CN2335265Y

CN2335265Y - Base for light emitting diode (LED)

Info

Publication number: CN2335265Y
Application number: CN97230141U
Authority: CN
Inventors: 周万顺
Original assignee: Individual
Current assignee: Individual
Priority date: 1997-12-15
Filing date: 1997-12-15
Publication date: 1999-08-25
Anticipated expiration: 2007-12-15

Abstract

The utility model relates to a base for a light emitting diode. A material sheet taking copper material as electric conducting material is used for stamping a lead frame, and a light emitting diode lead frame is formed via plating treatment. The light emitting diode lead frame is provided with a plurality of supporting frame units, wherein, the supporting frame units are provided with the base for a light emitting diode via PPA injection molding, and a concave part forming a bowl shape is arranged on the base for fixing a semiconductor light emitting chip. The base of the utility model can be matched with automatic large-scale production, and a 128 psi light emitting diode can be made out on the base via the material sheet having the same size with the existing material sheets. Material can be saved, a user needs not to open a die additionally, and thus cost in producing process can be reduced for the user.

Description

LED base

The utility model relates to a kind of light-emitting diode (LED) pedestal, refer to especially a kind of can be on the LED down-lead bracket, by the p.p.a ejection formation, on each carrier unit, to form the structure of the pedestal of LED.

Existing light-emitting diode (LED) manufacturing is with the tablet of copper material as conductive material, stamp out a lead frame, by electroplating processes, with formation-LED down-lead bracket, give the client to carry out solid crystalline substance, routing voluntarily again, the lead end of itself and each down-lead bracket unit is linked.After the binding, coated encapsulation by encapsulating material (as epoxy resin) again, and carried out the operations such as pin, finished product test and packing of clinched lead end.

Such light-emitting diode must fit on manufacturing process die sinking voluntarily, just can carry out encapsulating, so, for the client, cost of manufacture height not only, and can not hinder production, it once only can produce the light-emitting diode of about 30psi on this lead frame.

The purpose of this utility model is to provide a kind of pedestal of light-emitting diode, and it can be suitable for automation and produce in a large number when making use, and not die sinking in addition can directly be transferred to the client from advancing solid crystalline substance, routing and encapsulating.

The purpose of this utility model is achieved in that a kind of LED base, make one to stamp out a lead frame as the tablet of conductive material with copper material, and pass through electroplating processes, with formation-LED down-lead bracket, on this L E D down-lead bracket several carrier units are arranged, wherein have the LED pedestal of P.P.A ejection formation on the carrier unit.

Have one to be bowl-shape on the pedestal the semiconductor light emitting wafer is set firmly recess wherein.

The utility model pedestal can cooperate automation to produce in a large number, and use and the tablet of existing same same size size, but what is produced about 128psi light-emitting diode on it, saves material greatly, and because client's die sinking more in addition, so can reduce the cost that the client expends in processing procedure.

Below in conjunction with accompanying drawing and specific embodiments the utility model is described in further detail.

Fig. 1 is that substrate of the present utility model is through stamping forming schematic diagram.

Fig. 2 is the schematic diagram of the carrier unit of the utility model substrate through the P.P.A ejection formation.

Fig. 3 is the partial cutaway schematic diagram of the carrier unit of the utility model substrate through the P.P.A ejection formation.

Fig. 4 is the schematic diagram of the single pedestal of the utility model.

Fig. 5 is the utility model finished product schematic diagram.

Fig. 6 sends out the diode fabrication flow chart for the utility model light.

Shown in Fig. 1-6, the utility model tablet of copper material as conductive material, process to stamp out a lead frame through punch press, and pass through electroplating processes, with formation-LED down-lead bracket 1, several carrier units 11 are arranged on this LED down-lead bracket 1, each carrier unit 11 mat P.P.A ejection formation, with formation-LED pedestal 2, this P.P.A is a kind of quartzy hot-melt object, tool plasticity height, thermal conductivity be stable, can stop that IR and VPS flow back to technology, and provide many characteristics such as better electrical sub-feature, and be provided with the extreme pin 112,113 of a P-N in each carrier unit 11.

Have one to be bowl-shape recess 21 on the pedestal 2, so that semiconductor light emitting wafer 22 can be fixedly arranged on wherein, wafer 22 can cooperate the routing process technology, the lead end of itself and each carrier unit 11 is linked, again via operation implementing procedures such as encapsulating, baking, clubfoot, finished product test and packings.

Its design of mat makes LED pedestal 2 can directly transfer to the client and carries out solid crystalline substance, routing, encapsulating, baking, clubfoot, finished product test and package handling flow implementation voluntarily, client's die sinking more in addition.

Claims

1, a kind of LED base, make one to stamp out a lead frame as the tablet of conductive material with copper material, and pass through electroplating processes, to form a LED down-lead bracket, on this LED down-lead bracket several carrier units are arranged, it is characterized in that: the LED pedestal that has the P.P.A ejection formation on the carrier unit.

2, LED base according to claim 1 is characterized in that: have one to be bowl-shape the semiconductor light emitting wafer is set firmly recess wherein on the pedestal.