CN202339565U - Novel smart card - Google Patents
Novel smart card Download PDFInfo
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- CN202339565U CN202339565U CN2011204247325U CN201120424732U CN202339565U CN 202339565 U CN202339565 U CN 202339565U CN 2011204247325 U CN2011204247325 U CN 2011204247325U CN 201120424732 U CN201120424732 U CN 201120424732U CN 202339565 U CN202339565 U CN 202339565U
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Abstract
The utility model discloses a novel smart card. Efficient product production is realized by adopting a process for encapsulating small cards of a plurality of smart cards simultaneously. The novel smart card module comprises a smart card module and a card base, wherein the card base is provided with a module installation groove hole; the smart card module consists of a substrate, a chip and an encapsulating body; the chip is arranged on the part surface of the substrate; the chip encapsulating body surrounds the outer side of the chip; the non-part surface of the substrate is provided with six or eight contacts which are accordant with an ISO7816 standard; the smart card module where the chip and the chip encapsulating body are arranged is jointed with the card base; and the chip encapsulating body is arranged in the groove hole of the card base. The novel smart card can be used for replacing the conventional smart card and is environmentally friendly, production efficiency is increased, production cost is lowered, and product reliability is improved.
Description
Technical field
The utility model relates to field of intelligent cards, and particularly the contact intelligent card field is specifically related to a kind of novel smart card.
Background technology
Smart card is a 21 century smart electronics product with the fastest developing speed, through multi-field application, each corner of being socially reintegrated.Like bank card, gate inhibition's card, mass transit card and SIM cards of mobile phones etc., our work and life have depended on the magical function of smart card.Traditional smart card is the slim card of a 85X54mm, and its thickness is 0.76mm, meets the mechanical dimension of ISO7816 and the requirement of electrical specification.Its core is a smart card module that is embedded in the card body, is made up of substrate, chip and some auxiliary material.
The general form of kilocalorie that adopts such as bank card, gate inhibition's card and mass transit card is used, and the SIM of mobile phone adopts the mode of lesser calorie to use bar none, and two kinds of sizes of miniature cards of lesser calorie or the 15X12mm of 25X15mm are arranged at present.In the smart card product in the whole world, SIM cards of mobile phones has occupied and has surpassed 80% share, and annual consumption is above 4,000,000,000! And during plant produced because the restriction of equipment is produced according to the technology of kilocalorie always, punch out the profile of lesser calorie then in the relevant position of kilocalorie; The user is after having bought card; Lesser calorie is broken off with the fingers and thumb down, and remaining kilocalorie card base has become waste material, is arbitrarily abandoned to cause environmental pollution.When traditional smart card module and Ka Ji fit,, module is separated with Ka Ji, make smart card disabled because the area that adhesive attaches is less.
The utility model is used the problem points that exists in order to solve lesser calorie class smart card product, considers from cost, reliability, environmental protection equal angles, all needs a kind of new technology to break through.We have proposed brand-new solution, the production technology of small intelligent card are simplified, efficient improves, reliability is higher, cost is lower, and accomplish environmental protection.
The utility model content
The utility model has proposed many notions that lesser calorie is made simultaneously to the problems referred to above in the production of smart card.This novel product through bare chip directly is installed on the substrate, couples together through the circuit of ultrasonic welding process with bonding pads and substrate, re-uses encapsulating compound with chip package.A kind of in addition approach is that bare chip is packaged into slim module through slim packaging technology, and the attachment process through the general surface mounting device is then crossed the Reflow Soldering mode with the link tester of the pad of module and substrate and solidified and couple together reliably.The smart card module that installs chip after attaching adhesive and being die-cut into individual module with the basic reliable connection of card, more multiunit kilocalorie is cut into the little card size that needs at last, like the miniature cards of lesser calorie or the 15X12mm of 25X15mm.The novel smart card of the utility model has been simplified the production procedure of traditional approach, and the smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and caused the pollution of environment.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of novel smart card comprises smart card module and the card base with module installation slotted eye;
Described smart card module is made up of substrate, chip and packaging body; Chip is arranged on the part surface of substrate; The chip package body is enclosed in the chip outside, and non-part surface being provided with of substrate meets the contact of ISO7816 standard, and the quantity of contact is 6 or 8; Smart card module and Ka Ji that chip and chip package body are installed fit, and the chip package body is installed in the slotted eye of card base.
Further, described chip is single the bare chip that does not encapsulate after wafer cuts through attenuate; Described substrate is that epoxy resin applies copper circuit board (PCB), polyimide (PI) applies copper circuit board or polyethylene terephthalate (PET) circuit board; Described encapsulated member is ultraviolet curing glue, silica gel or epoxide-resin glue; Described card base is PVC (PVC) or acrylonitrile-styrene-butadiene copolymer (ABS).
Further again, described chip and encapsulated member have formed slim through surface-pasted module through preprocessing, and the circuit through welding compound and substrate is connected.
Further again, described chip is installed to the part surface of substrate, through the supersonic welding Wiring technology bonding pads is connected with base plate line, through encapsulated member chip is surrounded again.
Further again, described card base cuts into the unit lesser calorie after being provided with 9 groups of identical structural units and baseplate-laminating processing, and the length and width of lesser calorie are of a size of 25X15mm.
Further again, described card base cuts into the unit miniature cards after being provided with 15 groups of identical structural units and baseplate-laminating processing, and the length and width of miniature cards are of a size of 15X12mm.
According to the smart card that technique scheme forms, simplified the production procedure of traditional approach, the smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and is caused the pollution of environment.The effect of promotion is played in the progress for the smart card industry of the utility model.
Description of drawings
Further specify the utility model below in conjunction with accompanying drawing and embodiment.
Fig. 1 is the utility model 8 contact smart cards 9 card synoptic diagram.
Fig. 2 is the utility model 6 contact smart cards 9 card synoptic diagram.
Fig. 3 is the utility model 6 contact smart cards 15 card synoptic diagram.
Fig. 4 is box-like lesser calorie of the utility model 6 contact sets and mini-chip card 15 card synoptic diagram.
Fig. 5 is the utility model smart card 9 Lian Kaka based structures synoptic diagram.
Fig. 6 is the utility model smart card 15 Lian Kaka based structures synoptic diagram.
Fig. 7 is the utility model smart card 9 Lian Kaka based structures synoptic diagram.
Fig. 8 is the utility model smart card 15 Lian Kaka based structures synoptic diagram.
Fig. 9 is the utility model 8 contact smart card single deck tape-recorder synoptic diagram.
Figure 10 is the utility model 6 contact smart card single deck tape-recorder synoptic diagram.
Figure 11 is the box-like small-sized and mini-chip card single deck tape-recorder synoptic diagram of the utility model 6 contact sets.
Figure 12 is the utility model 6 contact mini-chip card single deck tape-recorder synoptic diagram.
Figure 13 is the synoptic diagram that the utility model 8 contact smart card modules adopt surface mount chip.
Figure 14 is that the utility model 8 contact smart card modules adopt nation to decide the synoptic diagram of Chip Packaging.
Figure 15 is that the utility model 6 contact smart card modules adopt nation to decide the synoptic diagram of Chip Packaging.
Figure 16 is the synoptic diagram that the utility model 6 contact smart card modules adopt surface mount chip.
Figure 17 decides the diagrammatic cross-section of Chip Packaging for the utility model smart card module adopts nation.
Figure 18 adopts the diagrammatic cross-section of surface mount chip for the utility model smart card module.
Figure 19 is the diagrammatic cross-section that the utility model smart card single deck tape-recorder adopts surface mount chip.
Figure 20 is the section enlarged diagram that the utility model smart card single deck tape-recorder adopts surface mount chip.
Embodiment
For the technological means, the creation characteristic that make the utility model, reach purpose and effect and be easy to understand and understand, below in conjunction with concrete diagram, further set forth the particular content of the utility model.
The utility model adopts many modes that lesser calorie is made simultaneously in the production of smart card; Through directly being installed to bare chip on the substrate; Adopt ultrasonic welding process that the circuit of bonding pads and substrate is coupled together, re-use encapsulating compound chip package; Also can bare chip be packaged into slim module through slim packaging technology, the attachment process through the general surface mounting device is then crossed the Reflow Soldering mode with the link tester of the pad of module and substrate and is solidified and couple together reliably.The smart card module that installs chip after attaching adhesive and being die-cut into individual module with the basic reliable connection of card, more multiunit kilocalorie is cut into the little card size that needs at last, like the miniature cards of lesser calorie or the 15X12mm of 25X15mm.This mode has been simplified the production procedure of conventional smart card, and the smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and caused the pollution of environment.
Like Figure 13, Figure 16 and smart card module chip attachment synoptic diagram and diagrammatic cross-section shown in Figure 180; At first welding compound is placed on the zone that needs welding through surface-pasted silk screen printing process on part pad 5 surfaces of substrate 2; The pad 5 of pad alignment substrate that adopts mechanical arm will pass through the chip 23 of encapsulation is then installed; The substrate 2 that will install chip 23 again will weld 24 doses of curing through the reflow soldering heating, accomplish the process of chips welding; In this process, the amount of welding compound 24 is selected according to the size of pad, is as the criterion can fully connecting.Can adjust through the thickness of selecting steel mesh and the size that printing is windowed in the practical operation.The thickness of steel mesh can be selected between from 25um to 200um.
In the process that welding compound is solidified in the reflow soldering heating, select different welding compounds for use and cooperate corresponding heating-up temperature to realize according to the material of substrate.Adopt following temperature like deposited copper circuit board (PCB) of epoxy resin and the deposited copper circuit board of polyimide (PI):
The phase one preheating section: temperature rises to T1 from room temperature earlier; The subordinate phase soaking zone: temperature keeps between T2; The phase III reflux section: temperature is a reflux temperature during T3-T4-T3, and the stage cooling section: temperature drops to room temperature from T3;
T1 is 180 ℃-200 ℃;
T2 is 180 ℃-230 ℃;
T3 is 220 ℃-240 ℃;
T4 is 240 ℃-280 ℃;
Like material is that polyethylene terephthalate (PET) circuit board adopts following temperature:
T1 is 100-120 ℃;
T2 is 100-150 ℃;
T3 is 140-160 ℃;
T4 is 160-180 ℃.
In the time of for larger-size chips welding, can select that reinforcement is carried out at four angles of chip and fix, and pass through curing process, play the purpose of protection chip and pad the reinforcement adhesive curing.
Like Figure 14, Figure 15 and chip point glue envelope shape synoptic diagram shown in Figure 17; At first adhesive is placed on the zone that needs welding through the automatic attachment process of chip on the part installing zone surface of substrate 2; Adopt mechanical arm that bare chip 24 is mounted on corresponding position then; The substrate 2 that will install chip 24 again solidifies welding compound through heating, accomplishes the process that chip is installed; Chip can be down packaged type, with the direct conducting of the pad of bonding pads and substrate, also can adopt positive packaged type, adopts the pad conducting of wire bonds technology with bonding pads and substrate at last.At last,, add protecting colloid 23, make chip 24 and lead-in wire 25 avoid the damage of external force at chip area in order effectively to protect chip 24 and lead-in wire 25.
Reach like Fig. 5 and Fig. 6 card based structures synoptic diagram, the card base is designed to a plurality of lesser calorie joining-card structures of 9 or 15, adopts precision injection molding or accurate groove milling to process and realizes.The length and width size is confirmed according to the size of module.Designed lesser calorie edge identification slot 10 at another side, after lesser calorie is die-cut, carried out the inspection of outward appearance off normal and use.Pass through cross section A-A ' the card base diagrammatic cross-section of Fig. 7 and Fig. 8 shown in, the thickness of card base 1 is between 0.7 ~ 0.8mm, the module installation region is the sunk type double step structure, first step is 12, the degree of depth is between the 0.1-0.3mm; Second step is 11, and the degree of depth is between the 0.3-0.5mm; Module boundary trench 10 is positioned at the back side of card base.
The substrate part surface that installs part is sticked adhesive 6, be die-cut into behind the single smart card module and the applying of card base.Shown in the local amplification profile synoptic diagram of the single deck tape-recorder structural profile synoptic diagram of Figure 19 and Figure 20; Card base 1 is positioned at bottommost, and the contact face of substrate 21 makes progress, and part surface is downward; 21 of module 23 and substrates are connected through welding compound 5 and are fixing, module 23 are installed in the module mounting hole 11 of card basic 1; Reliably fit through adhesive 6 between substrate and Ka Ji.Product after the completion such as Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, back-side unit location groove 3 can play visual inspection identification for the outward appearance off normal of single product and use; Meet 6 contacts 22 of ISO7816 interface specification or the front that 8 contacts 22 are positioned at the card body; Part 1 beyond the lesser calorie edge 3 of card base 1 and 13 is concentrated discarded by die-cut back.
The size of the lesser calorie of accomplishing at last 3 can be the 25.0X15.0mm that meets international SIM standard, like Fig. 9 and shown in Figure 10; Also can be on standard card 3 punch out miniature cards 4 compatible body, shown in figure 11; Also can be miniature cards 3 structures, shown in figure 12.The related request that the size of the contact 22 of lesser calorie or miniature cards and position meet ISO7816, the shape of contact is not limited to illustrated square, in application process, can beautify, as long as meet the requirement of ISO7816.
In sum; Be merely the embodiment of the utility model; But the protection domain of the utility model is not limited thereto; Any technician who is familiar with the present technique field can expect changing or replacement in the technical scope that the utility model discloses easily, all should be encompassed within the protection domain of the utility model.
Claims (6)
1. a novel smart card is characterized in that, comprises smart card module and the card base with module installation slotted eye;
Described smart card module is made up of substrate, chip and packaging body; Chip is arranged on the part surface of substrate; The chip package body is enclosed in the chip outside, and non-part surface being provided with of substrate meets the contact of ISO7816 standard, and the quantity of contact is 6 or 8; Smart card module and Ka Ji that chip and chip package body are installed fit, and the chip package body is installed in the slotted eye of card base.
2. a kind of novel smart card according to claim 1 is characterized in that, described chip is single the bare chip that does not encapsulate after wafer cuts through attenuate; Described substrate is that epoxy resin applies copper circuit board (PCB), polyimide (PI) applies copper circuit board or polyethylene terephthalate (PET) circuit board; Described encapsulated member is ultraviolet curing glue, silica gel or epoxide-resin glue; Described card base is PVC (PVC) or acrylonitrile-styrene-butadiene copolymer (ABS).
3. a kind of novel smart card according to claim 1 is characterized in that, described chip and encapsulated member have formed slim through surface-pasted module through preprocessing, and the circuit through welding compound and substrate is connected.
4. a kind of novel smart card according to claim 1 is characterized in that described chip is installed to the part surface of substrate, through the supersonic welding Wiring technology bonding pads is connected with base plate line, through encapsulated member chip is surrounded again.
5. a kind of novel smart card according to claim 1 is characterized in that, described card base cuts into the unit lesser calorie after being provided with 9 groups of identical structural units and baseplate-laminating processing, and the length and width of lesser calorie are of a size of 25X15mm.
6. a kind of novel smart card according to claim 1 is characterized in that, described card base cuts into the unit miniature cards after being provided with 15 groups of identical structural units and baseplate-laminating processing, and the length and width of miniature cards are of a size of 15X12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204247325U CN202339565U (en) | 2011-11-01 | 2011-11-01 | Novel smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204247325U CN202339565U (en) | 2011-11-01 | 2011-11-01 | Novel smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202339565U true CN202339565U (en) | 2012-07-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204247325U Expired - Fee Related CN202339565U (en) | 2011-11-01 | 2011-11-01 | Novel smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202339565U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376013A (en) * | 2011-11-01 | 2012-03-14 | 上海祯显电子科技有限公司 | Novel intelligent card |
-
2011
- 2011-11-01 CN CN2011204247325U patent/CN202339565U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102376013A (en) * | 2011-11-01 | 2012-03-14 | 上海祯显电子科技有限公司 | Novel intelligent card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120718 Termination date: 20121101 |