M259317 四、創作說明（ο 【新型所屬之技術領域】 本創作係有關一種定位工具，特別是關於一種用於半 導體熱製程中定位晶圓承座中心點的定位工具。 【先前技術】 在半導體製程中，快速熱製程（RTP)是相當重要的一 個處理程序，其與傳統熱爐管的差別在於快速熱製程雖每 次只處理一片晶圓，但因其能在極短的時間内升降溫，因 此處理效率非常快，產出效率遠勝於傳統熱爐管式的處理 〇 在快速熱製程中，晶圓主要是放置於反應腔室中的晶 圓承座上以進行熱烤的處理，由於半導體產業對製程有著 極高的精準度要求以確保成品的品質，因此晶圓放置於承 座上的位置也必須完全符合要求，若晶圓置於晶圓承座上 重心不平均，在進行熱烤處理後會使得塗佈於晶圓表面的 光阻層分佈不均，影響後續的蝕刻製程，造成產品良率降 低，因此在半導體製程中，均會定期對製程機台包含晶圓 承座進行維護及校正，以確保整體設備的精確性。 以目前對於晶圓承座的保養校正程序，因半導體製程 機台設備均相當昂貴，在不傷及使晶圓承座且考量反應腔 室整體的結構，一般並不使用如機械手臂等工具進行校正 的工作，而由操作人員以目測方式檢查晶圓承座是否符合 標準，但如此一來，因人工目測並無判斷的依據，因此在 校正時仍會產生誤差。 為解決上述以人工目測校正所造成的缺失，本創作提M259317 4. Creation Instructions (ο [Technical Field of New Type] This creation is about a positioning tool, especially a positioning tool used to locate the center point of a wafer holder in a semiconductor thermal process. [Previous technology] In the semiconductor process The rapid thermal process (RTP) is a very important process. The difference from the traditional thermal furnace tube is that although the rapid thermal process processes only one wafer at a time, it can rise and fall in temperature in a very short time. Therefore, the processing efficiency is very fast, and the output efficiency is far better than the traditional hot furnace tube processing. In the rapid thermal process, the wafer is mainly placed on the wafer holder in the reaction chamber for hot baking processing. The semiconductor industry has extremely high precision requirements for the manufacturing process to ensure the quality of the finished product. Therefore, the position of the wafer on the holder must also fully meet the requirements. If the center of gravity of the wafer on the wafer holder is uneven, the process After baking, the photoresist layer coated on the wafer surface will be unevenly distributed, which will affect the subsequent etching process and reduce the product yield. Will regularly perform maintenance and calibration on the process equipment including the wafer holder to ensure the accuracy of the overall equipment. With the current maintenance and calibration procedures for wafer bearings, the semiconductor process equipment is quite expensive Damage to the wafer holder and consideration of the overall structure of the reaction chamber generally do not use tools such as a robotic arm for calibration work, but the operator checks visually whether the wafer holder meets the standard, but this way Because there is no basis for judgment by manual visual inspection, errors will still occur during calibration. In order to solve the above-mentioned shortcomings caused by manual visual inspection correction, this creation provides
M259317 四、創作說明（2) 出一種應用於半導體熱製程中用以校正晶圓承座中心點的 工具，以其簡便的設計但可快速準確定出整個承座中心點 的位置，以輔助操作人員解決上述之缺失。 【創作内容】 本創作之主要目的係在提供一種可用於半導體熱製程 中，校正晶圓承座中心點的工具，提供操作人員能方便正 確對晶圓承座進行校正。 本創作之另一目的係在提供一種可精確定位晶圓承座 中心點之工具，以解決習知利用目測方式造成校正精確度 不足之情況。 本創作之另一目的係在提供一種操作方便之中心點定 位工具，可快速的定位出任何圓形及矩型之物體的中心點 〇 根據本創作，晶圓承座之校正工具主要應用在中心點 之定位，其傑結構係包含二組量測直尺，利用尋找待測物 之最大徑值的交點，可容易的定位出該待測物的中心點。 底下藉由具體實施例配合所附的圖式詳加說明，當更 容易瞭解本創作之目的、技術内容、特點及其所達成之功 效。 【實施方式】 本創作係為一種應用於半導體熱製程中用以校正晶圓 承座之校正工具，主要用以改善習知在進行機台維護時， 對於晶圓承座之中心點需由人工以目視檢測，在校準上的 精確度較低，易有誤差，因此本創作提出一可用以定位中M259317 IV. Creation Instructions (2) A tool for calibrating the center point of wafer holders used in semiconductor thermal manufacturing processes. With its simple design, it can quickly and accurately determine the position of the center point of the entire holder to assist operations. Personnel address the aforementioned shortcomings. [Creation content] The main purpose of this creation is to provide a tool that can be used to correct the center point of the wafer holder in the semiconductor thermal process, so that the operator can easily and correctly calibrate the wafer holder. Another purpose of this creation is to provide a tool that can accurately locate the center point of the wafer holder, in order to solve the problem of the lack of calibration accuracy caused by the conventional visual inspection method. Another purpose of this creation is to provide a convenient center point positioning tool, which can quickly locate the center point of any circular and rectangular objects. According to this creation, the calibration tool of the wafer holder is mainly used in the center The positioning of the point includes a set of two measuring rulers. The center point of the object can be easily located by finding the intersection point of the maximum diameter of the object. The following detailed description with specific examples and accompanying drawings will make it easier to understand the purpose, technical content, features and functions of this creation. [Embodiment] This creation is a calibration tool used in the semiconductor thermal process to calibrate wafer holders. It is mainly used to improve the knowledge. When performing machine maintenance, the center point of the wafer holder must be manually adjusted. With visual inspection, the accuracy in calibration is low, and it is prone to errors. Therefore, this author proposes a method for positioning
M259317 四、創作說明（3) 心點的校正工具，利用二組可標定出待測物最大徑值的量 測直尺，則所測得之最大徑值的交點即為所欲定位之中心 點。 第1圖為本創作之立體結構示意圖，本創作之晶圓承 座校正工具在使用上係利用二組結構相同之量測直尺，分 別為第一組量測直尺1 0與第二組量測直尺2 0，由於二量測 直尺1 0、2 0的結構相同，以下僅以其中之第一組量測直尺 1 0說明其結構，請參閱第2圖及第3圖所示之結構示意圖及 分解圖，第一組量測直尺1 0的結構係包含一直尺1 2及二個 滑動條1 4、1 4 ’，在直尺1 2的二側係具有刻度以做為標示 距離之依據，並在直尺1 2的中間設有一長型槽孔1 6 ;滑動 條1 4、1 4 ’是由一矩型塊1 4 0、1 4 0 ’與其往下延伸具有凸緣 1 4 2、1 4 2 ’的柱體1 4 4、1 4 4 ’所構成的T狀結構，將二個滑 動條1 4、1 4 ’以柱體1 4 4、1 4 4 ’向下的方式分別套設於直尺 1 2的長型槽孔1 6中，並且將二滑動條1 4、1 4 ’的柱體1 4 4、 1 4 4 ’所具有之凸緣面1 4 2、1 4 2 ’分別朝向長型槽孔1 6的左 右二端，以做為量測進行時靠接待測物邊緣的接觸端，由 於該柱體1 4 4、1 4 4 ’之凸緣面1 4 2、1 4 2 ’主要做為與待測物 邊緣的接觸端，因此，該柱體144、144’除了需能裝設於 該長型槽孔1 6中外，在結構上，如三角柱、四角柱或其他 具有凸緣之柱體均可。 而包含於本創作之第二組量測直尺2 0的構成與上述第 一組量測直尺1 0相同，請同時參閱第1圖，其構成元件同 樣包含一直尺22，及設於直尺2 2上之長型槽孔2 6以及二滑M259317 IV. Creation instructions (3) Correction tool for heart point, using two sets of measuring rulers that can calibrate the maximum diameter of the object to be measured, the intersection point of the measured maximum diameter is the center point of the desired positioning . Figure 1 is a schematic diagram of the three-dimensional structure of the creation. The wafer holder calibration tool used in this creation uses two sets of measuring rulers with the same structure, which are the first group of measuring rulers 10 and the second group. The measuring ruler 20 is the same as the two measuring rulers 10 and 20, so the following only uses the first set of measuring rulers 10 to explain its structure. Please refer to Figure 2 and Figure 3. The structure diagram and exploded view shown in the figure. The first set of measuring ruler 10 structure includes ruler 12 and two slide bars 1 4 and 1 4 '. There are scales on both sides of ruler 12 to make In order to indicate the distance, a long slot 16 is provided in the middle of the ruler 12; the slide bar 1 4, 1 4 'is formed by a rectangular block 1 4 0, 1 4 0' and extends downward. The T-shaped structure formed by the flanges 1 4 2, 1 4 2 'and the columns 1 4 4, 1 4 4'. The two sliding bars 1 4, 1 4 ' The downward ways are respectively set in the long slot holes 16 of the ruler 12 and the two sliding bars 1 4 and 1 4 ′ of the cylinder 1 4 4 and 1 4 4 ′ have the flange surface 1 4 2, 1 4 2 ′ each face the long slot 1 6 The left and right ends are used as the contact ends on the edge of the receiving object when the measurement is being performed. Since the flanges 1 4 2, 1 4 2 'of the cylinder are mainly used for measurement Therefore, in addition to being able to be installed in the long slot 16, the pillars 144, 144 ′ can be structurally, such as triangular pillars, quadrangular pillars, or other pillars with flanges. The composition of the second set of measuring rulers 20 included in this creation is the same as the above first set of measuring rulers 10, please refer to FIG. 1 at the same time. Its constituent elements also include a ruler 22, Long slotted holes 2 6 and 2 slips on ruler 2 2
M259317 四、創作說明（4) 動條 2 4、2 4 ’。 由於本創作係主要應用於半導體熱製程中的晶圓承座 校正用，而欲校正之待測物體3 0通常具有如墊圈3 2的設計 ，並非一平坦的表面，使得校正進行時二組量測直尺1 0、 2 0無法保持平衡進而影響校正的精確性，因此本創作之第 一組量測直尺1 0更包含有第一墊塊1 8、1 8 ’的設計，第二 組量測直尺2 0亦同樣包含有第二墊塊2 6、2 6 ’的設計。 第一組量測直尺1 0所包含之第一墊塊1 8、1 8 ’係主要 用以支撐該直尺12，在第一墊塊18、18’下方係設有一貫 穿之凹槽1 8 0、1 8 0 ’，可用以容置設於待測物體3 0表面的 墊圈3 2以使直尺1 2保持平坦，而第二組量測直尺2 0所包含 之第二墊塊2 8、2 8 ’，因考慮第一組量測直尺1 0與第二組 量測直尺2 0在使用時需在不同平面上操作以避免直尺間的 摩擦，因此在第二墊塊28、28’的高度設計上與第一墊塊 1 8、1 8 ’有些差異，第二組量測直尺2 0所包含之第二墊塊 28、28’的高度略高於第一墊塊18、18’加上直尺12的高 度，以使此校正工具在校正時能更順暢操作，且在第二墊 塊28、28’的下端同樣設有一貫穿之凹槽280、280’，用以 容置晶圓承座的墊圈。 由於本創作係主要用以定位晶圓承座之中心點，再使 用說明中，請同時參閱第1圖、第4A圖及第4B圖，如圖所 示，本創作之校正工具的使用係先以第一組量測直尺1 〇配 合墊塊1 8、1 8 ’置於一待測物體3 0上，將一滑動條1 4置於 直尺1 2之刻度零點處，並使其緊靠接於該待測物體3 0的内M259317 IV. Creative Instructions (4) Moving bars 2 4, 2 4 ′. Since this creative system is mainly used for wafer holder calibration in the semiconductor thermal process, the object to be calibrated 30 usually has a design such as a washer 32, which is not a flat surface, so that two sets of quantities are made during calibration. The measuring rulers 10 and 20 cannot maintain balance and affect the accuracy of the calibration. Therefore, the first measuring ruler 10 of this creation includes the design of the first pads 18, 18 and the second group. The measuring ruler 20 also includes the design of the second pads 26, 26 '. The first set of measuring rulers 1 and 18 included in the ruler 10 is mainly used to support the ruler 12, and a through groove 1 is provided below the first ruler 18 and 18 '. 8 0, 1 8 0 ′ can be used to accommodate the washer 3 2 on the surface of the object to be measured 30 to keep the ruler 1 2 flat, and the second group measures the second pad included in the ruler 20 2 8, 2 8 ', because the first group of measuring rulers 10 and the second group of measuring rulers 20 are considered in use, they need to be operated on different planes to avoid friction between rulers. The height design of blocks 28 and 28 'is slightly different from that of the first block 18 and 18'. The height of the second block 28 and 28 'included in the second set of measuring rulers 20 is slightly higher than that of the first block The pads 18, 18 'and the height of the ruler 12 make the calibration tool operate more smoothly during calibration, and a penetrating groove 280, 280' is also provided at the lower end of the second pad 28, 28 '. A washer for receiving a wafer holder. Since this creation is mainly used to locate the center point of the wafer holder, please refer to Fig. 1, Fig. 4A and Fig. 4B at the same time in the instructions for use. Use the first group to measure the ruler 10 with the mats 18 and 18 and place it on an object to be measured 30. Place a slide bar 14 at the zero point of the ruler 12 and make it tight. Abuts within the 3 of the object under test 30
M259317 四、創作說明（5) 壁邊緣，反相移動所包含之另一滑動條1 4 ’使其同樣緊靠 於該待測物3 0另一側的内壁邊緣，並觀察所對應之刻度直 至能獲得二滑動條1 4、1 4 ’間的距離最大測量值，則該測 量值即為該待測物3 0之最大徑值3 4，亦即内徑，另將第二 組量測直尺2 0橫跨置於該第一組量測直尺1 0的上方，並使 其位於第一組量測直尺1 0所量測得之最大徑值3 4的中點 上，或利用移動第二組量測直尺2 0所包含的滑動條2 4、 2 4 ’，依前述方式同樣取出該待測物3 0之另一條内徑3 4 ’， 則二量測直尺1 0、2 0所量測得内徑3 4、3 4 ’的交點，亦即 二長型槽孔1 6、2 6的交點，即為所求之晶圓承座之中心點 〇 本創作之設計係容易操作，可快速將一待測物的中心 點定位出，而在測量操作上，除了可測量待測物之内徑外 ，亦可利用測量待測物之外徑來進行中心點的定位，且因 此設計利用幾何學中二最大徑值之交點來決定中心點，因 此對於任何對稱之結構，如圓形、矩型的結構，均可用來 尋找其中心點。 惟以上所述者，僅為本創作之較佳實施例而已，並非 用來限定本創作實施之範圍。故即凡依本創作申請範圍所 述之形狀、構造、特徵及精神所為之均等變化或修飾，均 應包括於本創作之申請專利範圍内。 【圖號說明】 10 第一組量測直尺 13 直尺M259317 IV. Creation instructions (5) The wall edge, the other slide bar 1 4 'included in the reverse movement, so that it is also close to the edge of the inner wall on the other side of the test object 30, and observe the corresponding scale until The maximum measured value of the distance between the two sliders 1 4 and 1 4 'can be obtained, then the measured value is the maximum diameter value 3 4 of the object to be measured 30, which is the inner diameter, and the second group is measured straight. Ruler 20 is placed across the first group of measuring rulers 10 and placed at the midpoint of the maximum diameter value 34 measured by the first group of measuring rulers 10, or using Move the slide bars 2 4, 2 4 'included in the second group of measuring rulers 20, and take out the other inner diameter 3 4' of the object to be measured 30 in the same manner as above, then the two measuring rulers 1 0 The intersection point of the inner diameters 3, 4, and 3 'measured by 2 and 20, that is, the intersection point of the two long slotted holes 16 and 26, is the center point of the wafer holder requested. The design of this creation It is easy to operate and can quickly locate the center point of an object to be measured. In addition to measuring the inner diameter of the object to be measured, the center of the object can also be measured by measuring the outer diameter of the object to be measured. Positioning, and because of this design is determined using the center point of the intersection of the maximum diameter value of the two geometric, and therefore for any of the symmetrical configuration, such as circular, rectangular structure, which can be used to find the center point. However, the above are only the preferred embodiments of this creation, and are not intended to limit the scope of implementation of this creation. Therefore, all changes or modifications based on the shapes, structures, features, and spirits described in the scope of this creative application shall be included in the scope of the patent for this creative application. [Illustration of drawing number] 10 The first set of measuring ruler 13 Ruler
M259317 第10頁 創作說明（6) 14、 14’ 滑 動 條 140, 、140’ 矩 型 塊 142, ‘142’ 凸 緣 144, •144’ 柱 體 16 長 型 槽 孔 18、 18’ 第 墊 塊 180, ‘180’ 凹 槽 20 第 —~- 組 量 22 直 尺 24' 24’ 滑 動 條 26 長 型 槽 孔 28> 28’ 第 二 墊 塊 2 8 0、 、28(Γ 凹 槽 30 待 測 物 體 32 墊 圈 34' 34’ 内 徑M259317 Page 10 Creation Instructions (6) 14, 14 'Slider 140, 140' Rectangular block 142, '142' Flange 144, • 144 'Post 16 Long slot 18, 18' Block 180 , '180' Groove 20 No. — ~-Group size 22 Ruler 24 '24' Slider 26 Long slotted hole 28> 28 'Second pad 2 8 0, ， 28 (Γ Groove 30 Object to be measured 32 Washer 34 '34' ID
M259317 圖式簡單說明 第1 圖為本創作之結構示意圖。 第2 圖為本創作所包含之量測直尺結構示意圖。 第3 圖為本創作所包含之量測直尺結構分解示意圖 第4 A圖為本創作之結構俯視圖。 第4 B圖為本創作之結構剖面圖。M259317 Schematic description of the diagram Figure 1 is a schematic diagram of the structure of the creation. Figure 2 shows the structure of the measuring ruler included in the creation. Figure 3 is a schematic illustration of the structure of the measuring ruler included in the creation. Figure 4A is a top view of the structure of the creation. Figure 4B is a structural sectional view of the creation.
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