CN206301789U - A kind of three-dimensional LED encapsulation modules with loop filament - Google Patents
A kind of three-dimensional LED encapsulation modules with loop filament Download PDFInfo
- Publication number
- CN206301789U CN206301789U CN201621114316.4U CN201621114316U CN206301789U CN 206301789 U CN206301789 U CN 206301789U CN 201621114316 U CN201621114316 U CN 201621114316U CN 206301789 U CN206301789 U CN 206301789U
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- ring
- led
- loop filament
- metal
- sheet metal
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 238000009413 insulation Methods 0.000 claims abstract description 7
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 14
- 239000012212 insulator Substances 0.000 claims description 7
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000004033 plastic Substances 0.000 abstract description 8
- 229920003023 plastic Polymers 0.000 abstract description 8
- 238000007596 consolidation process Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 abstract description 2
- 230000005855 radiation Effects 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The utility model is related to a kind of three-dimensional LED encapsulation modules with loop filament,Specifically,Metal tape is punched into many loop filament support blanks of two or more LED that multiple units are mutually connected together,It is every to have the metal connector for acting as support or/and circuit connection function between unit inner ring and ring,It is molded after plating,Make each ring plastic consolidation,The gap of loop circuit is also set to be linked together with plastic insulation simultaneously,The packaging LED chips on each ring,LED chip is connected on metal loop circuit by bonding wire,Formed between unit inner ring and ring and connected,Or it is in parallel,Serial-parallel mirror combination connection,Then the LED filament encapsulation module for multiple units being linked together splits into individual unit,The multiple annulus in unit are axially pulled open again,It is fabricated to a kind of three-dimensional LED encapsulation modules with loop filament,Filament encapsulation module heat conduction and heat radiation of the present utility model is good,Multifaceted light-emitting is uniform,It is attractive in appearance.
Description
Technical field
The utility model and LED application fields, and in particular to a kind of three-dimensional LED encapsulation modules with loop filament.
Background technology
Traditional LED filament bulb is all that welding assembly is formed one by one with the filament bar of multiple straight rod formulas, welding effect
Rate is low, and straight rod lacks the beautiful curve, and the Metal Packaging post-tensioning of Zeng You companies helical structure is split into solid, but when pulling open
The bonding wire of encapsulation can be broken and not succeed, and how LED filament directly be made a three-dimensional module for integration, improve assembling
Efficiency, and also have multiple curved lines, the moulding having had, into the problem that industry is captured always.
In order to capture the problem of the above, a kind of three-dimensional LED encapsulation modules with loop filament of the present utility model, using many
The loop filament metallic support of ring interconnection, takes injection to reinforce in the region for having chip package, module is drawn after packaging is accomplished
When being split into solid, chip position is indeformable, it is ensured that encapsulation bonding wire is not stretched fracture, and the curve of integration three-dimensional is made
Type is attractive in appearance, internally forms the connection in series-parallel encapsulation of arbitrary various ways, and the electrode connection points of external power supply are few, are assembled in bulb
In simple, efficiency high.
Utility model content
The utility model is related to a kind of three-dimensional LED encapsulation modules with loop filament, specifically, metal tape is punched into
Many loop filament support blanks of two or more LED that multiple units are mutually connected together, per unit inner ring and ring
Between have act as support or/and circuit connection function metal connector, after plating be molded, make each ring plastic consolidation, together
When the gap of loop circuit is linked together with plastic insulation, the packaging LED chips on each ring, LED chip passes through
Bonding wire is connected on metal loop circuit, series connection is formed between unit inner ring and ring or in parallel, serial-parallel mirror combines connection, then
The LED filament encapsulation module that multiple units are linked together splits into individual unit, then the multiple annulus in unit along
Axial direction is pulled open, and is fabricated to a kind of three-dimensional LED encapsulation modules with loop filament, and filament encapsulation module of the present utility model is led
Hot good heat dissipation, multifaceted light-emitting are uniform, attractive in appearance.
A kind of three-dimensional LED encapsulation modules with loop filament, including ring support are provided according to the utility model；Rigidity
Insulator；LED chip；Metal wire；Encapsulation glue；Wherein described ring support be containing it is two or more not
With the ring of size, there is the disconnection mouthful of disconnection on each ring, supported or/and circuit connection work per being acted as between unit inner ring and ring
Metal connector, metal connector needs settable disconnection mouth according to circuit design；Or centre is sheet metal, outer ring is
There is the disconnection mouthful of disconnection on each ring of one or more multiple different size of rings, intermediate metal film and outer ring, often
There is the metal connector for acting as support or/and circuit connection function between unit inner metal sheets and ring, and ring and ring, metal connects
Junctor needs settable disconnection mouth according to circuit design；Described rigid insulator is noted on each ring or/and sheet metal
It is moulding into rigid insulation reinforcing body or be paste that rigid insulator formed on each ring or/and sheet metal firm
Property insulation reinforcing body, each ring or/and sheet metal are reinforced and become more rigid and on-deformable structure, while making every
The gap of individual ring or/and sheet metal is fixedly secured and insulate and is connected；Described LED chip be encapsulated in each ring or/
With on sheet metal or be packaged on each ring or/and sheet metal and metal connector, LED chip is by described metal
Bonding wire bonding wire is connected on the metallic circuit of described ring support, forms the circuit of series connection or the combination of in parallel or serial-parallel mirror
Connection；Described encapsulation glue is arranged on the metallic support front or front and side or front, side of chip circumference
And the back side, multiple ring ,Huo Zhe and sheet metal axially pull open, and forms a kind of three-dimensional LED Encapsulation Moulds with loop filament
Group.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, there is the electrode connection points of at least two or more than two external power supplys on described LED ring supports.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, described insulator is lighttight or is printing opacity.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, described encapsulation glue is to contain fluorescent powder packaging glue.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, described LED ring supports, it is on each ring or/and sheet metal or is in each ring or/and gold
It is arranged to the side of battlement shape structure long on category piece and metal connector, forms the LED ring supports of battlement shape structure long.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, the LED ring supports of described battlement shape structure long, are that LED chip is encapsulated on battlement long.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, the shape of described battlement long is squarish or polygon or generally radiused.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, described battlement long, zooms in the root of pile, the pile root of approximate bottleneck shape is formed, make Great Wall after encapsulation
The light that chip on pile sends, the edge from more directions is guide-lighting to the back side under glue help.
According to a preferred embodiment of the present utility model, a kind of described three-dimensional LED encapsulation modules with loop filament,
Characterized in that, the three-dimensional LED encapsulation modules with loop filament are used to make LED ball bubble or candle bulb or different
Property bulb.
In the following description to the drawings and specific embodiments, one or more embodiments of the present utility model will be illustrated
Details.
Brief description of the drawings
By reading this specification in conjunction with the following drawings, feature of the present utility model, objects and advantages will become more to show
And be clear to, accompanying drawing is briefly described as follows.
Fig. 1 is the floor map of the ring support blank that the multiple units being punched into metal tape connect together
Fig. 2 is the floor map of the ring support blank of individual unit.
Fig. 3 is the floor map of the ring support after the ring support blank injection reinforcing of individual unit.
Fig. 4 is the schematic cross-section of " Fig. 3 ".
Fig. 5 is the schematic perspective view of " Fig. 3 ".
Fig. 6 is the floor map of the ring support for prejudging tie point of the removal supporting role of individual unit.
Fig. 7 is floor map on a toroidal support after die bond bonding wire.
Fig. 8 is the schematic cross-section of " Fig. 7 ".
Fig. 9 is the floor map of the loop filament LED encapsulation modules for having dripped encapsulation glue.
Figure 10 is the schematic cross-section of " Fig. 9 ".
Figure 11 is the schematic perspective view of the three-dimensional LED encapsulation modules of loop filament.
Specific embodiment
The utility model will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some sides of being preferable to carry out
Formula, to claim of the present utility model and without any limitation.
With the thick metal tapes of 0.4mm, it is punched unwanted any part metals removed with mould on the auspicious support punch press of rainbow, plus
Work into three different size of annulus 1.1,1.2,1.3 for having a structure side of battlement long 1.5, while according to the need for designed lines
The disconnection mouthful 1.4 of disconnection is gone out on annulus 1.1,1.2,1.3, there are two to act as support and electricity between annulus 1.1 and annulus 1.2
The metal connector 1.6a of road connection function, has two to act as support and circuit connection function between annulus 1.2 and annulus 1.3
Metal connector 1.6b, two electrode connection points of external power supply 1.8 on the inner ring of annulus 1.3, on each annulus
Injection molding plastic cement inlaid hole 1.10 is all gone out, also act as connection supporting role prejudges tie point 1.9, prejudges tie point
1.9 interconnect multiple units, are then connected to together on frame 1.7, are fabricated to LED ring supports blank (such as
Shown in Fig. 1).
Explanation：Fig. 2 is the LED ring support blanks of individual unit, die bond, bonding wire in postorder Making programme, packaging plastic
Water conservancy project sequence is made on the ring support in flakes connected together in multiple units, but apparent in order to illustrate, just with list
Individual unit ring support illustrates to express, and illustrates hereby.
Then electrosilvering surface treatment is carried out at the position that bonding wire and LED chip luminous reflecting are needed in postorder, next
Day essence injection machine on be molded on the annulus 1.1,1.2,1.3 of ring support 1 with injection mold, expose Great Wall on each annulus
The structure side of pile 1.5, the plastic insulation 2 of injection is embedded in the inlaid hole 1.10 on each annulus, makes each ring plastics exhausted
Edge body 2 is reinforced and becomes more rigid and on-deformable structure, while the gap of each ring is fixedly secured and is insulated being linked to be
One then will act as the pre- disconnection of connection supporting role on the auspicious cutting punch press of rainbow as shown in (Fig. 3, Fig. 4, Fig. 5) with mould
The punching of contact 1.9 is removed, and is fabricated to LED ring supports (as shown in Figure 6).
On light DB382 bonders are helped, LED chip 3 is distinguished into die bond in three battlements long of annulus 1.1,1.2,1.3
On 1.5, baking-curing, then by ASM-AB350 bonding equipments with metal wire 4 by between chip and chip and chip and metal
Bonding wire connection between circuit, forms 54 2 circuits (as shown in Figure 7, Figure 8) simultaneously of string, and the encapsulation glue 5 containing fluorescent material is used a little
Glue machine point is close to the ring support front in intrinsic which face of LED chip 3 in which side of battlement long 1.5 on each annulus, while stream
Be suspended to the side of battlement long 1.5, after baking-curing, then by the encapsulation glue 5 containing fluorescent material with point gum machine point in each annulus
The upper ring support back side near which side of battlement long 1.5, while sagging is to the side of battlement long 1.5, baking-curing uses mould
The LED encapsulation modules (as shown in Figure 9, Figure 10) with loop filament for being fabricated to individual unit are cut from frame 1.7.
The LED encapsulation modules with loop filament of individual unit are axially pulled open, a kind of band annular is fabricated to
The three-dimensional LED encapsulation modules (as shown in figure 11) of filament.
Above in association with accompanying drawing by a kind of specific embodiment of the three-dimensional LED encapsulation modules with loop filament to the utility model
It is described in detail.It will be understood by those skilled in the art, however, that the above is merely illustrative and describes
Specific embodiment, to this with the scope of new scope, especially claim, and without any limitation.
Claims (9)
1. a kind of three-dimensional LED encapsulation modules with loop filament, including
Ring support；
Rigid insulator；
LED chip；
Metal wire；
Encapsulation glue；Wherein
Described ring support is the disconnection mouthful for having disconnection on each ring containing two or more different size of rings,
Every to have the metal connector for acting as support or/and circuit connection function between unit inner ring and ring, metal connector is according to circuit
Design needs settable disconnection mouth；Or centre is sheet metal, outer ring is one or more multiple different size of rings, in
Between sheet metal and outer ring each ring on have the disconnection mouthful of disconnection, per having between unit inner metal sheets and ring, and ring and ring
The metal connector of support or/and circuit connection function is acted as, metal connector needs settable disconnection mouth according to circuit design；
Described rigid insulator be molded on each ring or/and sheet metal formation rigid insulation reinforcing body or
That the rigid insulation reinforcing body that rigid insulator is formed is pasted on each ring or/and sheet metal, by each ring or/and
Sheet metal is reinforced and becomes more rigid and on-deformable structure, while making the gap of each ring or/and sheet metal firmly solid
Determine and insulate to be connected；
Described LED chip be encapsulated on each ring or/and sheet metal or be packaged in each ring or/and sheet metal and
On metal connector, LED chip is solder-connected on the metallic circuit of described ring support by described metal wire, shape
Into series connection or the circuit connection of in parallel or serial-parallel mirror combination；
Described encapsulation glue be arranged on the metallic support front or front and side or front of chip circumference, side and
The back side, multiple ring ,Huo Zhe and sheet metal are axially pulled open, and form a kind of three-dimensional LED Encapsulation Moulds with loop filament
Group.
2. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 1, it is characterised in that described LED
There are the electrode connection points of at least two or more than two external power supplys on ring support.
3. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 1, it is characterised in that described is exhausted
Edge body is lighttight or is printing opacity.
4. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 1, it is characterised in that described envelope
Dress glue is to contain fluorescent powder packaging glue.
5. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 1, it is characterised in that described LED
Ring support is on each ring or/and sheet metal or set on each ring or/and sheet metal and metal connector
The side of battlement shape structure long is set to, the LED ring supports of battlement shape structure long are formed.
6. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 5, it is characterised in that described length
The LED ring supports of battlement shape structure, are that LED chip is encapsulated on battlement long.
7. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 5, it is characterised in that described length
The shape of battlement is squarish or polygon or generally radiused.
8. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 5, it is characterised in that described length
Battlement, zooms in the root of pile, forms the pile root of approximate bottleneck shape, the light for sending the chip after encapsulation on battlement long, from
The edge in more directions is guide-lighting to the back side under glue help.
9. a kind of three-dimensional LED encapsulation modules with loop filament according to any one of the claims 1-8, its feature
It is that the three-dimensional LED encapsulation modules with loop filament are used to make LED ball bubble or candle bulb or different in nature lamp
Bubble.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621114316.4U CN206301789U (en) | 2016-09-30 | 2016-09-30 | A kind of three-dimensional LED encapsulation modules with loop filament |
| PCT/CN2017/078716 WO2018058924A1 (en) | 2016-09-30 | 2017-03-30 | Three-dimensional led package module with annular filaments |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621114316.4U CN206301789U (en) | 2016-09-30 | 2016-09-30 | A kind of three-dimensional LED encapsulation modules with loop filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206301789U true CN206301789U (en) | 2017-07-04 |
Family
ID=59203354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621114316.4U Active CN206301789U (en) | 2016-09-30 | 2016-09-30 | A kind of three-dimensional LED encapsulation modules with loop filament |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206301789U (en) |
| WO (1) | WO2018058924A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887374A (en) * | 2016-09-30 | 2018-04-06 | 王定锋 | A kind of three-dimensional LED encapsulation modules and preparation method with loop filament |
| CN113341631A (en) * | 2021-06-29 | 2021-09-03 | 王凯 | Polishing system and method for live broadcast |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW533750B (en) * | 2001-11-11 | 2003-05-21 | Solidlite Corp | LED lamp |
| CN203810155U (en) * | 2014-05-19 | 2014-09-03 | 宋勇飞 | LED (light emitting diode) bulb lamp |
| CN203932051U (en) * | 2014-05-30 | 2014-11-05 | 深圳市斯迈得光电子有限公司 | A kind of special construction filament LED |
| HK1207250A2 (en) * | 2014-10-15 | 2016-01-22 | 新照明設計有限公司 號 | Substrate for led package, a tridimensional led package having the substrate, a light bulb having the tridimensional led package and methods for producing the same led led led |
| CN104465638A (en) * | 2014-12-05 | 2015-03-25 | 苏州紫昱天成光电有限公司 | LED lamp and filament thereof |
| CN204348760U (en) * | 2014-12-19 | 2015-05-20 | 苏州天微工业技术有限公司 | LED silk |
| CN205065341U (en) * | 2015-10-29 | 2016-03-02 | 苏州紫昱天成光电有限公司 | LED lamp filament |
-
2016
- 2016-09-30 CN CN201621114316.4U patent/CN206301789U/en active Active
-
2017
- 2017-03-30 WO PCT/CN2017/078716 patent/WO2018058924A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107887374A (en) * | 2016-09-30 | 2018-04-06 | 王定锋 | A kind of three-dimensional LED encapsulation modules and preparation method with loop filament |
| CN113341631A (en) * | 2021-06-29 | 2021-09-03 | 王凯 | Polishing system and method for live broadcast |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018058924A1 (en) | 2018-04-05 |
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