CN207353245U - A kind of polyhedral LED encapsulation modules of metal - Google Patents
A kind of polyhedral LED encapsulation modules of metal Download PDFInfo
- Publication number
- CN207353245U CN207353245U CN201721198576.9U CN201721198576U CN207353245U CN 207353245 U CN207353245 U CN 207353245U CN 201721198576 U CN201721198576 U CN 201721198576U CN 207353245 U CN207353245 U CN 207353245U
- Authority
- CN
- China
- Prior art keywords
- metal
- polyhedral
- led
- led encapsulation
- another side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title claims abstract description 60
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 60
- 238000005538 encapsulation Methods 0.000 title claims abstract description 32
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 229920003023 plastic Polymers 0.000 claims abstract description 22
- 239000007924 injection Substances 0.000 claims abstract description 10
- 238000002347 injection Methods 0.000 claims abstract description 10
- 238000005452 bending Methods 0.000 claims abstract description 4
- 239000002991 molded plastic Substances 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 150000003384 small molecules Chemical class 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
It the utility model is related to a kind of polyhedral LED encapsulation modules of metal, specifically, metallic plate is made to the circuit board being supported with injection, plastic support is not provided with broken line position is folded, led chips and/or soldered elements are encapsulated on the circuit board, polyhedral stereochemical structure is folded into, is linked together behind folding between face by the metal dowel of bending, end to end place after folding, takes following fixed form to be fixed：Head and the tail metal welds together fixation, the metal connecting sheet on either one side is buckled in the frosting of another side or is buckled in hole or half bore, or the clasp nail of one side plastics is anchored in hole or the half bore of another side plastics, the clasp nail of either one side metal is anchored in hole or the half bore of another side metal, the connection sheet of either one side metal is buckled in another side metallic surface, forms a kind of polyhedral LED encapsulation modules of metal.
Description
Technical field
It the utility model is related to LED application fields, and in particular to a kind of polyhedral LED encapsulation modules of metal.
Background technology
Refolding is of high cost into tridimensional polyhedral module after welding LED lamp bead with traditional circuit-board on the market now, and
Making in the gum resin of wiring board material or/and in the solder mask of wiring board has small-molecule substance spilling, is made when with module
Light bulb, is sealed in blister, and the small-molecule substance of spilling, which deposits to glass bulb inner surface, causes light bulb light decay, the present inventor it
The supporting plate encapsulation of the LED circuit module of the Patent No. " 201220381225.2 " of preceding invention, simply a plane, does not roll over
Tridimensional polyhedral is built up, causes LED light direction of illumination single, it is uneven, it is impossible to realize that LED shines to shining around three dimensions
Penetrate, some places form dim spot.
The defects of in order to overcome the above and deficiency, the polyhedral LED encapsulation modules of a kind of metal of the invention, using by gold
Belong to plate and the circuit board being supported with injection is made, then packaging LED chips and/or soldered elements, be folded into polyhedral vertical
Body structure, its LED bulb made, while solve the problems, such as that small-molecule substance overflow problem and LED light direction of illumination are single,
The light efficiency of LED bulb, and perfect heat-dissipating are improved, simple in structure, efficient, cost is low.
Utility model content
A kind of polyhedral LED encapsulation modules of metal are the utility model is related to, specifically, metallic plate is made with injection
The circuit board of plastic support, then packaging LED chips and/or welding LED element, folding form polyhedral stereochemical structure,
End to end place after folding, takes following fixed form to be fixed：Head and the tail metal welds together fixation；Either on one side
Metal connecting sheet be buckled in the frosting of another side or be buckled in hole or half bore；Or the clasp nail of one side plastics is anchored to separately
In the hole of side plastics or half bore；The clasp nail of either one side metal is anchored in hole or the half bore of another side metal, forms a kind of gold
Belong to polyhedral LED encapsulation modules.
A kind of polyhedral LED encapsulation modules of metal are provided according to the utility model, including：Supported with injection-moulded plastic
Metallic circuit；The LED chip, and/or welding LED element being encapsulated on metallic circuit；It is characterized in that, by metallic plate system
Into the circuit board being supported with injection, plastic support is not provided with broken line position is folded, LED is encapsulated on the circuit board
Chip and/or soldered elements, are folded into polyhedral stereochemical structure, are connected behind folding between face by the metal dowel of bending
Together, end to end place after folding, takes following fixed form to be fixed：Head and the tail metal welds together fixation,
The frosting that the metal connecting sheet on either one side is buckled in another side is either buckled in hole or half bore or the button of one side plastics
Nail catcher is in the hole of another side plastics or half bore, or the clasp nail of one side metal is anchored in hole or the half bore of another side metal,
The connection sheet of either one side metal is buckled in another side metallic surface.
An embodiment according to the present utility model, a kind of polyhedral LED encapsulation modules of metal, its feature exist
In the metallic circuit supported with injection-moulded plastic, is provided with injection-moulded plastic reflector at packaging LED chips position.
An embodiment according to the present utility model, a kind of polyhedral LED encapsulation modules of metal, its feature exist
In the LED chip being encapsulated on metallic circuit is formal dress routing chip or the upside-down mounting core that is welded on circuit
Piece or the CSP chips being welded on stent.
An embodiment according to the present utility model, a kind of polyhedral LED encapsulation modules of metal, its feature exist
In power drives element, can be directly welded on circuit board by the metallic circuit supported with injection-moulded plastic.
An embodiment according to the present utility model, a kind of polyhedral LED encapsulation modules of metal, its feature exist
In the LED encapsulation modules are used for the making of light bulb.
Below in the description of the drawings and specific embodiments, will illustrate one or more embodiments of the utility model
Details.
Brief description of the drawings
By reading this specification in conjunction with the following drawings, the feature, objects and advantages of the utility model will become more to show
And be clear to, it is as follows to the brief description of accompanying drawing.
Fig. 1 is the schematic diagram of the metallic circuit supported with injection-moulded plastic.
Fig. 2 is the schematic diagram after die bond bonding wire on metallic circuit.
Fig. 3 is the schematic perspective view of the polyhedral LED encapsulation modules of metal.
Fig. 4 is that LED encapsulation modules are folded into the end to end place after polyhedron and are welded together using head and the tail metal, and one
The connection sheet of side metal is buckled in the schematic cross-section that the mode of another side metallic surface is fixed.
Fig. 5 is that LED encapsulation modules are folded into the end to end place after polyhedron and are buckled in separately using the metal connecting sheet on one side
The schematic cross-section that the mode of the frosting on one side is fixed.
Fig. 6 be LED encapsulation modules be folded into the end to end place after polyhedron be anchored to using the clasp nail of one side plastics it is another
The schematic cross-section that mode in the plastics button hole of side is fixed.
Fig. 7 be LED encapsulation modules be folded into the end to end place after polyhedron be anchored to using the clasp nail of one side metal it is another
The schematic cross-section that mode in the button hole of side metal is fixed.
Embodiment
The utility model will be described in detail by taking preferred embodiment as an example below.
It should be appreciated to those skilled in the art that as described below be merely illustrative and describe some sides of being preferable to carry out
Formula, claim to the utility model simultaneously do not have any restrictions.
As shown in Figure 1, according to the data of design, the pre-designed mould punching of metallic plate is removed into unwanted gold
Belong to, and one side Punching Technology at the end to end place after postorder folding goes out metal connecting sheet button 1.2, is fabricated to circuit board blank
1, the then surface progress electrosilvering processing at the position that postorder needs bonding wire and LED chip luminous reflecting, next in day
The circuit board after silver-plated process is inserted in injection mold on smart injection molding machine, injection raw material injection, is designing predetermined position shape
Into plastic support 2, and reflector 2.2 is formed at the position for needing packaging LED chips, and it is end to end after postorder folding
The another side at place is formed and the supporting plastics button hole 2.1 of metal connecting sheet button 1.2, folds in postorder and is not set at position of broken line 1.1
Plastic support is put, is fabricated to the metallic circuit supported with injection-moulded plastic.Then on light DB382 bonders are helped, by LED chip
In the reflector 2.2 of 3 die bonds on circuit boards, baking-curing, then by ASM-AB350 bonding equipments with metal wire 4 by core
Bonding wire connects between chip and metallic circuit between piece and chip, and the encapsulation glue dispenser containing fluorescent powder is uniform
Point after baking-curing, is fabricated to the semi-finished product of the polyhedral LED encapsulation modules of metal as shown in Figure 2 in reflector 2.2.
The semi-finished product of LED encapsulation modules as shown in Figure 2 are folded into polyhedral three-dimensional knot as shown in Figure 3 with mould
Structure, is linked together between face by the metal dowel 1.1 of bending behind folding, the gold on the one side at the end to end place after folding
Category connection sheet button 1.2, which is buckled in the plastics button hole 2.1 of another side, is fixedly secured shaping, is fabricated to the polyhedral LED encapsulation of metal
Module (as shown in Figure 3).The fixed form at the end to end place after folding certainly can also take following fixed form to be consolidated
It is fixed：The mode that head and the tail metal 1a, 1b as shown in Figure 4 welds together is fixed；The metal connecting sheet 1b on one side as shown in Figure 5
The mode for being buckled in the plastics 2a surfaces of another side is fixed；The clasp nail 2b of one side plastics as shown in Figure 6 is anchored to another side plastic button
Mode in the 2a of hole is fixed；The mode that the clasp nail 1b of one side metal as shown in Figure 7 is anchored in the button hole 1a of another side metal is consolidated
It is fixed；The mode that the connection sheet 1b of one side metal as shown in Figure 4 is buckled in the surface of another side metal 1a is fixed.
A kind of polyhedral LED encapsulation modules of metal of the utility model, are made what is be supported with injection by metallic plate
Circuit board, then encapsulates led chips and/or soldered elements, is folded into polyhedral stereochemical structure, its LED bulb made, together
When solve the problems, such as that small-molecule substance overflow problem and LED light direction of illumination are single, improve the light efficiency of LED bulb, and
Perfect heat-dissipating, simple in structure, efficient, cost is low.
A kind of specific embodiment of the polyhedral LED encapsulation modules of metal carries out the utility model above in association with attached drawing
Detailed description.It will be understood by those skilled in the art, however, that the above is merely illustrative and to describe some specific
Embodiment, the scope to this with new scope, especially claim, and do not have any restrictions.
Claims (5)
1. a kind of polyhedral LED encapsulation modules of metal, including：
The metallic circuit supported with injection-moulded plastic；
The LED chip, and/or welding LED element being encapsulated on metallic circuit；
It is characterized in that, metallic plate to be made to the circuit board being supported with injection, plastics branch is not provided with broken line position is folded
Support, packaging LED chips and/or soldered elements on the circuit board are folded into polyhedral stereochemical structure, behind folding with
Linked together between face by the metal of bending, end to end place after folding, takes following fixed form to be fixed：From beginning to end
Metal welds together fixation, or the metal connecting sheet on one side is buckled in the frosting of another side, or one side metal
Clasp nail is buckled in plastic eyelet or the half bore of another side, or the clasp nail of one side plastics is anchored in hole or the half bore of another side plastics,
The either clasp nail of one side metal is anchored in hole or the half bore of another side metal, or one side metal connection sheet be buckled in it is another
Side metallic surface.
A kind of 2. polyhedral LED encapsulation modules of metal according to claim 1, it is characterised in that the injection modeling
Expect the metallic circuit of support, injection-moulded plastic reflector is provided with packaging LED chips position.
3. the polyhedral LED encapsulation modules of a kind of metal according to claim 1, it is characterised in that described to be encapsulated in gold
LED chip on category circuit board is formal dress routing chip or the flip-chip being welded on circuit or is welded to
CSP chips on stent.
4. the polyhedral LED encapsulation modules of a kind of metal according to claim 1, it is characterised in that with injection-moulded plastic branch
Power drives element, can be directly welded on circuit board by the metallic circuit of support.
A kind of 5. polyhedral LED encapsulation modules of metal according to claim 1, it is characterised in that the LED encapsulation
Module is used for the making of light bulb.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721198576.9U CN207353245U (en) | 2017-09-11 | 2017-09-11 | A kind of polyhedral LED encapsulation modules of metal |
| PCT/CN2018/104912 WO2019047959A1 (en) | 2017-09-11 | 2018-09-10 | Led encapsulation module formed of metal polyhedron |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721198576.9U CN207353245U (en) | 2017-09-11 | 2017-09-11 | A kind of polyhedral LED encapsulation modules of metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207353245U true CN207353245U (en) | 2018-05-11 |
Family
ID=62410154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721198576.9U Expired - Fee Related CN207353245U (en) | 2017-09-11 | 2017-09-11 | A kind of polyhedral LED encapsulation modules of metal |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207353245U (en) |
| WO (1) | WO2019047959A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019047959A1 (en) * | 2017-09-11 | 2019-03-14 | 王定锋 | Led encapsulation module formed of metal polyhedron |
| WO2019057143A1 (en) * | 2017-09-22 | 2019-03-28 | 王定锋 | Led bulb made from combination of multiple circuit board packaging modules |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202927518U (en) * | 2012-07-19 | 2013-05-08 | 王定锋 | Three-dimensional luminous light-emitting diode (LED) bulb module |
| CN203784697U (en) * | 2014-03-27 | 2014-08-20 | 四川新力光源股份有限公司 | Bulb lamp |
| JP2016115645A (en) * | 2014-12-18 | 2016-06-23 | 岩崎電気株式会社 | LED lamp |
| CN106402681A (en) * | 2016-10-17 | 2017-02-15 | 漳州立达信光电子科技有限公司 | LED (Light-emitting diode) lighting device |
| CN207353245U (en) * | 2017-09-11 | 2018-05-11 | 王定锋 | A kind of polyhedral LED encapsulation modules of metal |
-
2017
- 2017-09-11 CN CN201721198576.9U patent/CN207353245U/en not_active Expired - Fee Related
-
2018
- 2018-09-10 WO PCT/CN2018/104912 patent/WO2019047959A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019047959A1 (en) * | 2017-09-11 | 2019-03-14 | 王定锋 | Led encapsulation module formed of metal polyhedron |
| WO2019057143A1 (en) * | 2017-09-22 | 2019-03-28 | 王定锋 | Led bulb made from combination of multiple circuit board packaging modules |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019047959A1 (en) | 2019-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180511 Termination date: 20210911 |