CN114141636B - Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board - Google Patents
Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board Download PDFInfo
- Publication number
- CN114141636B CN114141636B CN202111295292.2A CN202111295292A CN114141636B CN 114141636 B CN114141636 B CN 114141636B CN 202111295292 A CN202111295292 A CN 202111295292A CN 114141636 B CN114141636 B CN 114141636B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- double
- sided
- plastic
- plastic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 47
- 230000008093 supporting effect Effects 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 238000010137 moulding (plastic) Methods 0.000 claims abstract description 9
- 239000012778 molding material Substances 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000012958 reprocessing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 description 24
- 239000000463 material Substances 0.000 description 10
- 238000012858 packaging process Methods 0.000 description 10
- 238000000465 moulding Methods 0.000 description 9
- 239000007769 metal material Substances 0.000 description 8
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000000748 compression moulding Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The application discloses a double-sided plastic packaging method of a circuit board and the double-sided plastic packaged circuit board. The double-sided plastic packaging method of the circuit board comprises the following steps: mounting electronic devices on the front and back surfaces of the circuit board; mounting a support piece on the front or back of the circuit board, wherein the height of the support piece is higher than that of the electronic device; erecting the circuit board on a substrate through the supporting piece, and fixedly connecting the supporting piece and the substrate to obtain a piece to be molded; and fixing the to-be-molded part in a plastic molding die, and filling plastic molding materials into the front and back surfaces of the circuit board to obtain the double-sided plastic-packaged circuit board. The double-sided plastic packaging method of the circuit board can realize double-sided plastic packaging of the circuit board at one time, reduces the plastic packaging times and improves the production efficiency.
Description
Technical Field
The application relates to the technical field of plastic packaging of circuit boards, in particular to a double-sided plastic packaging method of a circuit board and a double-sided plastic packaged circuit board.
Background
In some circuit boards for precision instruments, the circuit boards are often packaged in order to protect the circuit performance from environmental factors such as moisture, foreign matter, and the like. The encapsulation can be realized by adopting wax or asphalt as sealant, and can also be realized by adopting plastic packaging material to carry out plastic packaging on the whole circuit board.
In the prior art, the circuit board is packaged in a plastic packaging mode, but the plastic packaging of the double-sided printed circuit board generally needs to carry out two plastic packaging procedures, although the plastic packaging has a plurality of advantages. Namely, firstly, one surface of the circuit board is subjected to plastic packaging, and then the other surface of the circuit board is subjected to plastic packaging, which is time-consuming and labor-consuming. Therefore, how to complete plastic packaging on both sides of the circuit board at one time is an urgent problem to be solved.
Disclosure of Invention
The application aims to provide a double-sided plastic packaging method of a circuit board and a novel technical scheme of the double-sided plastic packaging method of the circuit board.
According to a first aspect of the present application, there is provided a double-sided plastic packaging method of a circuit board, including the steps of:
mounting electronic devices on the front and back surfaces of the circuit board;
mounting a support piece on the front or back of the circuit board, wherein the height of the support piece is higher than that of the electronic device; erecting the circuit board on a substrate through the supporting piece, and fixedly connecting the supporting piece and the substrate to obtain a piece to be molded;
and fixing the to-be-molded part in a plastic molding die, so that plastic molding materials are filled into the front and back surfaces of the circuit board, and the circuit board with double-sided plastic molding is obtained.
Optionally, mounting the electronic device on the front and back sides of the circuit board using an SMT pick-and-place process, comprising:
the front surface of the circuit board is provided with an electronic device by adopting solder paste;
mounting electronic devices on the back of the circuit board by using solder paste;
wherein, the melting point of the back solder paste is lower than that of the front solder paste.
Optionally, the support member is mounted simultaneously when the electronic device is mounted on the front surface of the circuit board.
Optionally, the substrate is made of a metal material, and the support member is fixedly connected with the substrate through welding.
Optionally, the substrate is a copper sheet, and after the plastic packaging is completed, the substrate is removed from the circuit board with the double-sided plastic packaging.
Optionally, the substrate is made of resin or glass material, the supporting piece is adhered to the substrate, and the plastic package is completed by adopting a compression molding process.
Optionally, a plurality of circuit modules are arranged on the circuit board;
and dividing the circuit board with the double-sided plastic package to obtain a single circuit module.
Optionally, the support member is attached to an edge of each circuit module, and the support member is separated at the same time when the circuit board with the double-sided plastic package is separated.
Optionally, two supporting pieces are provided, and the two supporting pieces are respectively attached to two ends of the circuit board.
Optionally, the support member is provided in plural, and plural support members are respectively attached to the respective corners of the circuit board.
According to a second aspect of the present application, there is provided a circuit board of double-sided plastic package, comprising:
the double-sided circuit board, the supporting piece and the plastic package structure;
one end of the supporting piece is attached to one surface of the double-sided circuit board, the plastic package structure is packaged on two sides of the double-sided circuit board, and the end face of the other end of the supporting piece is enabled to be flush with the outer side face of the plastic package structure.
Optionally, the circuit board with the double-sided plastic package further comprises a substrate, wherein the substrate is attached to the outer side of the plastic package structure and is fixedly connected with the end face of the supporting piece.
Optionally, the height of the supporting piece is higher than the height of the electronic device mounted on the corresponding surface of the double-sided circuit board.
According to one embodiment of the disclosure, the support piece is attached to one surface of the circuit board, which is attached to the electronic devices on two sides of the circuit board, the circuit board is erected on the substrate through the support piece, so that when the circuit board is positioned in the plastic package die, the electronic devices on one side of the support piece are suspended, and the plastic package material can flow along the substrate and is filled to the front surface and the back surface of the circuit board at one time. The operation mode is simple, the plastic packaging times of the double-sided plastic packaging circuit board are reduced, and the production efficiency is improved.
Other features of the present application and its advantages will become apparent from the following detailed description of exemplary embodiments of the application, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a schematic view of a circuit board of the present application with electronic components and a support attached to one side thereof.
Fig. 2 is a schematic diagram of a circuit board with electronic components mounted on both sides and a support mounted on one side.
Fig. 3 is a schematic structural diagram of a to-be-molded package with two circuit modules arranged on a circuit board according to the present application.
Fig. 4 is a schematic diagram of a circuit board with double-sided plastic package according to the present application.
Fig. 5 is a schematic view of a circuit board with a double-sided plastic package removed substrate according to the present application.
Fig. 6 is a schematic diagram of the present application with the support member retained when dividing a plurality of circuit modules.
Fig. 7 is a schematic diagram of the present application with the support removed to divide a plurality of circuit modules.
1, a circuit board; 2. an electronic device; 3. a support; 4. a substrate; 5. and (5) a plastic package structure.
Detailed Description
Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
The plastic packaging of the circuit board 1 can ensure that the electronic device 2 on the circuit board 1 is not damaged by the external environment, the service life of the circuit board 1 is prolonged, and the integrity of the circuit module and the assembly efficiency of the electronic equipment can be improved. Along with the increasing functions and the increasing demand for thinning and thinning of electronic equipment, many circuit boards 1 are double-sided mounted electronic devices 2, but when packaging such double-sided circuit boards 1, two packaging operations are required for the front and the back, and a certain cold setting time is required between the two packaging operations, so that the process is more, and time and labor are wasted.
Referring to fig. 1 to 7, the application provides a double-sided plastic packaging method of a circuit board 1, which can complete plastic packaging of the circuit board 1 with electronic devices 2 attached on both sides at one time, and the method is time-saving and labor-saving, and specifically comprises the following steps:
mounting electronic devices 2 on the front and back surfaces of the circuit board 1; mounting a support 3 on the front or back of the circuit board 1, wherein the height of the support 3 is higher than that of the electronic device 2; erecting the circuit board 1 on a substrate 4 through the supporting piece 3, and fixedly connecting the supporting piece 3 and the substrate 4 to obtain a piece to be molded; and fixing the to-be-molded part in a plastic molding die, so that plastic molding materials are filled into the front and back surfaces of the circuit board 1, and the double-sided plastic-packaged circuit board 1 is obtained.
The front and back sides of the circuit board 1, i.e. the two sides of the circuit board 1, need not be specially distinguished during actual operation, and when one of the sides is defined as the front side, the other side is the back side. In addition, the mounting of the supporting member 3 may be performed simultaneously when the front or rear electronic device 2 is mounted, or may be performed separately after the electronic device 2 is mounted. After the plastic packaging is completed, the obtained double-sided plastic-packaged circuit board 1 can be directly applied to electronic equipment, and can be reprocessed according to actual requirements, such as cutting or grinding in terms of shape and thickness, and the application is not limited to the above.
The specific operation method of the scheme can be carried out according to the following steps:
A. as shown in fig. 1, the electronic device 2 is mounted on the front or back of the circuit board 1 according to the functional requirement of the circuit board 1, and the process can select manual mounting or machine mounting according to the number scale of the circuit board 1, the mounting precision requirement and the like.
B. As shown in fig. 2, the support 3 is continuously attached to the front or back of the circuit board 1. This operation may also be performed before the electronic device 2 is mounted, or after the electronic device 2 on one side is mounted (as shown in fig. 1, a schematic view of mounting the electronic device 2 on one side of the circuit board 1 and mounting the supporting member 3 at the same time), where the specific mounting order may be selected according to the actual requirement and the design scheme of the circuit board 1, which is not limited in the present application.
It should be noted that the height of the support 3 after mounting needs to be higher than that of other electronic devices 2 on the same surface, so that the electronic devices 2 are suspended in the plastic packaging process, and the electronic devices 2 are prevented from touching the plastic packaging mold and damaging the electronic devices 2. As shown in fig. 2, the supporting member 3 has a supporting function on the whole circuit board 1, and at this time, the electronic device 2 attached below the circuit board 1 is suspended relative to the horizontal plane on which the supporting member 3 is placed, so as to avoid the electronic device 2 contacting with the side wall of the plastic packaging mold in the subsequent plastic packaging process.
C. As shown in fig. 3, the circuit board 1 is erected on a substrate 4 through the supporting member 3, and the supporting member 3 is fixedly connected with the substrate 4, so as to obtain a to-be-molded component. The fixing connection manner of the supporting member 3 and the substrate 4 may be selected according to the characteristics of the substrate 4 or the material of the supporting member 3, which is not limited in the present application. In addition, the location of the supporting member 3 on the circuit board 1 may be selected from nonfunctional areas of the circuit board 1, or may be directly disposed at the edge of the circuit board 1, so long as the substrate 4 can stably support the entire circuit board 1. The shape of the support member 3 may be a bar, a column, a block, etc. (e.g., a support bar as illustrated in fig. 1), which is not limited in the present application.
D. The circuit board 1 erected on the substrate 4 through the supporting member 3, namely, the to-be-molded member is fixed in the plastic packaging mold, wherein the to-be-molded member can be fixed in the plastic packaging mold through the substrate 4 or can be fixed in other modes, and the to-be-molded member can be specifically selected according to the structure of the mold, and the application is not limited to the above.
After the plastic package is fixed, the plastic package is molded, so that the injection molding material is filled to the two sides of the circuit board, and the front and the back of the circuit board are molded at one time, so as to form the plastic package structure 5. In the plastic packaging process, the supporting piece 3 plays a role in supporting the whole circuit board 1, so that the electronic device 2 is suspended in the plastic packaging die, the electronic device 2 is prevented from touching the wall of the die, the electronic device 2 is prevented from being impacted due to overlarge die flow, and the product yield of plastic packaging is improved. On the other hand, in the plastic packaging process, the substrate 4 provides a bearing platform for the plastic packaging mold flow, so that the plastic packaging material can flow to two sides of the circuit board 1 along the substrate 4, and the cavity of the plastic packaging mold is filled. And after the plastic package is finished, cooling the device to obtain the circuit board 1 with the double-sided plastic package.
E. The obtained double-sided plastic-packaged circuit board can be reprocessed according to requirements so as to meet the requirements of electronic equipment.
The method for double-sided plastic packaging of the circuit board 1 provided by the application can be used for plastic packaging the circuit board 1 with the electronic device attached on both sides at one time, has the advantages of simple process, easiness in operation, great saving in plastic packaging time, saving in labor and material costs, improvement in production efficiency and suitability for mass plastic packaging requirements.
Optionally, the electronic device is mounted on the front and back sides of the circuit board 1 by using an SMT mounting process, which specifically includes the following steps: the front surface of the circuit board 1 is provided with an electronic device by solder paste; the back of the circuit board 1 is pasted with an electronic device by using solder paste; wherein, the melting point of the back solder paste is lower than that of the front solder paste. Alternatively, the supporting member 3 is mounted at the same time when the electronic device 2 is mounted on the front surface of the circuit board 1.
Specifically, the SMT pick and place process refers to an abbreviation of a series of process flows for processing on the basis of a PCB (printed circuit board 1). The SMT chip mounting technology is a circuit mounting technology in which no-lead or short-lead surface-mounted components are mounted on the surface of the printed circuit board 1 or the surface of another substrate 4, and are soldered and assembled by reflow soldering or dip soldering. In this embodiment, the electronic devices 2 on the front and back sides of the circuit board 1 can be mounted by SMT technology, and the supporting member 3 (as shown in fig. 1) can be mounted at the same time when the front electronic device 2 or the back electronic device is mounted, that is, when the electronic device 2 is printed on the circuit board 1, the solder paste on the portion of the supporting member 3 can be printed at the same time, so that the process of individually mounting the supporting member 3 is omitted.
Preferably, the support 3 is mounted simultaneously when the electronic device 2 is mounted on the front surface of the circuit board 1 (i.e., when the first surface is mounted, as shown in fig. 1). The mounting mode can enable the supporting piece 3 to play a certain supporting role when the electronic device 2 on the back is mounted, so that the electronic device 2 on the back is suspended, and the front electronic device 2 is prevented from being damaged when the electronic device 2 on the back is mounted.
It should be noted that, in mounting the electronic device 2 on the back side, it is necessary to use a lower Wen Xigao mounting process, so as to avoid melting the solder paste of the electronic device 2 on the front side of the mounting circuit board 1 during the mounting process. In addition, in this embodiment, the electronic device on the back side may be mounted first, and the melting point of the front solder paste should be lower than that of the back solder paste.
Alternatively, the base plate 4 is made of a metal material, and the supporting member 3 is fixedly connected with the base plate 4 by welding.
Specifically, during the plastic packaging process, the substrate 4 needs to bear the impact of the mold flow, and the substrate 4 made of metal material can provide stronger supporting force. In addition, if the die flow is too large during the molding process, the connection between the support member 3 and the substrate 4 may be failed, so that the electronic device 2 is directly impacted by the die flow to cause damage. In this embodiment, the mounting portion between the supporting member 3 and the substrate 4 may be made of a metal material, and the mounting portion and the metal substrate 4 are welded together, so that the connection firmness of the supporting member and the substrate 4 is enhanced, and the yield of the plastic package finished product is improved.
Optionally, the substrate 4 is a copper sheet, and after the plastic packaging is completed, the substrate 4 is removed from the circuit board 1 with the double-sided plastic packaging.
Specifically, in the present embodiment, the substrate 4 is made of a copper sheet. Copper has good solderability and is relatively low cost in metallic materials with good solderability. On the one hand, the connection stability of the support 3 to the base plate 4 is improved and on the other hand the costs are reduced. In addition, copper also has good conductivity, and after the plastic packaging is finished, the copper sheet can be removed, as shown in fig. 5, so that the copper sheet is prevented from forming short circuit with other electronic devices 2, and the safety of the circuit board 1 is improved. In actual production, the plastic-encapsulated circuit board 1 often needs to be reworked and ground in terms of shape, thickness and the like, and the copper sheets can be removed simultaneously with the processes, so that no extra process is added.
When the metal material or the copper sheet is used as the substrate 4, the plastic packaging mode is more selected, and the plastic packaging can be finished by adopting an injection molding process or a compression molding process, which is not limited in the application. When the plastic packaging process is adopted, the plastic packaging process has larger die flow, and the welding of the metal material or copper and the support piece 3 can bear larger die flow impact, so that the selection range of the plastic packaging process is wider.
Alternatively, the substrate 4 is made of resin or glass material, the supporting member 3 is adhered to the substrate 4, and the plastic packaging is performed by a compression molding process.
Specifically, in the present embodiment, the substrate 4 may be made of a material such as resin or glass. The base plate 4 of a material such as resin, glass, or the like may be bonded and fixed to the support 3 by glue or the like. It should be noted that when a resin material is used as the substrate 4, the melting point thereof needs to be higher than that of the molding compound, so that the substrate 4 is prevented from being melted at a high temperature during the molding process. In addition, in the plastic packaging process, a compression molding process with smaller mold flow can be adopted to finish, so that the support piece 3 and the substrate 4 are prevented from being separated due to overlarge impact. After the molding is completed, the substrate 4 made of resin or glass is easily removed, and the circuit performance of the circuit board 1 is not affected.
Alternatively, as shown in fig. 6 or 7, a plurality of circuit modules are arranged on the circuit board 1; and dividing the circuit board with the double-sided plastic package to obtain a single circuit module.
In particular, the present application can be applied to mass production. Before plastic packaging, a lot of circuit modules can be arranged on the circuit board 1 according to actual demands, after plastic packaging is completed, the circuit modules can be cut one by one according to the setting positions of the circuit modules (refer to fig. 6 and 7), so that the production efficiency is improved, and the production cost is reduced. In the present embodiment, the supporting member 3 may be provided in a nonfunctional area between the respective circuit modules, or may be provided at the edge of the entire circuit board 1 (refer to fig. 5 to 7), to which the present application is not limited.
Alternatively, the support 3 is attached at the edge of each of the circuit modules (as shown in fig. 5 to 7), and the support 3 is simultaneously separated when the double-sided plastic-packaged circuit board is divided.
Specifically, in this embodiment, the position of the supporting member 3 is located at the edge of each circuit module, and this arrangement mode can provide a better supporting effect for the whole circuit board 1, so as to ensure that the electronic devices 2 on each circuit module can bear the impact of the plastic package mold flow, and improve the yield of plastic package. In the present embodiment, the support 3 may be removed (refer to fig. 7) or left (refer to fig. 6) as needed. If the circuit module is required to be removed, the circuit module can be divided simultaneously, so that the production process is saved, and the production efficiency is improved.
Alternatively, the support members 3 are provided in two, and the two support members 3 are respectively attached at both ends of the circuit board 1.
Specifically, in the present embodiment, some small-sized circuit boards 1 can be provided with the supporting members 3 at both ends of one face thereof, which can save materials, reduce mounting processes, and improve production efficiency.
Alternatively, the support member 3 may be provided in plural, and the support member 3 may be attached to each corner of the circuit board 1.
Specifically, in the present embodiment, the supporting members 3 are attached to the respective corners of the circuit board 1, respectively, and can function well for some special-shaped circuit boards 1.
The following illustrates the specific operation steps of a preferred embodiment in conjunction with the above embodiments to further illustrate the advantages of the present application.
A. As shown in fig. 1, the electronic device 2 and the supporting member 3 are simultaneously mounted on the front surface of the circuit board 1 using a solder paste by an SMT process. Wherein, the support piece 3 is made of strip-shaped metal materials, which is convenient for realizing SMT (surface mount technology). Wherein, a plurality of circuit modules can be arranged on the circuit board 1, and the edge of each circuit module is provided with a supporting piece 3.
B. As shown in fig. 2, the SMT process is used to mount the electronic device 2 on the back side of the circuit board 1 at a lower Wen Xigao (here, the lower temperature is relative to the front side mounting temperature).
C. As shown in fig. 3, the SMT process is adopted to mount (solder) the circuit board 1 on a copper sheet (substrate 4) through the supporting member 3, so that the circuit board 1 is mounted on the copper sheet, and a to-be-molded part is obtained.
D. As shown in fig. 4, the part to be molded is fixed in a molding die through a copper sheet, the molding compound is filled into the front and the back of the circuit board 1 by adopting an injection molding process, the circuit board 1 is molded by one-step molding, and both sides of the circuit board 1 are provided with the molding structures 5 after cooling, so that the circuit board 1 with double-sided molding is obtained.
E. As shown in fig. 5, the copper sheet is ground away. As shown in fig. 6 and 7, the circuit board 1 having a plurality of circuit modules is divided, and the supporting members 3 are simultaneously removed as needed.
According to a second aspect of the present application, referring to fig. 5, there is provided a double-sided plastic-encapsulated circuit board, including a double-sided circuit board 1, a support 3, and a plastic-encapsulated structure 5; one end of the supporting piece 3 is attached to one surface of the double-sided circuit board 1, the plastic package structure 5 is packaged on two sides of the double-sided circuit board, and the end face of the other end of the supporting piece 3 is flush with the outer side face of the plastic package structure 5.
Specifically, the circuit board 1 with two plastic packages provided in this embodiment is a product formed by one injection molding, and compared with a circuit board formed by plastic packages on two sides by adopting a traditional process, the circuit board with two plastic packages has a firm plastic package structure 5 and a long service life. In the plastic packaging process, the supporting piece can suspend the electronic devices positioned on the same side, so that the impact of plastic packaging mold flow is avoided. .
Optionally, referring to fig. 4, the circuit board with double-sided plastic package further includes a substrate 4, where the substrate 4 is attached to the outer side of the plastic package structure 5 and is fixedly connected with the end surface of the support member 3. Optionally, the height of the supporting member 3 is higher than the height of the electronic device mounted on the corresponding surface of the double-sided circuit board 1.
The substrate 4 fixed on the end face of the supporting piece 3 can provide a flow platform for plastic package mold flow in a plastic package process, so that plastic package materials can be filled on two sides of the double-sided circuit board at one time to form a plastic package structure 5. In addition, the height of the supporting piece 3 is higher than that of the electronic device attached to the corresponding surface of the double-sided circuit board, so that the electronic device can be protected to a certain extent.
The foregoing embodiments mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in consideration of brevity of line text, no further description is given here.
While certain specific embodiments of the application have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the application. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.
Claims (9)
1. The double-sided plastic packaging method of the circuit board is characterized by comprising the following steps of:
adopting an SMT (surface mount technology) to mount an electronic device and a supporting piece on the front surface of a circuit board by using solder paste, wherein the height of the supporting piece is higher than that of the electronic device;
the back of the circuit board is provided with an electronic device by adopting solder paste, and the melting point of the solder paste at the back is lower than that of the solder paste at the front;
erecting the circuit board on a substrate through the supporting piece, and fixedly connecting the supporting piece and the substrate to obtain a piece to be molded, wherein the substrate is a copper sheet;
fixing the to-be-molded part in a plastic molding die, and filling plastic molding materials into the front and back surfaces of the circuit board to obtain a double-sided plastic-molded circuit board;
and (3) carrying out shape and thickness reprocessing and grinding on the circuit board subjected to double-sided plastic packaging, and grinding the substrate.
2. The method of double sided plastic packaging of a circuit board of claim 1, wherein the support and the substrate are fixedly connected by welding.
3. The method of double sided plastic packaging of a circuit board of claim 1, wherein the circuit board has a plurality of circuit modules disposed thereon;
and dividing the circuit board with the double-sided plastic package to obtain a single circuit module.
4. A double-sided plastic packaging method of circuit boards according to claim 3, wherein the supporting members are attached at the edge of each of the circuit modules, and the supporting members are simultaneously separated when the double-sided plastic packaged circuit boards are separated.
5. The method of double-sided plastic packaging of a circuit board according to claim 1, wherein two of the supporting members are provided, and the two supporting members are respectively attached at both ends of the circuit board.
6. The method of double-sided plastic packaging of a circuit board according to claim 1, wherein a plurality of the supporting members are provided, and the plurality of the supporting members are respectively attached to the corners of the circuit board.
7. A double-sided plastic-encapsulated circuit board produced according to the double-sided plastic-encapsulation method of any one of claims 1 to 6, comprising:
the double-sided circuit board, the supporting piece and the plastic package structure;
one end of the supporting piece is attached to one surface of the double-sided circuit board, the plastic package structure is packaged on two sides of the double-sided circuit board, and the end face of the other end of the supporting piece is enabled to be flush with the outer side face of the plastic package structure.
8. The double-sided plastic-encapsulated circuit board of claim 7, further comprising a substrate attached to the outside of the plastic-encapsulated structure and fixedly connected to the end face of the support member.
9. The double-sided plastic encapsulated circuit board of claim 7, wherein the support member has a height that is higher than a height of an electronic device mounted on a corresponding side of the double-sided circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111295292.2A CN114141636B (en) | 2021-11-03 | 2021-11-03 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
| PCT/CN2022/128707 WO2023078213A1 (en) | 2021-11-03 | 2022-10-31 | Double-sided plastic packaging method for circuit board, and circuit board having double-sided plastic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111295292.2A CN114141636B (en) | 2021-11-03 | 2021-11-03 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114141636A CN114141636A (en) | 2022-03-04 |
| CN114141636B true CN114141636B (en) | 2023-11-07 |
Family
ID=80392914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111295292.2A Active CN114141636B (en) | 2021-11-03 | 2021-11-03 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN114141636B (en) |
| WO (1) | WO2023078213A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141636B (en) * | 2021-11-03 | 2023-11-07 | 青岛歌尔微电子研究院有限公司 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012028487A (en) * | 2010-07-22 | 2012-02-09 | Panasonic Corp | Resin-sealed substrate device and method of manufacturing the same |
| CN109257888A (en) * | 2018-08-22 | 2019-01-22 | 维沃移动通信有限公司 | A kind of circuit board double-faced packaging method, structure and mobile terminal |
| CN109559996A (en) * | 2018-11-13 | 2019-04-02 | 无锡中微高科电子有限公司 | A kind of PoP plastic device preparation method of 3D high density interconnection |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI663701B (en) * | 2017-04-28 | 2019-06-21 | 矽品精密工業股份有限公司 | Electronic package and method for fabricating the same |
| CN109003906B (en) * | 2018-06-22 | 2020-05-22 | 江苏长电科技股份有限公司 | Substrate double-sided plastic packaging process method |
| CN114141636B (en) * | 2021-11-03 | 2023-11-07 | 青岛歌尔微电子研究院有限公司 | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board |
-
2021
- 2021-11-03 CN CN202111295292.2A patent/CN114141636B/en active Active
-
2022
- 2022-10-31 WO PCT/CN2022/128707 patent/WO2023078213A1/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012028487A (en) * | 2010-07-22 | 2012-02-09 | Panasonic Corp | Resin-sealed substrate device and method of manufacturing the same |
| CN109257888A (en) * | 2018-08-22 | 2019-01-22 | 维沃移动通信有限公司 | A kind of circuit board double-faced packaging method, structure and mobile terminal |
| CN109559996A (en) * | 2018-11-13 | 2019-04-02 | 无锡中微高科电子有限公司 | A kind of PoP plastic device preparation method of 3D high density interconnection |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114141636A (en) | 2022-03-04 |
| WO2023078213A1 (en) | 2023-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105721754B (en) | Camera module based on integrated packaging process | |
| CN101355073B (en) | Leadframe panel | |
| CN114141636B (en) | Double-sided plastic packaging method of circuit board and double-sided plastic packaged circuit board | |
| US20150096792A1 (en) | Electronic component unit and manufacturing method therefor | |
| US20140117525A1 (en) | Power module package and method of manufacturing the same | |
| KR100730626B1 (en) | Method of fabricating substrate for package of semiconductor light-emitting device | |
| CN101017785A (en) | Semiconductor stack structure and its making method | |
| CN105513977A (en) | Intelligent power module and packaging method thereof | |
| US20210043548A1 (en) | Electronic device with three dimensional thermal pad | |
| CN116631952A (en) | Ultra-low power consumption semiconductor power device and preparation method thereof | |
| CN102528357A (en) | Glue-dispensing positioning clamp and method for utilizing glue-dispensing positioning clamp to calibrate glue-dispensing needle head | |
| CN112397669B (en) | Display module, manufacturing method thereof and display device | |
| US7433199B2 (en) | Substrate structure for semiconductor package and package method thereof | |
| US11128048B2 (en) | Method of manufacturing coil component and jig used for manufacturing the coil component | |
| CN102403241B (en) | Double-side plastic packaging method of LGA (Land Grid Array) | |
| KR101319219B1 (en) | Terminal pin soldering jig for the power semiconductor module | |
| CN212136455U (en) | Surface-mounted photoelectric sensor manufactured by glue pouring process | |
| CN214203677U (en) | High-density material-saving lead frame for bent lead type diode | |
| CN202339565U (en) | Novel smart card | |
| CN219678837U (en) | Steel mesh and bonding pad structure of PCB | |
| JPH077033A (en) | Manufacture of semiconductor packaging device | |
| CN100583405C (en) | Foot manufacture method of small size chip module | |
| CN114156190A (en) | Jig for packaging and packaging method of circuit component | |
| CN111162015A (en) | Intelligent power module and packaging method | |
| CN114822298A (en) | Manufacturing method of display unit based on glass substrate and display unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |