measuring device of the present invention, the fixing device is a screw.
作為本發明的宏觀劃痕長度測量裝置的一種優選方案，所述宏觀劃痕長度測量裝置還包括第二驅動裝置，所述第二驅動裝置與所述固定裝置相連接，適於驅動所述固定裝置帶動所述尺規以所述固定裝置的軸向中心線為中心在平行於所述旋轉夾具上表面的平面內旋轉及帶動所述尺規沿所述滑槽的長度方向滑動。 As a preferred solution of the macro scratch length measuring device of the present invention, the macro scratch length measuring device further includes a second driving device, the second driving device is connected to the fixing device and is suitable for driving the fixing The device drives the ruler to rotate in a plane parallel to the upper surface of the rotating jig with the axial centerline of the fixing device as a center, and drives the ruler to slide along the length direction of the chute.
如上所述，本發明的宏觀劃痕長度測量裝置，具有以下有益 效果：本發明通過在旋轉夾具的頂部開設沿其周向設有滑槽，並增設一具有刻度的尺規，且將尺規的一端經由一固定裝置固定於滑槽處，並保證尺規可以固定點為中心在平行於旋轉夾具上表面的平面內旋轉，同時，固定裝置一端置於滑槽內，且可帶動尺規沿滑槽的長度方向滑動，上述測量裝置可以在目檢的同時精確測量晶圓表面任意位置處的宏觀劃痕；本發明的宏觀劃痕長度測量裝置具有結構簡單、操作方便及測量精度高等優點。 As mentioned above, the macro scratch length measuring device of the present invention has the following beneficial effects: The present invention provides a slide groove along the circumferential direction of the rotary fixture on the top of the rotary fixture, and adds a ruler with a scale, and one end of the ruler A fixing device is fixed to the chute, and the ruler can be rotated at a fixed point in a plane parallel to the upper surface of the rotating jig. The above measuring device can accurately measure the macro scratches at any position on the surface of the wafer while performing visual inspection. The macro scratch length measuring device of the present invention has the advantages of simple structure, convenient operation and high measurement accuracy.
11‧‧‧旋轉夾具 11‧‧‧Rotating fixture
12‧‧‧驅動裝置 12‧‧‧Drive
13‧‧‧光源 13‧‧‧light source
14‧‧‧待測晶圓 14‧‧‧Test wafer
21‧‧‧旋轉夾具 21‧‧‧rotating fixture
211‧‧‧滑槽 211‧‧‧chute
22‧‧‧第一驅動裝置 22‧‧‧first drive
23‧‧‧光源 23‧‧‧light source
24‧‧‧尺規 24‧‧‧ Ruler
241‧‧‧刻度 241‧‧‧scale
242‧‧‧通孔 242‧‧‧through hole
25‧‧‧固定裝置 25‧‧‧Fixed device
26‧‧‧待測晶圓 26‧‧‧Test wafer
27‧‧‧宏觀劃痕 27‧‧‧Macro scratches
圖1及圖2顯示為現有技術的目檢設備的結構示意圖。 FIG. 1 and FIG. 2 are schematic structural diagrams of a prior art visual inspection device.
圖3顯示為本發明實施例一中提供的宏觀劃痕長度測量裝置的結構示意圖。 FIG. 3 is a schematic structural diagram of a macro scratch length measurement device provided in Embodiment 1 of the present invention.
圖4顯示為本發明實施例一中提供的宏觀劃痕長度測量裝置中的旋轉夾具及尺規量測晶圓表面的宏觀劃痕的示意圖。 FIG. 4 is a schematic diagram of measuring a macro scratch on a wafer surface by a rotating fixture and a ruler in a macro scratch length measuring device provided in Embodiment 1 of the present invention.
圖5顯示為本發明實施例一中提供的宏觀劃痕長度測量裝置中的尺規的結構示意圖。 FIG. 5 is a schematic structural diagram of a ruler in a macro scratch length measurement device provided in Embodiment 1 of the present invention.
圖6顯示為圖5沿AA’方向的截面結構示意圖。 FIG. 6 is a schematic view of the cross-sectional structure of FIG. 5 along the AA 'direction.
圖7顯示為本發明實施例二中提供的宏觀劃痕長度測量裝置中的旋轉夾具及尺規量測晶圓表面的宏觀劃痕的示意圖。 FIG. 7 is a schematic diagram of measuring a macro scratch on a wafer surface by a rotating fixture and a ruler in a macro scratch length measuring device provided in Embodiment 2 of the present invention.
以下通過特定的具體實例說明本發明的實施方式，本領域技術人員可由本說明書所揭露的內容輕易地瞭解本發明的其他優點與功效。本發明還可以通過另外不同的具體實施方式加以實施或應用，本說明書中的各項細節也可以基於不同觀點與應用，在沒有背離本發明的精神下進行 各種修飾或改變。 The following describes the embodiments of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention may also be implemented or applied through different specific embodiments, and various details in this specification may also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
請參閱圖3至圖7。需要說明的是，本實施例中所提供的圖示僅以示意方式說明本發明的基本構想，雖圖示中僅顯示與本發明中有關的組件而非按照實際實施時的元件數目、形狀及尺寸繪製，其實際實施時各元件的形態、數量及比例可為一種隨意的改變，且其元件佈局形態也可能更為複雜。 Please refer to FIGS. 3 to 7. It should be noted that the illustrations provided in this embodiment only illustrate the basic idea of the present invention in a schematic manner, although the illustrations only show the components related to the present invention and not the number, shape and For size drawing, the shape, quantity, and proportion of each element can be changed at will during its actual implementation, and the shape of the element layout may be more complicated.
實施例一：Embodiment one:
請參閱圖3及圖4，本發明提供一種宏觀劃痕長度測量裝置，所述宏觀劃痕長度測量裝置包括：旋轉夾具21及光源23，所述旋轉夾具21適於夾持待測晶圓26，所述旋轉夾具21的下表面與一第一驅動裝置22相連接，適於在所述第一驅動裝置22的驅動下旋轉，所述光源23位於所述旋轉夾具21上表面的一側，適於提供強光；所述旋轉夾具21的頂部沿其周圍方向上設有滑槽211；所述宏觀劃痕長度測量裝置還包括：尺規24，所述尺規24的上表面沿其長度方向設有刻度241，所述尺規24的一端經由一固定裝置25固定於所述滑槽211處；所述固定裝置25一端置於所述滑槽211內，且可帶動所述尺規24以所述固定裝置25的軸向中心線為中心在平行於所述旋轉夾具21上表面的平面內旋轉及帶動所述尺規24沿所述滑槽211的長度方向滑動。本發明通過在所述旋轉夾具21的頂部開設沿其周向設有滑槽211，並增設一具有刻度241的尺規24，且將尺規24的一端經由所述固定裝置25固定於滑槽211處，並保證尺規24可以固定點為中心在平行於旋轉夾具21上表面的平面內旋轉，同時，所述固定裝置25一端置於所述滑槽211內，且可帶動所述尺規24沿滑槽211的長度方向滑動，上述測量裝置可以在目檢的同時精 確測量所述待測晶圓26表面任意位置處的宏觀劃痕27；本發明的宏觀劃痕長度測量裝置具有結構簡單、操作方便及測量精度高等優點。 Please refer to FIG. 3 and FIG. 4. The present invention provides a macro scratch length measurement device. The macro scratch length measurement device includes a rotating fixture 21 and a light source 23. The rotating fixture 21 is adapted to hold a wafer 26 to be tested. The lower surface of the rotating jig 21 is connected to a first driving device 22 and is adapted to rotate under the driving of the first driving device 22. The light source 23 is located on one side of the upper surface of the rotating jig 21. Suitable for providing strong light; the top of the rotating fixture 21 is provided with a sliding groove 211 along its surrounding direction; the macro scratch length measuring device further includes: a ruler 24, and an upper surface of the ruler 24 is along its length A scale 241 is provided in the direction. One end of the ruler 24 is fixed to the slide groove 211 via a fixing device 25. One end of the fixing device 25 is placed in the slide groove 211 and can drive the ruler 24. Taking the axial centerline of the fixing device 25 as a center, the ruler 24 is rotated in a plane parallel to the upper surface of the rotation jig 21 and drives the ruler 24 to slide along the length direction of the slide groove 211. In the present invention, a slide groove 211 is provided on the top of the rotating jig 21 along its circumferential direction, and a ruler 24 with a scale 241 is added, and one end of the ruler 24 is fixed to the slide groove 211 via the fixing device 25. And ensure that the ruler 24 can rotate in a plane parallel to the upper surface of the rotating fixture 21 as a center, and at the same time, one end of the fixing device 25 is placed in the slide groove 211, and the ruler 24 can be driven along The chute 211 slides in the length direction. The above-mentioned measuring device can accurately measure the macro scratches 27 at any position on the surface of the wafer 26 to be inspected at the same time as the visual inspection; the macro scratch length measuring device of the present invention has a simple structure and operation. Convenient and high measurement accuracy.
作為示例，所述尺規24的數量為一個，所述尺規24的長度大於或等於所述待測晶圓26的直徑。所述尺規24的長度大於或等於所述待測晶圓26的直徑，可以確保所述尺規24在目檢的過程中測量所述待測晶圓26表面任意位置處的宏觀劃痕的長度。 As an example, the number of the rulers 24 is one, and the length of the rulers 24 is greater than or equal to the diameter of the wafer 26 to be tested. The length of the ruler 24 is greater than or equal to the diameter of the wafer 26 to be measured, which can ensure that the ruler 24 measures the macro scratches at any position on the surface of the wafer 26 to be measured during the visual inspection process. length.
作為示例，所述尺規24可在平行於所述旋轉夾具21上表面的平面內360°旋轉，以確保所述尺規24可以量測所述待測晶圓26表面任意角度的宏觀劃痕的長度。 As an example, the ruler 24 can be rotated 360 ° in a plane parallel to the upper surface of the rotating fixture 21 to ensure that the ruler 24 can measure macro scratches on the surface of the wafer 26 to be measured at any angle. length.
需要說明的是，為了便於顯示，圖3及圖4中的所述尺規24表面的刻度241並沒有顯示出來。 It should be noted that, for the convenience of display, the scale 241 on the surface of the ruler 24 in FIG. 3 and FIG. 4 is not displayed.
作為示例，請參閱圖5，所述尺規24的上表面設有兩排平行對應的所述刻度241，其中一排所述刻度241位於所述尺規24上表面的一側，另一排刻度241位於所述尺規24上表面的另一側。當然，在其他示例中，所述尺規24的上表面也可以設置一排所述刻度241，所述刻度241為一排時，可以位於所述尺規24上表面的一側，也可以沿所述尺規24的寬度方向橫跨所述尺規24。 As an example, referring to FIG. 5, the upper surface of the ruler 24 is provided with two rows of the corresponding scales 241 in parallel, one of the rows of the scales 241 is located on one side of the upper surface of the ruler 24 and the other row The scale 241 is located on the other side of the upper surface of the ruler 24. Of course, in other examples, a row of the scales 241 may be provided on the upper surface of the ruler 24. When the scales 241 are in a row, they may be located on one side of the upper surface of the ruler 24, or A width direction of the ruler 24 spans the ruler 24.
作為示例，所述刻度241的最小單位為毫米，以確保測量的精度；當然，在其他示例中，所述刻度241的最小單位也可以為釐米、微米等等。 As an example, the minimum unit of the scale 241 is millimeters to ensure the accuracy of the measurement; of course, in other examples, the minimum unit of the scale 241 may be centimeters, micrometers, and so on.
作為示例，如圖5所示，所述尺規24的固定端設有通孔242，所述固定裝置25的一端經由所述通孔242插入所述滑槽211內，另一端位於 所述尺規24的上方；即所述尺規24的一端套至於所述固定裝置25上。 As an example, as shown in FIG. 5, the fixed end of the ruler 24 is provided with a through hole 242, one end of the fixing device 25 is inserted into the slide groove 211 through the through hole 242, and the other end is located in the ruler. Above the gauge 24; that is, one end of the ruler 24 is sleeved on the fixing device 25.
作為示例，所述尺規24的端面形狀可以為圓形。將所述尺規24的端面設置為圓形，可以確保從任意角度均可讀取所述尺規24的刻度，以確保可以從任意角度進行觀測測量。 As an example, the shape of the end surface of the ruler 24 may be circular. Setting the end surface of the ruler 24 to be circular can ensure that the scale of the ruler 24 can be read from any angle, so as to ensure that observation and measurement can be performed from any angle.
作為示例，所述尺規24的測量範圍可以為但不僅限於300mm。 As an example, the measurement range of the ruler 24 may be, but is not limited to, 300 mm.
作為示例，所述尺規24的材料可以為耐高溫透明材料；所述尺規24的材料耐高溫可以確保其在高溫環境下的正常使用，所述尺規24的材料透明有利於從各個角度觀測測量結果，以避免所述尺規24造成觀測者視線的遮擋。 As an example, the material of the ruler 24 may be a high-temperature-resistant transparent material; the high-temperature resistance of the material of the ruler 24 may ensure its normal use in a high-temperature environment, and the material of the ruler 24 is transparent, which is beneficial from various angles. Observe the measurement results to prevent the ruler 24 from obstructing the observer's line of sight.
作為示例，所述尺規24的材料可以為石英、透明陶瓷等等。 As an example, the material of the ruler 24 may be quartz, transparent ceramic, or the like.
作為示例，所述固定裝置25可以為但不僅限於螺釘。 As an example, the fixing device 25 may be, but is not limited to, a screw.
作為示例，所述宏觀劃痕長度測量裝置還包括第二驅動裝置(未示出)，所述第二驅動裝置與所述固定裝置25相連接，適於驅動所述固定裝置25帶動所述尺規24以所述固定裝置25的軸向中心線為中心在平行於所述旋轉夾具21上表面的平面內旋轉及帶動所述尺規24沿所述滑槽211的長度方向滑動。 As an example, the macro scratch length measuring device further includes a second driving device (not shown), which is connected to the fixing device 25 and is adapted to drive the fixing device 25 to drive the ruler. The ruler 24 rotates in a plane parallel to the upper surface of the rotating jig 21 around the axial centerline of the fixing device 25 and drives the ruler 24 to slide along the length direction of the slide groove 211.
本發明的所述宏觀劃痕長度測量裝置的工作原理為：在目檢的過程中，如果發現所述待測晶圓26表面有宏觀劃痕27，則使用所述第二驅動裝置驅動所述固定裝置25沿所述滑槽211滑動到適當位置，優選地，使用所述第二驅動裝置驅動所述固定裝置25沿所述滑槽211滑動到待檢測的所述宏觀劃痕27一端，使得所述固定裝置25位於所述宏觀劃痕27所在直線 的一側附近；將所述固定裝置25固定於所述滑槽211內，再使用所述第二驅動裝置驅動所述尺規24旋轉至於所述宏觀劃痕27平行，且所述尺規24的一邊位於所述宏觀劃痕27附近或與所述宏觀劃痕27相接觸，如圖4所示；讀取所述宏觀劃痕27對應的所述尺規24上的刻度241，根據所述宏觀劃痕27對應的所述刻度241即可精確地確定出所述宏觀劃痕27的長度。 The working principle of the macro scratch length measurement device of the present invention is: during the visual inspection, if a macro scratch 27 is found on the surface of the wafer 26 to be tested, the second driving device is used to drive the The fixing device 25 slides to an appropriate position along the sliding groove 211. Preferably, the second driving device is used to drive the fixing device 25 to slide along the sliding groove 211 to one end of the macro scratch 27 to be detected, so that The fixing device 25 is located near one side of the line where the macro scratches 27 are located; the fixing device 25 is fixed in the chute 211, and then the ruler 24 is rotated by using the second driving device The macro scratches 27 are parallel, and one side of the ruler 24 is located near the macro scratches 27 or is in contact with the macro scratches 27, as shown in FIG. 4; corresponding to the reading of the macro scratches 27 The scale 241 on the ruler 24 can accurately determine the length of the macro scratch 27 according to the scale 241 corresponding to the macro scratch 27.
實施例二：Embodiment two:
請參閱圖7，本實施例還提供一種宏觀劃痕長度測量裝置，本實施例中的所述宏觀劃痕長度測量裝置的結構與實施例一中所述的宏觀劃痕長度測量裝置的結構大致相同，二者的區別在於：實施例一中所述的尺規24的數量為一個，所述尺規24的長度大於或等於所述待測晶圓26的直徑，在測量的過程中，使用一個所述尺規24完成對所述待測晶圓26表面的所述宏觀劃痕27進行測量；而本實施例中，所述尺規24的數量為兩個，兩個所述尺規24的長度之和大於或等於所述待測晶26圓的直徑，在測量的過程中，使用所述第二驅動裝置同時驅動連接兩個所述尺規24的所述固定裝置25沿所述滑槽211運動，優選地，使用所述第二驅動裝置驅動連接兩個所述尺規24的所述固定裝置25沿所述滑槽211分別滑動到待檢測的所述宏觀劃痕27兩端，使得兩個所述固定裝置25位於所述宏觀劃痕27所在直線的一側附近，且兩個所述尺規24位於同一直線上，根據所述宏觀劃痕27對應的兩個所述尺規24上的所述刻度241可以精確地確定所述宏觀劃痕27的長度。 Please refer to FIG. 7, this embodiment also provides a macro scratch length measurement device. The structure of the macro scratch length measurement device in this embodiment is similar to that of the macro scratch length measurement device in the first embodiment. The same, the difference between the two is that the number of rulers 24 described in the first embodiment is one, and the length of the ruler 24 is greater than or equal to the diameter of the wafer 26 to be tested. One ruler 24 completes the measurement of the macro scratches 27 on the surface of the wafer 26 to be measured; in this embodiment, the number of the rulers 24 is two, and the two rulers 24 are two The sum of the lengths is greater than or equal to the diameter of the 26 circle of the crystal to be measured. During the measurement, the second driving device is used to simultaneously drive the fixing device 25 connected to the two rulers 24 along the slide. The groove 211 moves. Preferably, the second driving device is used to drive the fixing device 25 connected to the two rulers 24 along the slide groove 211 to the two ends of the macro scratch 27 to be detected. So that the two fixing devices 25 are located in the macro scratch 27 Near one side of a straight line, and the two rulers 24 are located on the same straight line. According to the scale 241 on the two rulers 24 corresponding to the macro scratches 27, the macro rule can be accurately determined. The length of the mark 27.
綜上所述，本發明提供一種宏觀劃痕長度測量裝置，所述宏觀劃痕長度測量裝置包括：旋轉夾具及光源，所述旋轉夾具適於夾持待測晶圓，所述旋轉夾具的下表面與一第一驅動裝置相連接，適於在所述第一 驅動裝置的驅動下旋轉，所述光源位於所述旋轉夾具上表面的一側，適於提供強光；所述旋轉夾具的頂部沿其周向設有滑槽；所述宏觀劃痕長度測量裝置還包括：尺規，所述尺規的上表面沿其長度方向設有刻度，所述尺規的一端經由一固定裝置固定於所述滑槽處；所述固定裝置一端置於所述滑槽內，且可帶動所述尺規以所述固定裝置的軸向中心線為中心在平行於所述旋轉夾具上表面的平面內旋轉及帶動所述尺規沿所述滑槽的長度方向滑動。本發明通過在旋轉夾具的頂部開設沿其周向設有滑槽，並增設一具有刻度的尺規，且將尺規的一端經由一固定裝置固定於滑槽處，並保證尺規可以固定點為中心在平行於旋轉夾具上表面的平面內旋轉，同時，固定裝置一端置於滑槽內，且可帶動尺規沿滑槽的長度方向滑動，上述測量裝置可以在目檢的同時精確測量晶圓表面任意位置處的宏觀劃痕；本發明的宏觀劃痕長度測量裝置具有結構簡單、操作方便及測量精度高等優點。 In summary, the present invention provides a macro scratch length measurement device. The macro scratch length measurement device includes a rotating fixture and a light source. The rotating fixture is adapted to hold a wafer to be tested. The surface is connected to a first driving device, and is adapted to rotate under the driving of the first driving device. The light source is located on one side of the upper surface of the rotating jig, and is adapted to provide strong light; the top of the rotating jig A chute is provided along a circumferential direction thereof; the macro scratch length measuring device further includes a ruler, and an upper surface of the ruler is provided with a scale along its length direction, and one end of the ruler is fixed to the ruler by a fixing device. At the chute; one end of the fixing device is placed in the chute, and the ruler can be driven to rotate around the axial centerline of the fixing device in a plane parallel to the upper surface of the rotating fixture and Drive the ruler to slide along the length direction of the chute. In the invention, a slide groove is provided on the top of the rotating fixture along its circumferential direction, and a ruler with a scale is added. One end of the ruler is fixed to the slide groove through a fixing device, and the fixed point of the ruler can be ensured as the center. Rotate in a plane parallel to the upper surface of the rotating fixture. At the same time, one end of the fixing device is placed in the chute, and the ruler can be driven to slide along the length of the chute. The above measurement device can accurately measure the surface of the wafer at the same time as the visual inspection. Macro scratches at arbitrary positions; the macro scratch length measuring device of the present invention has the advantages of simple structure, convenient operation, high measurement accuracy, and the like.
上述實施例僅例示性說明本發明的原理及其功效，而非用於限制本發明。任何熟悉此技術的人士皆可在不違背本發明的精神及範疇下，對上述實施例進行修飾或改變。因此，舉凡所屬技術領域中具有通常知識者在未脫離本發明所揭示的精神與技術思想下所完成的一切等效修飾或改變，仍應由本發明的權利範圍所涵蓋。 The above-mentioned embodiments merely illustrate the principle of the present invention and its effects, but are not intended to limit the present invention. Anyone familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field to which they belong without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the scope of rights of the present invention.
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