KR20110016780A - Wafer sampling apparatus and wafer sampling method using thereof - Google Patents

Wafer sampling apparatus and wafer sampling method using thereof Download PDF

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Publication number
KR20110016780A
KR20110016780A KR1020090074451A KR20090074451A KR20110016780A KR 20110016780 A KR20110016780 A KR 20110016780A KR 1020090074451 A KR1020090074451 A KR 1020090074451A KR 20090074451 A KR20090074451 A KR 20090074451A KR 20110016780 A KR20110016780 A KR 20110016780A
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KR
South Korea
Prior art keywords
wafer
wafer holder
holder
lower plate
diamond tip
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Application number
KR1020090074451A
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Korean (ko)
Inventor
임철호
Original Assignee
주식회사 동부하이텍
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Priority to KR1020090074451A priority Critical patent/KR20110016780A/en
Publication of KR20110016780A publication Critical patent/KR20110016780A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: A wafer sampling apparatus and a wafer sampling method using the same are provided to accurately implement the sampling work regardless of crystal forming direction of the wafer by forming the scratch using the diamond tip on the particular portion of the inspection target wafer. CONSTITUTION: An inspection object wafer(W) is settled on a wafer fixing bottom plate(10). A wafer fixing top plate(20) is fixed and coupled to the wafer fixing lower plate. A rotating ruler(30) is installed to be rotating around the center of the wafer fixing top plate. A diamond tip(40) forms the scratch on the edge part of the wafer.

Description

Wafer sampling apparatus and wafer sampling method using same

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer sampling apparatus used to obtain a specimen by cutting a specific point of a wafer in order to inspect a wafer for defects, and more particularly, to a wafer sampling method using the same. The present invention relates to a wafer sampling apparatus and a wafer sampling method using the same, capable of easily and precisely performing a sampling operation on a specific point of a wafer to detect whether a wafer is defective or not.

As a diffusion process, an oxidation process, a metal process, etc. are repeatedly performed in the manufacturing process of a semiconductor element, many film | membrane quality is laminated | stacked on the wafer. If a certain film quality is defective in the film formed on the wafer, abnormal operation may occur in the operation of the semiconductor device formed by the subsequent process. To perform. In addition, as the semiconductor device is highly integrated, the manufacturing process thereof is also complicated and miniaturized, and thus analysis and verification are essential processes.

Referring to this analysis and verification step, first, the specimen is cut to a predetermined size to prepare a specimen, and after performing a polishing process to planarize the wafer on which a plurality of films are formed, and then analyze the processed result using the specimen analyzer. The analysis process is performed. The diamond tip is mainly used for the sampling process for fabricating such specimens. A scratch is formed with a diamond tip at the edge of the wafer to be cut, and then the force is applied with both hands to divide the wafer along the crystal plane. To produce a specimen.

On the other hand, wafers generally used in semiconductor manufacturing in the past are mostly <100> oriented wafers as shown in FIG. In agreement, sampling to a particular point on the wafer is relatively easy.

However, when applying the <110> direction wafer as shown in (b) of FIG. 1 to improve the electrical characteristics of the semiconductor, the pattern printing operation direction and the crystal direction of the wafer are different from each other. There was a problem that the point could not be sampled or the sampling operation went through a lot of trial and error.

That is, if the point to be cut in the printed pattern is out of the crystal direction of the wafer during the cutting of the wafer for sampling the specimen, the point to be cut is cut off at the cutting of the wafer or the cut is made too far. There was a problem that the sampling operation takes a lot of time due to the decrease in precision and the repetition of the cutting operation.

The present invention has been made to solve the above problems, the wafer sampling to facilitate the sampling operation for a specific point of the wafer even if the crystal formation direction of the wafer and the printing operation direction of the pattern does not match It is an object of the present invention to provide an apparatus and a wafer sampling method using the same.

Wafer sampling device of the present invention for realizing the above object, the wafer holder is loaded with a wafer holding the lower plate; A wafer holder upper plate which is fastened by covering an upper side of the lower plate of the wafer holder and whose rotation angle is marked along the circumferential direction and an opening is partially formed; It is installed to be rotatable about the center portion of the upper plate of the wafer holder, a rotary ruler marked with a perpendicular grid line on the surface; and a diamond tip for forming a scratch on the edge of the wafer; characterized in that it comprises a.

The bottom surface of the upper plate of the wafer holder is characterized in that the wafer push pin for pressing the upper surface of the edge portion of the wafer seated on the lower plate of the wafer holder is provided along the circumferential direction.

The wafer holder upper plate and the wafer holder lower plate may be made of a transparent material.

The diamond tip is characterized in that it is installed to be mounted on the wafer holder top plate.

The wafer sampling method of the present invention comprises the steps of: seating the inspection target wafer on the upper surface of the lower plate of the wafer holder; Covering and fastening the wafer holder upper plate to an upper side of the wafer holder lower plate such that the wafer seated on the wafer holder lower plate is fixed; Rotating the rotary ruler such that a grid line marked on a rotary ruler provided to be rotatable about a central portion of the upper surface of the wafer holder and the crystal forming direction of the wafer are parallel to each other; and surrounding a specific portion of the wafer to be sampled to be sampled; And forming a scratch by using a diamond tip at an edge portion of the wafer on which the grid line of the rotary ruler extends.

Between rotating the rotary ruler and forming a scratch using a diamond tip at the edge of the wafer, after rotating the wafer to a position where the scratch is easily formed using the diamond tip, the wafer holder top plate And rotating the wafer holder upper plate by an angle at which the wafer is rotated based on the angle indicated at.

According to the wafer sampling apparatus and the wafer sampling method using the same according to the present invention, after the rotary ruler is rotated so as to correspond to the wafer crystallographic direction, the scale of the rotary ruler that surrounds the die of the specific portion to be sampled from the wafer to be inspected is extended. By forming a scratch using a diamond tip at the edge of the sample, the sampling operation can be easily and precisely performed regardless of whether the crystal formation direction of the wafer and the pattern printing direction coincide.

Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view schematically showing the overall configuration of a wafer sampling apparatus according to the present invention, FIG. 3 is a cross-sectional view taken along line AA of FIG. 2, and FIG. 4 is a state in which a rotary ruler is installed on the upper plate of the holder in the wafer sampling apparatus according to the present invention. It is the top view shown.

In the wafer sampling apparatus according to the present invention, even when the crystal formation direction of the wafer and the printing operation direction of the pattern do not coincide, the wafer sampling device is configured to easily sample the specimen from the inspection target wafer (W). A wafer holder upper plate 20 fastened to the wafer holder lower plate 10 to cover the upper side of the wafer holder lower plate 10 on which the wafer is loaded and seated thereon, and the wafer holder upper plate 20 fastened to the wafer holder lower plate 10. Rotating ruler 30 is installed to be rotatable about a central portion of the center portion 20 and has a scale perpendicular to the surface thereof, and a diamond tip 40 for forming a scratch at an edge of the wafer W. As shown in FIG.

The wafer holder lower plate 10 is formed to have a diameter larger than that of the wafer W, and upper and lower plate connecting members 14a, 14b, 14c; 14 for fastening with the wafer holder upper plate 20 are formed at edges thereof. Is provided.

The wafer holder upper plate 20 covers the upper side of the wafer holder lower plate 10 and is fastened to the wafer holder lower plate 10 through the upper and lower plate connecting members 14 to form a space for receiving the wafer. In addition, a plurality of wafer push pins 25 protrude downward along the circumferential direction of the bottom surface of the wafer holder upper plate 20, so that the wafer holder upper plate 20 may be fastened to the wafer holder lower plate 10. At this time, the wafer pressing pin 25 presses the upper surface of the edge portion of the wafer W to fix the wafer in close contact with the wafer holder lower plate 10.

Here, the wafer push pin 25 is preferably made of a flexible material to prevent damage to the wafer when contacted with the wafer.

The rotation angle of the wafer holder upper plate 20 is indicated in the circumferential direction so that the rotation angle of the rotary ruler 30 can be adjusted by an angle corresponding to the rotation angle of the wafer as described below. Play a role.

Here, the wafer holder upper plate 20 and the wafer holder lower plate 10 are preferably made of a transparent material so that an operator can check the scale of the wafer and the rotary ruler 30 housed therein from the outside.

The rotary ruler 30 is used to align the cutting line of the wafer parallel to the crystal direction of the wafer by marking a scale orthogonal to the surface thereof. It is connected to the ruler fixing pin 32 so as to be possible, and may be installed on the bottom surface of the wafer holder upper plate 20 as shown in FIG. 3, but may be installed on the upper surface of the wafer holder upper plate 20.

In addition, an opening portion 22 partially opened along the circumferential direction is formed at an edge of the wafer holder upper plate 20. The opening 22 serves as a passage through which the wafer is exposed to the outside when the scratch is formed at the edge of the wafer by using the diamond tip 40, and the operator puts his hand into the opening 22 to allow the rotary ruler 30 to be opened. ) To provide a space to rotate.

The diamond tip 40 is to form a scratch on the edge of the wafer extending the cutting line of the wafer, is installed to be mounted on the holder 42 installed on the wafer holder upper plate 20, to prevent loss when not in use It is connected to the diamond tip 40 and the holder 42 by a spring-type connecting line 44 to be able to.

Hereinafter, a method of performing a wafer sampling operation using the wafer sampling apparatus of the present invention having the above structure will be described.

5 is an exemplary view showing a wafer sampling operation state using a wafer sampling apparatus according to the present invention, where (a) shows a <100> direction wafer, and (b) shows a case of a <110> direction wafer, respectively. .

First, the inspection target wafer W to sample the specimen is loaded on the upper surface of the lower plate 10 of the wafer holder and seated.

Then, the upper surface of the wafer holder base plate 20 on which the wafer is seated is covered with the upper plate 20 of the wafer holder plate and fastened to the upper and lower plate connecting members 14. At this time, since the edge portion of the wafer is pressed downward by the wafer pressing pin 25 provided on the bottom surface of the upper plate 20 of the wafer holder, the wafer is fixed to the upper surface of the lower plate 20 of the wafer holder.

Next, the rotary ruler 30 is rotated by a predetermined angle so as to be parallel to the crystal formation direction of the wafer.

At this time, in the case of the <100> direction wafer in which the wafer crystal direction and the printing operation direction of the pattern coincide with each other, as shown in FIG. 5A, the rotary ruler 30 is arranged such that the grid lines on the wafer and the grid lines of the rotary rulers are parallel to each other. ), But in the case of a <110> direction wafer in which the crystal direction of the wafer and the printing operation direction of the pattern do not coincide with each other, as shown in FIG. 5 (b), by the angle difference between the lattice line on the wafer and the wafer crystal direction. Rotate the rotary ruler.

In detail, in the case of a <110> direction wafer such as (b) of FIG. 5, an angle difference is formed between a grid line formed on the wafer by an angle size corresponding to the wafer crystal direction and a grid line marked on the rotary ruler 30. What is necessary is to rotate the rotary ruler 30 as much as possible.

Next, a scratch is formed using the diamond tip 40 on the edge of the wafer where the grid line (the thick dotted line on the drawing) of the rotary ruler 30 surrounding the specific portion P to be sampled on the wafer extends. do. In this case, scratches may be formed at four points by the diamond tip 40, because the single crystal silicon wafer is cracked in one direction even if only one side of the silicon crystal is scratched.

In this case, if the extension line points to a blocked portion other than the opening 22 of the wafer holder upper plate 20, a space for inserting the diamond tip 40 into the wafer side is not provided and thus scratches cannot be formed. In this case, after reading and writing the angle marked in the circumferential direction on the edge portion of the wafer holder upper plate 20, the wafer is rotated by a predetermined angle so that the edge portion of the wafer on which the scratch is to be formed is located at the opening 22, and the rotary type is rotated by the rotated angle. What is necessary is just to rotate the ruler 30 in the same direction.

Accordingly, since the wafer and the rotary ruler 30 are rotated by the same angle, it is possible to form a scratch using the diamond tip 40 at the edge of the wafer in the direction indicated by the extension line.

Next, after the upper and lower plate connecting members 14 are released, the wafer holder upper plate 20 is separated from the wafer holder lower plate 10, and the unwrapped wafer is unloaded. The wafer sampling operation may be completed by using a bent or by using both hands to bend and cut both sides of the scratched portion.

It is apparent to those skilled in the art that the present invention is not limited to the above embodiments and can be practiced in various ways without departing from the technical spirit of the present invention. will be.

1 is a view for explaining a crystal direction of a wafer;

2 is a plan view schematically showing the overall configuration of a wafer sampling apparatus according to the present invention;

3 is a cross-sectional view taken along the line A-A of FIG.

4 is a plan view showing a state in which a rotary ruler is installed on the upper plate of the holder in the wafer sampling apparatus according to the present invention,

5 is an exemplary view showing a wafer sampling operation state using a wafer sampling apparatus according to the present invention, where (a) shows a <100> direction wafer, and (b) shows a case of a <110> direction wafer, respectively. .

<Explanation of symbols for the main parts of the drawings>

W: Wafer 10: Lower Plate of Wafer Holder

14: upper and lower plate connecting member 20: wafer holding plate upper plate

22: opening 25: wafer pressing pin

30: rotary ruler 32: ruler fixing pin

40: diamond tip 42: holder

44: connecting line

Claims (6)

In the wafer sampling apparatus used to obtain a specimen by cutting a specific point of the wafer to check whether the wafer is defective, A lower surface of the wafer holder on which the wafer to be loaded is placed; A wafer holder upper plate which is fastened by covering an upper side of the lower plate of the wafer holder and whose rotation angle is marked along the circumferential direction and an opening is partially formed; A rotary ruler installed to be rotatable about a central portion of the upper plate of the wafer holder, and having a grid line perpendicular to the surface thereof; and And a diamond tip for forming a scratch on an edge of the wafer. The method of claim 1, Wafer sampling device, characterized in that the bottom surface of the upper surface of the wafer holder is provided with a wafer push pin along the circumferential direction for pressing the upper surface of the edge portion of the wafer seated on the lower plate of the wafer holder. The method of claim 1, And a wafer holder upper plate and a wafer holder lower plate made of a transparent material. The method of claim 1, The diamond tip is a wafer sampling device, characterized in that installed so as to be mounted on the wafer holder top plate. In the wafer sampling method for obtaining a specimen by cutting a specific point of the wafer to check whether the wafer is defective, Mounting the wafer to be inspected on an upper surface of the lower plate of the wafer holder; Covering and fastening the wafer holder upper plate to an upper side of the wafer holder lower plate such that the wafer seated on the wafer holder lower plate is fixed; Rotating the rotary ruler such that a grid line marked on a rotary ruler installed to be rotatable about a central portion of the upper surface of the wafer holder and the crystal forming direction of the wafer are parallel to each other; and And forming a scratch by using a diamond tip at an edge portion of the wafer on which a grid line of the rotary ruler surrounding a specific portion to be sampled in the wafer to be sampled extends. The method of claim 5, Between rotating the rotary ruler and forming a scratch using a diamond tip at the edge of the wafer, And rotating the wafer holder upper plate by an angle at which the wafer is rotated based on an angle marked on the wafer holder upper plate after rotating the wafer to a position where scratch formation is easily performed using the diamond tip. Wafer sampling method, characterized in that.
KR1020090074451A 2009-08-12 2009-08-12 Wafer sampling apparatus and wafer sampling method using thereof KR20110016780A (en)

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Application Number Priority Date Filing Date Title
KR1020090074451A KR20110016780A (en) 2009-08-12 2009-08-12 Wafer sampling apparatus and wafer sampling method using thereof

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Application Number Priority Date Filing Date Title
KR1020090074451A KR20110016780A (en) 2009-08-12 2009-08-12 Wafer sampling apparatus and wafer sampling method using thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346595A (en) * 2017-01-25 2018-07-31 上海新昇半导体科技有限公司 Macroscopical cut length-measuring appliance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108346595A (en) * 2017-01-25 2018-07-31 上海新昇半导体科技有限公司 Macroscopical cut length-measuring appliance
CN108346595B (en) * 2017-01-25 2020-08-18 上海新昇半导体科技有限公司 Macroscopic scratch length measuring device

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