CN214203677U - High-density material-saving lead frame for bent lead type diode - Google Patents
High-density material-saving lead frame for bent lead type diode Download PDFInfo
- Publication number
- CN214203677U CN214203677U CN202120520185.4U CN202120520185U CN214203677U CN 214203677 U CN214203677 U CN 214203677U CN 202120520185 U CN202120520185 U CN 202120520185U CN 214203677 U CN214203677 U CN 214203677U
- Authority
- CN
- China
- Prior art keywords
- pin
- diode
- lead
- frame
- pole piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a lead frame for lead wire formula diode is buckled to high density festival material type, including the section bar, its characterized in that: the diode frame structure is characterized in that a plurality of diode frame units are uniformly distributed on the section bar at intervals, one or two diode forming bodies are arranged in each diode frame unit, and each diode forming body is composed of a first pin, a second pin, a chip supporting sheet and a lead pole piece. The utility model has the advantages of scientific and reasonable design, have the density of arranging high, save the section bar, reduce diode processing cost, convenient operation, easily realize, be a lead frame for high density festival material type lead wire formula diode of buckling that has higher novelty.
Description
Technical Field
The utility model relates to a diode, especially a lead frame for lead wire formula diode is buckled to high density festival material type.
Background
With the advancement of electronic semiconductor technology, diodes have evolved from axial plug-in type diodes to bent-pin patch diodes to flat-pin patch diodes. Electronic products gradually develop towards miniaturization, and ultrathin flat-pin type surface-mounted diodes grow explosively in recent years and gradually replace traditional diodes.
The flat-pin diode sold in the market at present mainly has three types of package bonding structures, namely a connection piece bonding structure (clip bonding), a wire bonding structure (wire bonding) and a double lead frame bonding structure (double lead frame), wherein the connection piece bonding structure is most widely applied.
For the diode with the connecting sheet welding structure, the processing needs to be finished on two section bar frames, namely a lead frame with a connecting sheet is processed on one section bar and a chip lead frame is processed on the other section bar, when the processing is carried out, the lead frame with the connecting sheet needs to be manufactured firstly, then one or a plurality of connecting sheets are punched and cut from the section bar of the lead frame at a time, and then the punched connecting sheets are sucked and placed on the chip lead frame for welding; in order to facilitate the injection molding of the subsequent package casing, a special area is generally reserved on the lead frame and used as a special channel for the epoxy resin injection molding, so that the area required by a single chip lead unit is increased, the number of the single chip lead units distributed on a frame profile is reduced, the discharging rate of the profile is low, and the cost is increased for enterprises.
To sum up, it is necessary to provide a frame which can save the processing of frame section bar, has high discharging rate and can ensure the normal encapsulation of the encapsulation shell.
Disclosure of Invention
An object of the utility model is to overcome prior art not enough, provide a lead frame for lead wire formula diode is buckled to high density festival material type that design scientific and reasonable, the density of arranging is high, save the section bar, reduce diode processing cost, convenient operation, easily realize.
The utility model provides a its technical problem take following technical scheme to realize:
the utility model provides a lead wire frame for lead wire formula diode is buckled to high density festival material type, includes the section bar, its characterized in that: the LED module comprises a profile, a plurality of diode frame units, one or two diode forming bodies, a chip supporting sheet and a lead pole piece, wherein the profile is uniformly distributed on the profile at intervals, each diode forming body consists of a first pin, a second pin, a chip supporting sheet and a lead pole piece, the first pin and the second pin which are integrated with the profile are oppositely arranged on the left side and the right side in the frame of the diode frame unit, an L-shaped lead pole piece is integrally formed at the position, close to the right side, of the lower side of the first pin, and consists of a connecting piece part vertically arranged with the first pin and a lead pole piece part vertically arranged at the root part of the connecting piece part, and the first pin, the connecting piece part and the lead pole piece part are all on the same horizontal plane; and a chip supporting sheet which is positioned on the same horizontal plane with the second pin is integrally formed at the left end of the second pin.
Moreover, the thickness of the lead pole piece is smaller than that of the first pin.
And the bottoms of the end surfaces of the opposite sides of the first pin and the second pin are respectively provided with a glue grabbing notch, and the angle formed by the glue grabbing notches is a sharp-angled structure.
The utility model has the advantages that:
1. according to the high-density material-saving lead frame for the bent lead type diode, the functions of the lead frame with the connecting sheet (lead pole piece) and the chip lead frame are integrated, so that the step of processing the chip lead frame and the use of a processed section are firstly saved; and through reasonable layout in the diode frame unit, the space of a subsequent injection molding packaging cover can be reserved while the lead pole piece molding is met, the space of the section bar is fully utilized, the density of the diode frame unit on the section bar is increased, and the cost of raw materials of products is reduced. The utility model discloses in integrating the chip lead frame with lead wire pole piece design, do not need extra connection piece, or metal wire, or second lead frame, fine cost advantage has.
2. According to the lead frame for the high-density material-saving bent lead type diode, through the design of the connecting piece part, on one hand, the lead frame can achieve the purpose of transitionally connecting the lead pole piece part, and the processing is convenient; on the other hand, after the connecting piece part is bent, an anti-glue-overflow cross section can be formed, and the anti-glue-overflow cross section can prevent the epoxy resin from flowing and permeating in the subsequent epoxy resin injection molding process, prevent the pin area of the product from generating glue overflow and prevent the product from being bad.
3. This lead frame for lead wire formula diode is buckled to high density festival material type through will grabbing gluey breach design for the closed angle structure, it can with injection mold surface subside really, reduces the excessive gluey gap, gluey dashing into when avoiding moulding plastics.
4. According to the high-density material-saving lead frame for the bent lead type diode, the thickness of the lead pole piece is designed to be smaller than that of the first pin, so that the stress inside the diode can be reduced by the lead pole piece with small thickness, the quality of the diode is improved, and meanwhile, the thickness of a diode packaging body is also reduced.
5. The utility model has the advantages of scientific and reasonable design, have the density of arranging high, save the section bar, reduce diode processing cost, convenient operation, easily realize, be a lead frame for high density festival material type lead wire formula diode of buckling that has higher novelty.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a partial enlarged view of the present invention;
fig. 3 is a schematic structural view of the diode molded body of the present invention after molding;
FIG. 4 is a bottom view of FIG. 3;
fig. 5 is a schematic structural view of the diode-formed body of the present invention arranged in axial symmetry at the frame;
fig. 6 is a schematic structural view of the diode-formed body of the present invention arranged in a central symmetry manner at the frame;
fig. 7 is a cross-sectional view of the first pin and the lead plate of the present invention;
fig. 8 is a schematic structural view of the lead pole piece of fig. 7 after being bent upward by 180 °.
Description of the reference numerals
The chip packaging structure comprises a 1-section bar, a 2-diode frame unit, a 3-first pin, a 4-bending line, a 5-connecting piece part, a 6-lead pole piece part, a 7-chip supporting piece, a 8-second pin, a 9-first horizontal section, a 10-first inclined section, a 11-second horizontal section, a 12-diode chip, a 13-second inclined section, a 14-third horizontal section, a 15-glue overflow prevention section and a 16-glue grabbing notch.
Detailed Description
The embodiments of the present invention will be described in detail with reference to the accompanying drawings:
the utility model provides a lead frame for lead wire formula diode is buckled to high density festival material type, includes section bar 1, and its innovation point lies in: a plurality of diode frame units 2 are uniformly distributed on the section bar at intervals, each diode frame unit is provided with one or two diode forming bodies, as shown in figure 2, a diode forming body is arranged in the diode frame, each diode forming body consists of a first pin 3, a second pin 8, a chip support sheet 7 and a lead pole piece, a first pin and a second pin which are integrated with the section bar are oppositely arranged at the left side and the right side in the frame of the diode frame unit, an L-shaped lead pole piece is integrally formed at the position close to the right side of the lower side of the first pin, the L-shaped lead pole piece consists of a connecting piece part 5 which is vertically arranged with the first pin and a lead pole piece part 6 which is vertically arranged at the root part of the connecting piece part, and the first pin, the connecting piece part and the lead pole piece part are all on the same horizontal plane, a bending line 4 is arranged on the connecting piece part; and a chip supporting sheet which is positioned on the same horizontal plane with the second pin is integrally formed at the left end of the second pin. Through the design of the connecting piece part, on one hand, the connecting piece part can achieve the purpose of connecting the lead pole piece part in a transition mode, and the processing is convenient; on the other hand, after the connecting piece is bent, an anti-glue-overflow cross section 15 can be formed, and the cross section can block the flowing and permeation of epoxy resin in the subsequent epoxy resin injection molding process, prevent the pin area of the product from generating glue overflow, and prevent the product from being bad.
The thickness of the lead pole piece is smaller than that of the first pin.
As shown in fig. 5 and fig. 6, the present invention further provides two arrangements of the diode forming bodies in the diode frame unit, i.e. axisymmetric distribution and centrosymmetric distribution. The manufacturing process steps are reduced and the flow is simplified by the axisymmetric distribution mode; the centrosymmetric distribution mode enables the forming of the left and right lead pole pieces to be easily carried out step by step, and improves the precision and quality of bending forming.
During the forming process, firstly, a diode chip 12 is placed at the chip supporting sheet, and the diode chip and the chip supporting sheet are bonded or welded together through solder; the chip and the support area can also be soldered together in other ways, such as eutectic soldering; then, arranging solder (tin paste) on the upper surface of the diode chip;
secondly, bending the lead pole pieces in sequence to form a first horizontal section 9, a first inclined section 10, a second horizontal section 11, a second inclined section 13 and a third horizontal section 14, namely, the right side of the first horizontal section is bent upwards in an inclined mode to form the first inclined section, the right side of the first inclined section is bent horizontally to form the second horizontal section, the right side of the second horizontal section is bent downwards in an inclined mode to form the second inclined section, and the right side of the second inclined section is bent horizontally to form the third horizontal section;
then, bending the lead pole piece upwards by 180 degrees along the bending line at the connecting piece part to enable the lead pole piece to be arranged on the upper end surface of the first pin, wherein the head part of the lead pole piece, namely the third horizontal section, is in contact with the upper surface of the diode chip, and at the moment, the second horizontal section is higher than the first horizontal section and the third horizontal section and meets the welding conditions of the diode lead pole piece;
then, welding the third horizontal section and the upper surface of the diode chip together through a welding furnace, and welding the chip supporting chip and the lower surface of the chip together;
then, the first pin is connected with the upper surface of the diode chip, and the second pin is connected with the lower surface of the diode chip, so that the welding process of the diode is completed;
and finally, injection molding the packaging body on the molded diode body.
Among the prior art, when moulding plastics, the problem of excessive glue can appear, and the gluey of overflowing flows to pin department, can influence electrically conductive effect, and traditional method can adopt sand blasting machine to clear away, but because the material undersize, can cause the deformation of tablet at the in-process of clearing away, leads to the rising of rejection rate. The utility model discloses a section is glued to the anti-overflow and the setting of grabbing gluey breach, fine solution this problem.
Although the embodiments of the present invention and the accompanying drawings are disclosed for illustrative purposes, those skilled in the art will appreciate that: various substitutions, changes and modifications are possible without departing from the spirit and scope of the present invention and the appended claims, and therefore, the scope of the present invention is not limited to the disclosure of the embodiments and the accompanying drawings.
Claims (3)
1. The utility model provides a lead wire frame for lead wire formula diode is buckled to high density festival material type, includes the section bar, its characterized in that: the LED module comprises a profile, a plurality of diode frame units, one or two diode forming bodies, a chip supporting sheet and a lead pole piece, wherein the profile is uniformly distributed on the profile at intervals, each diode forming body consists of a first pin, a second pin, a chip supporting sheet and a lead pole piece, the first pin and the second pin which are integrated with the profile are oppositely arranged on the left side and the right side in the frame of the diode frame unit, an L-shaped lead pole piece is integrally formed at the position, close to the right side, of the lower side of the first pin, and consists of a connecting piece part vertically arranged with the first pin and a lead pole piece part vertically arranged at the root part of the connecting piece part, and the first pin, the connecting piece part and the lead pole piece part are all on the same horizontal plane; and a chip supporting sheet which is positioned on the same horizontal plane with the second pin is integrally formed at the left end of the second pin.
2. The lead frame for a high-density material-saving bent-lead diode according to claim 1, wherein: the thickness of the lead pole piece is smaller than that of the first pin.
3. The lead frame for a high-density material-saving bent-lead diode according to claim 1, wherein: and glue grabbing notches are arranged at the bottoms of the end surfaces of the opposite sides of the first pin and the second pin, and the corners formed by the glue grabbing notches are of sharp-angled structures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120520185.4U CN214203677U (en) | 2021-03-12 | 2021-03-12 | High-density material-saving lead frame for bent lead type diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120520185.4U CN214203677U (en) | 2021-03-12 | 2021-03-12 | High-density material-saving lead frame for bent lead type diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214203677U true CN214203677U (en) | 2021-09-14 |
Family
ID=77640233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120520185.4U Active CN214203677U (en) | 2021-03-12 | 2021-03-12 | High-density material-saving lead frame for bent lead type diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214203677U (en) |
-
2021
- 2021-03-12 CN CN202120520185.4U patent/CN214203677U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN214203677U (en) | High-density material-saving lead frame for bent lead type diode | |
| CN202977380U (en) | Line type pressure welding clamp used for QFN, DFN integrated circuit packaging | |
| CN210743964U (en) | Packaging frame based on photovoltaic module | |
| CN219180507U (en) | Rectifier module packaging structure | |
| CN202075772U (en) | Contact-type integrated card (IC) module | |
| CN110828432A (en) | Power semiconductor module | |
| CN214203673U (en) | Bending lead type ultrathin diode | |
| CN207353245U (en) | A kind of polyhedral LED encapsulation modules of metal | |
| CN202816923U (en) | Lead-wire frame used for integrated circuit ceramic package housing | |
| CN109830588A (en) | A kind of lead frame of LED support, LED support manufacturing process and LED support | |
| CN113035821A (en) | Lead frame for diode forming, diode and manufacturing method of diode | |
| CN201853700U (en) | Array type double in-line package (DIP) lead frame and integrated circuit (IC) encapsulating piece of frame | |
| CN100490198C (en) | Paster diode producing method | |
| CN109378307B (en) | Production method of multi-chip module type packaging structure | |
| CN114141636A (en) | Double-sided plastic package method of circuit board and double-sided plastic package circuit board | |
| CN108389854B (en) | Ultrathin miniature bridge rectifier | |
| CN207217480U (en) | A kind of more row high-density lead frame bonding tools | |
| CN211404491U (en) | Tin-absorption visual angle lead frame structure | |
| CN216354122U (en) | Paster diode frame sintering positioning jig | |
| CN213242536U (en) | Digital product chip packaging base | |
| CN205810797U (en) | A kind of rectifier bridge welding structure | |
| CN108962857A (en) | A kind of SIP integrated circuit package structure merging SMT | |
| CN213936145U (en) | Feeding push rod | |
| CN219534523U (en) | Lead frame | |
| CN210866170U (en) | Power semiconductor module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |