CN114141636A - Double-sided plastic package method of circuit board and double-sided plastic package circuit board - Google Patents
Double-sided plastic package method of circuit board and double-sided plastic package circuit board Download PDFInfo
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- CN114141636A CN114141636A CN202111295292.2A CN202111295292A CN114141636A CN 114141636 A CN114141636 A CN 114141636A CN 202111295292 A CN202111295292 A CN 202111295292A CN 114141636 A CN114141636 A CN 114141636A
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
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- 238000004519 manufacturing process Methods 0.000 abstract description 10
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- 238000010586 diagram Methods 0.000 description 4
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
The invention discloses a double-sided plastic package method of a circuit board and the circuit board with double-sided plastic package. The double-sided plastic package method of the circuit board comprises the following steps: mounting electronic devices on the front and back surfaces of the circuit board; mounting a support piece on the front surface or the back surface of the circuit board, wherein the height of the support piece is higher than that of the electronic device; erecting the circuit board on a substrate through the supporting piece, and fixedly connecting the supporting piece and the substrate to obtain a piece to be molded and packaged; and fixing the to-be-plastic-packaged piece in a plastic packaging mold, and filling plastic packaging materials to the front side and the back side of the circuit board to obtain the circuit board with double-sided plastic packaging. The double-sided plastic package method for the circuit board can realize double-sided plastic package on the circuit board at one time, reduces the plastic package times and improves the production efficiency.
Description
Technical Field
The invention relates to the technical field of plastic package of circuit boards, in particular to a double-sided plastic package method of a circuit board and the circuit board with double-sided plastic package.
Background
In some circuit boards used in precision instruments, the circuit boards are usually packaged in order to protect the circuit performance from moisture, foreign substances, and other environmental factors. The encapsulation can be realized by using wax or asphalt as a sealant, or by plastically encapsulating the whole circuit board by using a plastic encapsulating material.
In the prior art, although the circuit board is packaged in a plastic package manner, although the prior art has many advantages, the plastic package of the double-sided printed circuit board usually requires two plastic package processes. Namely, the plastic package is firstly carried out on one surface of the circuit board, and then the plastic package is carried out on the other surface of the circuit board, which wastes time and labor. Therefore, how to complete plastic package on the double surfaces of the circuit board at one time is a problem which needs to be solved urgently.
Disclosure of Invention
The invention aims to provide a double-sided plastic packaging method of a circuit board and a novel technical scheme of a double-sided injection molded circuit board.
According to a first aspect of the present invention, a double-sided plastic package method for a circuit board is provided, which includes the following steps:
mounting electronic devices on the front and back surfaces of the circuit board;
mounting a support piece on the front surface or the back surface of the circuit board, wherein the height of the support piece is higher than that of the electronic device; erecting the circuit board on a substrate through the supporting piece, and fixedly connecting the supporting piece and the substrate to obtain a piece to be molded and packaged;
and fixing the to-be-plastic-packaged part in a plastic packaging mold, and filling plastic packaging materials to the front side and the back side of the circuit board to obtain the circuit board with double-sided plastic packaging.
Optionally, the mounting the electronic device on the front and back of the circuit board by using an SMT sheet mounting process includes:
mounting an electronic device on the front surface of the circuit board by adopting solder paste;
mounting an electronic device on the back surface of the circuit board by adopting solder paste;
wherein the melting point of the back solder paste is lower than that of the front solder paste.
Optionally, the support member is attached at the same time when the electronic device is attached to the front surface of the circuit board.
Optionally, the base plate is made of a metal material, and the support member is fixedly connected with the base plate by welding.
Optionally, the substrate is a copper sheet, and after plastic packaging is completed, the substrate is removed from the double-sided plastic packaged circuit board.
Optionally, the substrate is made of resin or glass material, the supporting member is bonded to the substrate, and the plastic package is completed by a compression molding process.
Optionally, a plurality of circuit modules are arranged on the circuit board;
and cutting the circuit board subjected to double-sided plastic package to obtain a single circuit module.
Optionally, the supporting member is attached to an edge of each circuit module, and when the double-sided plastic package circuit board is cut, the supporting member is cut off at the same time.
Optionally, the number of the supporting members is two, and the two supporting members are respectively attached to two ends of the circuit board.
Optionally, the supporting members are provided in plural numbers, and the plural supporting members are respectively attached to the corners of the circuit board.
According to a second aspect of the present invention, there is provided a circuit board with double-sided plastic package, comprising:
the double-sided circuit board comprises a double-sided circuit board, a supporting piece and a plastic package structure;
one end of the supporting piece is attached to one surface of the double-sided circuit board, the plastic package structure is packaged on two sides of the double-sided circuit board, and the end face of the other end of the supporting piece is flush with the outer side face of the plastic package structure.
Optionally, the double-sided plastic package circuit board further includes a substrate, and the substrate is attached to the outer side of the plastic package structure and fixedly connected to the end face of the support member.
Optionally, the height of the supporting member is higher than the height of the electronic device mounted on the corresponding side of the double-sided circuit board.
According to one embodiment of the disclosure, a support piece is pasted on one surface of a circuit board with electronic devices pasted on two sides, the circuit board is erected on a substrate through the support piece, so that when the circuit board is located in a plastic package mold, the electronic devices on one side of the support piece are suspended, and a plastic package material can flow along the substrate and is filled to the front side and the back side of the circuit board at one time. The operation mode is simple, the plastic packaging times of the double-sided plastic packaging circuit board are reduced, and the production efficiency is improved.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic view of a single side of a circuit board in the present application with an electronic device and a support attached.
Fig. 2 is a schematic structural view of a circuit board with electronic devices mounted on both sides and a support member mounted on one side.
Fig. 3 is a schematic structural diagram of a to-be-molded part with two circuit modules arranged on a circuit board in the present application.
Fig. 4 is a schematic diagram of a circuit board double-sided plastic package according to the present application.
Fig. 5 is a schematic diagram of the circuit board with the substrate removed by the double-sided plastic package in the present application.
Fig. 6 is a schematic view of the present application with the support member retained when a plurality of circuit modules are divided.
Fig. 7 is a schematic view of the present application with the support members removed when the plurality of circuit modules are divided.
1, a circuit board; 2. an electronic device; 3. a support member; 4. a substrate; 5. and (5) plastic package structure.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The plastic package of the circuit board 1 can ensure that the electronic device 2 on the circuit board 1 is not damaged by the external environment, so that the service life of the circuit board 1 is prolonged, and the integrity of the circuit module can be improved, so that the assembly efficiency of the electronic equipment is improved. With the increasing functions and the increasing requirements for light weight and thinness of electronic devices, many circuit boards 1 are designed as double-sided mounting electronic devices 2, but when the double-sided circuit boards 1 are packaged, two times of packaging operations need to be performed on the front side and the back side, and certain cold curing time is required between the two times of packaging, so that the process is more, and time and labor are wasted.
Referring to fig. 1 to 7, the present application provides a double-sided plastic package method for a circuit board 1, which can complete plastic package for the circuit board 1 with an electronic device 2 attached to both sides at one time, and is time-saving and labor-saving, and specifically includes the following steps:
mounting electronic devices 2 on the front and back surfaces of the circuit board 1; a support member 3 is attached to the front surface or the back surface of the circuit board 1, and the height of the support member 3 is higher than that of the electronic device 2; erecting the circuit board 1 on a substrate 4 through the support member 3, and fixedly connecting the support member 3 and the substrate 4 to obtain a part to be molded; and fixing the to-be-plastic-packaged piece in a plastic packaging mold, and filling plastic packaging materials to the front side and the back side of the circuit board 1 to obtain the circuit board 1 with double-sided plastic packaging.
In the actual operation process, the front surface and the back surface of the circuit board 1, that is, the two side surfaces of the circuit board 1, do not need to be distinguished, and when one of the surfaces is defined as the front surface, the other surface is the back surface. In addition, the mounting of the support member 3 can be performed simultaneously when the electronic device 2 on the front surface or the back surface is mounted, and can also be performed independently after the electronic device 2 is mounted, and the application does not limit the mounting sequence. After the plastic package is completed, the obtained double-sided plastic package circuit board 1 may be directly applied to an electronic device, or may be reprocessed according to actual requirements, such as cutting or grinding in terms of shape and thickness, which is not limited in this application.
The specific operation method of the scheme can be carried out according to the following steps:
A. as shown in fig. 1, according to the functional requirements of the circuit board 1, the electronic device 2 is mounted on the front or back surface thereof, and this process may be performed by selecting either manual mounting or machine mounting according to the quantity and scale of the circuit boards 1, the mounting accuracy requirements, and the like.
B. As shown in fig. 2, the support member 3 is continuously mounted on the front or rear surface of the circuit board 1. This operation may also be performed before the electronic device 2 is mounted, or after the electronic device 2 on one side is mounted (as shown in fig. 1, a schematic diagram of the support 3 is also mounted while the electronic device 2 is mounted on one side of the circuit board 1), and the specific mounting sequence may be selected according to actual requirements and a design scheme of the circuit board 1, which is not limited in this application.
It should be noted that the height of the mounted support member 3 needs to be higher than that of the other electronic devices 2 on the same surface, so that the electronic devices 2 are suspended in the plastic package process, and the electronic devices 2 are prevented from touching the plastic package mold and damaging the electronic devices 2. As shown in fig. 2, the supporting member 3 has a supporting function on the entire circuit board 1, and at this time, the electronic device 2 attached below the circuit board 1 is suspended in the air relative to the horizontal plane on which the supporting member 3 is placed, so as to prevent the electronic device 2 from contacting with the side wall of the plastic package mold in the subsequent plastic package process.
C. As shown in fig. 3, the circuit board 1 is erected on a substrate 4 through the supporting member 3, and the supporting member 3 is fixedly connected with the substrate 4, so as to obtain a to-be-molded component. The fixing connection manner of the support 3 and the substrate 4 may be selected according to the characteristics of the substrate 4 or the material of the support 3, and the like, which is not limited in the present application. In addition, the position of the support member 3 on the circuit board 1 may be selected from the non-functional region of the circuit board 1, or may be directly disposed on the edge of the circuit board 1, so long as the substrate 4 can stably support the entire circuit board 1. The shape of the supporting member 3 may be a bar, a column, a block, etc. (such as the supporting bar illustrated in fig. 1), which is not limited in this application.
D. The circuit board 1 erected on the substrate 4 through the support member 3, that is, the to-be-molded component is fixed in the plastic package mold, wherein the to-be-molded component may be fixed in the plastic package mold through the substrate 4, or may be fixed in other manners, and specifically, the to-be-molded component may be selected according to a structure of the mold, which is not limited in this application.
After the plastic package part is fixed, carrying out die assembly and plastic package, filling injection molding materials to two sides of the circuit board, and carrying out one-time plastic package on the front side and the back side of the circuit board to form a plastic package structure 5. In the plastic packaging process, the supporting piece 3 plays a role in supporting the whole circuit board 1, so that the electronic device 2 is suspended in the plastic packaging mold, the electronic device 2 is prevented from touching the wall of the mold, the phenomenon that the electronic device 2 is too large in mold flow and impacts the electronic device 2 is avoided, and the yield of plastic packaged products is improved. On the other hand, in the plastic package process, the substrate 4 provides a bearing platform for the mold flow of the plastic package, so that the plastic package material can flow to two sides of the circuit board 1 along the substrate 4 to fill the cavity of the plastic package mold. And after the plastic packaging is finished, obtaining the circuit board 1 with double-sided plastic packaging after the device is cooled.
E. The obtained double-sided plastic package circuit board can be reprocessed according to requirements so as to meet the requirements of electronic equipment.
The method for double-sided plastic package of the circuit board 1 has the advantages that the circuit board 1 with the electronic devices attached to the two sides can be subjected to plastic package at one time, the process is simple, the operation is easy, the time for plastic package is greatly saved, the labor and material cost is saved, the production efficiency is improved, and the method is particularly suitable for large-batch plastic package requirements.
Optionally, the electronic device is attached to the front and back of the circuit board 1 by using an SMT sheet mounting process, which specifically includes the following steps: mounting an electronic device on the front surface of the circuit board 1 by adopting solder paste; mounting an electronic device on the back surface of the circuit board 1 by adopting solder paste; wherein the melting point of the back solder paste is lower than that of the front solder paste. Alternatively, the support member 3 is mounted at the same time when the electronic device 2 is mounted on the front surface of the circuit board 1.
Specifically, the SMT pick and place process refers to a short name of a series of process flows processed on the basis of a PCB (printed circuit board 1). The SMT mounting technique is a circuit connecting technique in which a surface-mounted device without leads or short leads is mounted on the surface of a printed circuit board 1 or other substrate 4, and then soldered or assembled by reflow soldering or dip soldering. In this embodiment, the electronic devices 2 on the front and back sides of the circuit board 1 can be mounted by SMT mounting technology, and the supporting members 3 (as shown in fig. 1) can be mounted while the front electronic devices 2 or the back electronic devices are mounted, that is, solder paste for mounting the supporting members 3 can be printed while the electronic devices 2 are mounted by printing solder paste on the circuit board 1, so that a process of separately mounting the supporting members 3 is omitted.
Preferably, the support 3 is attached at the same time as the electronic device 2 is attached on the front side of the circuit board 1 (i.e. when the first side is attached, as shown in fig. 1). The mounting mode can ensure that the supporting piece 3 can also play a certain supporting role when the electronic device 2 on the back side is mounted, so that the electronic device 2 on the back side is suspended, and the electronic device 2 on the front side is prevented from being damaged when the electronic device 2 on the back side is mounted.
It should be noted that when the electronic device 2 on the back side is mounted, a lower temperature solder paste is required to be used for mounting, so as to prevent the solder paste used for mounting the electronic device 2 on the front side of the circuit board 1 from being melted during the mounting process. In addition, in this embodiment, the electronic device on the back side may be mounted first, and the melting point of the front side solder paste should be lower than that of the back side solder paste.
Optionally, the base plate 4 is made of a metal material, and the support 3 and the base plate 4 are fixedly connected by welding.
Specifically, in the plastic encapsulation process, the substrate 4 needs to bear the impact of the mold flow, and the substrate 4 made of a metal material can provide stronger supporting force. In addition, if the mold flow impacts too much during the plastic encapsulation process, the connection between the support member 3 and the substrate 4 may fail, so that the electronic device 2 is directly impacted by the mold flow and damaged. In this embodiment, the mounting portion of the support member 3 and the substrate 4 may also be made of a metal material, and the mounting portion and the metal substrate 4 are mounted in a welding manner, so that the connection firmness of the support member and the metal substrate is enhanced, and the yield of plastic-sealed finished products is improved.
Optionally, the substrate 4 is a copper sheet, and after plastic package is completed, the substrate 4 is removed from the double-sided plastic package circuit board 1.
Specifically, in the present embodiment, the substrate 4 is made of a copper sheet. Copper has good weldability and relatively low cost in metal materials with good weldability. On the one hand, the connection stability of the support member 3 and the base plate 4 is improved, and on the other hand, the cost is also reduced. In addition, copper also has good conductive performance, and after the plastic package is finished, the copper sheet can be removed, as shown in fig. 5, so that short circuit with other electronic devices 2 is avoided, and the safety of the circuit board 1 is improved. In actual production, the molded circuit board 1 often needs to be reprocessed and ground in terms of shape, thickness and the like, and the copper sheets can be removed simultaneously with the steps, so that redundant steps are not increased.
When the metal material or the copper sheet is adopted as the substrate 4, the plastic package mode is selected more, the plastic package can be completed by adopting an injection molding process, and the plastic package can also be completed by adopting a compression molding process, which is not limited in the application. When the plastic package is performed by adopting an injection molding process, the mold flow is large, and the welding of the metal material or the copper and the support piece 3 can bear the large mold flow impact, so that the selection range of the plastic package process is wide.
Optionally, the substrate 4 is made of resin or glass material, the support member 3 is bonded to the substrate 4, and the plastic package is completed by a compression molding process.
Specifically, in the present embodiment, the substrate 4 may also be made of resin, glass, or the like. The substrate 4 made of resin, glass, or the like may be fixed to the support 3 by bonding with glue or the like. It should be noted that, when a resin material is used as the substrate 4, the melting point of the resin material needs to be higher than that of the molding compound, so as to avoid melting the substrate 4 at a high temperature during the molding process. In addition, in the plastic packaging process, a compression molding process with small mold flow can be adopted to complete the plastic packaging process, so that the support piece 3 is prevented from being separated from the substrate 4 due to overlarge impact. After the plastic package is completed, the resin or glass substrate 4 is easily removed, and the circuit performance of the circuit board 1 is not affected.
Alternatively, as shown in fig. 6 or fig. 7, a plurality of circuit modules are arranged on the circuit board 1; and cutting the circuit board subjected to double-sided plastic package to obtain a single circuit module.
In particular, the present application may be applicable to mass production. Before plastic packaging, a batch of circuit modules can be distributed on the circuit board 1 according to actual requirements, and after the plastic packaging is completed, the circuit modules are cut one by one according to the arrangement positions of the circuit modules (refer to fig. 6 and 7), so that the production efficiency is improved, and the production cost is reduced. In the present embodiment, the supporting member 3 may be disposed in the non-functional region between the circuit modules, or may be disposed at the edge of the entire circuit board 1 (refer to fig. 5 to 7), which is not limited in the present application.
Optionally, the supporting member 3 is attached to an edge of each of the circuit modules (as shown in fig. 5 to 7), and the supporting member 3 is cut off when the double-sided plastic package circuit board is cut off.
Specifically, in this embodiment, the position of the supporting member 3 is located at the edge of each circuit module, and this arrangement can provide a better supporting function for the whole circuit board 1, thereby ensuring that the electronic device 2 on each circuit module can bear the impact of the plastic package mold flow, and improving the yield of the plastic package. In the present embodiment, the support 3 may be removed (refer to fig. 7) or left as needed (refer to fig. 6). If the circuit module is required to be removed, the circuit module can be simultaneously divided, so that the production process is saved, and the production efficiency is improved.
Alternatively, two supporting members 3 are provided, and the two supporting members 3 are attached to both ends of the circuit board 1, respectively.
Specifically, in this embodiment, the supporting members 3 may be disposed at two ends of one surface of the small circuit board 1, so as to save materials, reduce mounting processes, and improve production efficiency.
Alternatively, a plurality of the supporting members 3 are provided, and the plurality of the supporting members 3 are respectively attached to the corners of the circuit board 1.
In particular, in the present embodiment, the supporting members 3 are respectively attached to the corners of the circuit board 1, and can provide a good supporting function for some special-shaped circuit boards 1.
The following is a description of the specific operation steps of a preferred embodiment in conjunction with the above examples to further illustrate the advantages of the present application.
A. As shown in fig. 1, the electronic device 2 and the support member 3 are mounted on the front surface of the circuit board 1 simultaneously using solder paste using an SMT pick and place process. Wherein, the support member 3 is made of strip-shaped metal material, which is convenient for realizing SMT paster technique. Wherein, a plurality of circuit modules can be arranged on the circuit board 1, and the edge of each circuit module is provided with a supporting piece 3.
B. As shown in fig. 2, the electronic device 2 is mounted on the back side of the circuit board 1 by using the SMT pad process with lower temperature solder paste (where the lower temperature is relative to the front side mounting temperature).
C. As shown in fig. 3, the circuit board 1 is mounted (welded) on a copper sheet (substrate 4) by a support member 3 by using an SMT surface mount technology, so that the circuit board 1 is erected on the copper sheet to obtain a member to be molded.
D. As shown in fig. 4, a to-be-plastic-packaged part is fixed in a plastic package mold through a copper sheet, plastic package materials are filled to the front and the back of the circuit board 1 by adopting an injection molding process, the circuit board 1 is subjected to one-step plastic package molding, and after cooling, both sides of the circuit board 1 are provided with plastic package structures 5, so that the circuit board 1 with double-sided plastic package is obtained.
E. The copper sheet was ground away as shown in fig. 5. As shown in fig. 6 and 7, the circuit board 1 having a plurality of circuit modules is divided, and the support member 3 is removed simultaneously as necessary.
According to a second aspect of the present application, referring to fig. 5, there is provided a double-sided plastic-encapsulated circuit board, comprising a double-sided circuit board 1, a support member 3 and a plastic-encapsulated structure 5; one end of the support piece 3 is attached to one surface of the double-sided circuit board 1, and the plastic package structure 5 is packaged on two sides of the double-sided circuit board, so that the end face of the other end of the support piece 3 is flush with the outer side face of the plastic package structure 5.
Specifically, the double-sided plastic-packaged circuit board 1 provided in this embodiment is a product formed by one-time injection molding, and compared with a circuit board formed by plastic-packaging on two sides by using a conventional process, the circuit board has a firm plastic-packaging structure 5 and a long service life. In the plastic packaging process, the electronic devices on the same side can be suspended by the supporting piece, so that the electronic devices are prevented from being impacted by plastic packaging mold flow. .
Optionally, referring to fig. 4, the circuit board of the double-sided plastic package further includes a substrate 4, and the substrate 4 is attached to the outer side of the plastic package structure 5 and is fixedly connected to the end face of the support member 3. Optionally, the height of the supporting member 3 is higher than the height of the electronic device mounted on the corresponding side of the double-sided circuit board 1.
The substrate 4 fixed on the end face of the support member 3 can provide a flowing platform for the plastic package mold flow in the plastic package process, so that the plastic package material can fill the two sides of the double-sided circuit board at one time to form the plastic package structure 5. In addition, the height of the supporting piece 3 is higher than that of the electronic device mounted on the corresponding surface of the double-sided circuit board, so that the electronic device can be protected to a certain extent.
In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.
Although some specific embodiments of the present invention have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustrative purposes only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (13)
1. A double-sided plastic package method of a circuit board is characterized by comprising the following steps:
mounting electronic devices on the front and back surfaces of the circuit board;
mounting a support piece on the front surface or the back surface of the circuit board, wherein the height of the support piece is higher than that of the electronic device; erecting the circuit board on a substrate through the supporting piece, and fixedly connecting the supporting piece and the substrate to obtain a piece to be molded and packaged;
and fixing the to-be-plastic-packaged piece in a plastic packaging mold, and filling plastic packaging materials to the front side and the back side of the circuit board to obtain the circuit board with double-sided plastic packaging.
2. The double-sided plastic package method of the circuit board according to claim 1, wherein the electronic device is mounted on the front and back surfaces of the circuit board by using an SMT pick and place process, comprising:
mounting an electronic device on the front surface of the circuit board by adopting solder paste;
mounting an electronic device on the back surface of the circuit board by adopting solder paste;
wherein the melting point of the back solder paste is lower than that of the front solder paste.
3. A double-sided plastic package method for circuit boards according to claim 2, wherein the supporting members are attached simultaneously when the electronic devices are attached to the front side of the circuit board.
4. The double-sided plastic package method of the circuit board as recited in claim 1, wherein the substrate is made of a metal material, and the supporting member is fixedly connected to the substrate by soldering.
5. The double-sided plastic package method of the circuit board according to claim 4, wherein the substrate is a copper sheet, and after the plastic package is completed, the substrate is removed from the double-sided plastic package circuit board.
6. A double-sided plastic package method for circuit boards according to claim 1, wherein the substrate is made of resin or glass material, the supporting member is bonded to the substrate, and the plastic package is completed by a compression molding process.
7. The double-sided plastic package method of the circuit board according to claim 1, wherein a plurality of circuit modules are arranged on the circuit board;
and cutting the circuit board subjected to double-sided plastic package to obtain a single circuit module.
8. The method of claim 7, wherein the supporting members are attached to the edges of each of the circuit modules, and the supporting members are cut off when the double-sided plastic package circuit board is cut.
9. The double-sided plastic package method for the circuit board as recited in claim 1, wherein there are two supporting members, and the two supporting members are respectively attached to two ends of the circuit board.
10. The double-sided plastic package method of the circuit board as recited in claim 1, wherein a plurality of the supporting members are provided, and the plurality of the supporting members are respectively attached to the corners of the circuit board.
11. The utility model provides a circuit board of two-sided plastic envelope which characterized in that includes:
the double-sided circuit board comprises a double-sided circuit board, a supporting piece and a plastic package structure;
one end of the supporting piece is attached to one surface of the double-sided circuit board, the plastic package structure is packaged on two sides of the double-sided circuit board, and the end face of the other end of the supporting piece is flush with the outer side face of the plastic package structure.
12. The circuit board according to claim 11, further comprising a substrate, wherein the substrate is attached to an outer side of the plastic package structure and is fixedly connected to the end surface of the supporting member.
13. The circuit board according to claim 11, wherein the supporting member has a height higher than a height of the electronic device mounted on the corresponding side of the double-sided circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111295292.2A CN114141636B (en) | 2021-11-03 | 2021-11-03 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
| PCT/CN2022/128707 WO2023078213A1 (en) | 2021-11-03 | 2022-10-31 | Double-sided plastic packaging method for circuit board, and circuit board having double-sided plastic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111295292.2A CN114141636B (en) | 2021-11-03 | 2021-11-03 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN114141636A true CN114141636A (en) | 2022-03-04 |
| CN114141636B CN114141636B (en) | 2023-11-07 |
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| CN202111295292.2A Active CN114141636B (en) | 2021-11-03 | 2021-11-03 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
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| Country | Link |
|---|---|
| CN (1) | CN114141636B (en) |
| WO (1) | WO2023078213A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023078213A1 (en) * | 2021-11-03 | 2023-05-11 | 青岛歌尔微电子研究院有限公司 | Double-sided plastic packaging method for circuit board, and circuit board having double-sided plastic packaging |
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| JP2012028487A (en) * | 2010-07-22 | 2012-02-09 | Panasonic Corp | Resin-sealed substrate device and method of manufacturing the same |
| CN109257888A (en) * | 2018-08-22 | 2019-01-22 | 维沃移动通信有限公司 | A kind of circuit board double-faced packaging method, structure and mobile terminal |
| CN109559996A (en) * | 2018-11-13 | 2019-04-02 | 无锡中微高科电子有限公司 | A kind of PoP plastic device preparation method of 3D high density interconnection |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI663701B (en) * | 2017-04-28 | 2019-06-21 | 矽品精密工業股份有限公司 | Electronic package and method for fabricating the same |
| CN109003906B (en) * | 2018-06-22 | 2020-05-22 | 江苏长电科技股份有限公司 | Substrate double-sided plastic packaging process method |
| CN114141636B (en) * | 2021-11-03 | 2023-11-07 | 青岛歌尔微电子研究院有限公司 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
-
2021
- 2021-11-03 CN CN202111295292.2A patent/CN114141636B/en active Active
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2022
- 2022-10-31 WO PCT/CN2022/128707 patent/WO2023078213A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012028487A (en) * | 2010-07-22 | 2012-02-09 | Panasonic Corp | Resin-sealed substrate device and method of manufacturing the same |
| CN109257888A (en) * | 2018-08-22 | 2019-01-22 | 维沃移动通信有限公司 | A kind of circuit board double-faced packaging method, structure and mobile terminal |
| CN109559996A (en) * | 2018-11-13 | 2019-04-02 | 无锡中微高科电子有限公司 | A kind of PoP plastic device preparation method of 3D high density interconnection |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023078213A1 (en) * | 2021-11-03 | 2023-05-11 | 青岛歌尔微电子研究院有限公司 | Double-sided plastic packaging method for circuit board, and circuit board having double-sided plastic packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023078213A1 (en) | 2023-05-11 |
| CN114141636B (en) | 2023-11-07 |
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