CN102419825A - Novel smart card - Google Patents
Novel smart card Download PDFInfo
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- CN102419825A CN102419825A CN2011103385924A CN201110338592A CN102419825A CN 102419825 A CN102419825 A CN 102419825A CN 2011103385924 A CN2011103385924 A CN 2011103385924A CN 201110338592 A CN201110338592 A CN 201110338592A CN 102419825 A CN102419825 A CN 102419825A
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Abstract
The invention discloses a novel smart card, wherein a process of packaging a plurality of small cards of the smart cards simultaneously is adopted to realize efficient product production. The novel smart card comprises a chip, a chip packaging body, a substrate and a card base with a module mounting slotted hole. The chip is arranged on a part side of the substrate; the chip packaging body encircles the external side of the chip; the non-part side of the substrate is provided with 6 or 8 contacts in accordance with an ISO7816 (International Standardization Organization 7816) standard; the part side on which the chip and the chip packaging body are mounted is jointed with the card base; and the chip packaging body is mounted in the slotted hole of the card base. The novel smart card disclosed by the invention can replace traditional smart cards, is not only environment-friendly, but also has the advantages of improved production efficiency and product reliability and reduced production cost.
Description
Technical field
The present invention relates to field of intelligent cards, particularly the contact intelligent card field is specifically related to a kind of novel smart card.
Background technology
Smart card is a 21 century smart electronics product with the fastest developing speed, through multi-field application, each corner of being socially reintegrated.Like bank card, gate inhibition's card, mass transit card and SIM cards of mobile phones etc., our work and life have depended on the magical function of smart card.Traditional smart card is the slim card of a 85X54mm, and its thickness is 0.76mm, meets the mechanical dimension of ISO7816 and the requirement of electrical specification.Its core is a smart card module that is embedded in the card body, is made up of substrate, chip and some auxiliary material.
The general form of kilocalorie that adopts such as bank card, gate inhibition's card and mass transit card is used, and the SIM of mobile phone adopts the mode of lesser calorie to use bar none, and two kinds of sizes of miniature cards of lesser calorie or the 15X12mm of 25X15mm are arranged at present.In the smart card product in the whole world, SIM cards of mobile phones has occupied and has surpassed 80% share, and annual consumption is above 4,000,000,000! And during plant produced because the restriction of equipment is produced according to the technology of kilocalorie always, punch out the profile of lesser calorie then in the relevant position of kilocalorie; The user is after having bought card; Lesser calorie is broken off with the fingers and thumb down, and remaining kilocalorie card base has become waste material, is arbitrarily abandoned to cause environmental pollution.When traditional smart card module and Ka Ji fit,, module is separated with Ka Ji, make smart card disabled because the area that adhesive attaches is less.
The present invention uses the problem points that exists in order to solve lesser calorie class smart card product, considers from cost, reliability, environmental protection equal angles, all needs a kind of new technology to break through.We have proposed brand-new solution, the production technology of small intelligent card are simplified, efficient improves, reliability is higher, cost is lower, and accomplish environmental protection.
Summary of the invention
The present invention is directed to the problems referred to above, in the production of smart card, proposed many notions that lesser calorie is made simultaneously.This novel product through bare chip directly is installed on the substrate, couples together through the circuit of ultrasonic welding process with bonding pads and substrate, re-uses encapsulating compound with chip package.A kind of in addition approach is that bare chip is packaged into slim module through slim packaging technology, and the attachment process through the general surface mounting device is then crossed the Reflow Soldering mode with the link tester of the pad of module and substrate and solidified and couple together reliably.The substrate that installs chip is through adhesive and Ka Ji reliable connection, and the last little card size that more multiunit kilocalorie is cut into needs is like the miniature cards of lesser calorie or the 15X12mm of 25X15mm.Novel smart card of the present invention has been simplified the production procedure of traditional approach, and the smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and caused the pollution of environment.
In order to achieve the above object, the present invention adopts following technical scheme:
A kind of novel smart card is characterized in that, comprises chip, chip package body, substrate and has the card base that module is installed slotted eye;
Described chip is arranged on the part surface of substrate; The chip package body is enclosed in the chip outside; Non-part surface being provided with of substrate meets the contact of ISO7816 standard; The quantity of contact is 6 or 8, and part surface and Ka Ji that the substrate of chip and chip package body is installed fit, and the chip package body is installed in the slotted eye of card base.
Further, described chip is single the bare chip that does not encapsulate after wafer cuts through attenuate; Described substrate is that epoxy resin applies copper circuit board (PCB), polyimide (PI) applies copper circuit board or polyethylene terephthalate (PET) circuit board; Described encapsulated member is ultraviolet curing glue, silica gel or epoxide-resin glue; Described card base is PVC (PVC) or acrylonitrile-styrene-butadiene copolymer (ABS).
Further again, described chip and encapsulated member have formed slim through surface-pasted module through preprocessing, and the circuit through welding compound and substrate is connected.
Further again, described chip is installed to the part surface of substrate, through the supersonic welding Wiring technology bonding pads is connected with base plate line, through encapsulated member chip is surrounded again.
Further again, described substrate is provided with 9 groups of identical line units, and fit with the card base in the processing back simultaneously.
Further again, described card base cuts into the unit lesser calorie after being provided with 9 groups of identical structural units and baseplate-laminating processing, and the length and width of lesser calorie are of a size of 25X15mm.
Further again, described substrate is provided with 15 groups of identical line units, and fit with the card base in the processing back simultaneously.
Further again, described card base cuts into the unit miniature cards after being provided with 15 groups of identical structural units and baseplate-laminating processing, and the length and width of miniature cards are of a size of 15X12mm.
According to the smart card that technique scheme forms, simplified the production procedure of traditional approach, the smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and is caused the pollution of environment.The effect of promotion is played in progress for the smart card industry of the present invention.
Description of drawings
Further specify the present invention below in conjunction with accompanying drawing and embodiment.
Fig. 1 is the present invention's 8 contact smart cards 9 card synoptic diagram.
Fig. 2 is the present invention's 6 contact smart cards 9 card synoptic diagram.
Fig. 3 is smart card 9 the core of the card sheet surface mount synoptic diagram of the present invention.
Fig. 4 is smart card 9 the core of the card sheet point glue envelope shape synoptic diagram of the present invention.
Fig. 5 is smart card 9 Lian Kaka based structures synoptic diagram of the present invention.
Fig. 6 is smart card 9 Lian Kakaji diagrammatic cross-sections of the present invention.
Fig. 7 is the present invention's 8 contact smart card single deck tape-recorder synoptic diagram.
Fig. 8 is the present invention's 6 contact smart card single deck tape-recorder synoptic diagram.
Fig. 9 is the present invention's 6 contact combinations type smart card single deck tape-recorder synoptic diagram that declines.
Figure 10 is the present invention's 6 contact smart cards 15 card synoptic diagram.
Figure 11 is smart card 15 the core of the card sheet surface mount synoptic diagram of the present invention.
Figure 12 is smart card 15 the core of the card sheet point glue envelope shape synoptic diagram of the present invention.
Figure 13 is smart card 15 Lian Kaka based structures synoptic diagram of the present invention.
Figure 14 is the present invention's 6 contact mini-chip card single deck tape-recorder synoptic diagram.
Figure 15 is a smart card single deck tape-recorder structural profile synoptic diagram of the present invention.
Figure 16 is a smart card single deck tape-recorder structure partial amplification profile synoptic diagram of the present invention.
Embodiment
In order to make technological means of the present invention, creation characteristic, to reach purpose and effect and be easy to understand and understand,, further set forth particular content of the present invention below in conjunction with concrete diagram.
The present invention adopts many modes that lesser calorie is made simultaneously in the production of smart card, through bare chip directly is installed on the substrate, adopt ultrasonic welding process that the circuit of bonding pads and substrate is coupled together, and re-uses encapsulating compound with chip package; Also can bare chip be packaged into slim module through slim packaging technology, the attachment process through the general surface mounting device is then crossed the Reflow Soldering mode with the link tester of the pad of module and substrate and is solidified and couple together reliably.The substrate that installs chip is through adhesive and Ka Ji reliable connection, and the last little card size that more multiunit kilocalorie is cut into needs is like the miniature cards of lesser calorie or the 15X12mm of 25X15mm.This mode has been simplified the production procedure of conventional smart card, and the smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and caused the pollution of environment.
Mount synoptic diagram like Fig. 3 and chip surface shown in Figure 11; At first the part bond pad surface at substrate 3 is placed on welding compound in the zone that needs welding through surface-pasted silk screen printing process; The pad of pad alignment substrate that adopts mechanical arm will pass through the chip 34 of encapsulation is then installed; The substrate 3 that will install chip 34 again solidifies welding compound through the reflow soldering heating, accomplishes the process of chips welding; In this process, the amount of welding compound is selected according to the size of pad, is as the criterion can fully connecting.Can adjust through the thickness of selecting steel mesh and the size that printing is windowed in the practical operation.The thickness of steel mesh can be selected between from 25um to 200um.
In the process that welding compound is solidified in the reflow soldering heating, select different welding compounds for use and cooperate corresponding heating-up temperature to realize according to the material of substrate.Adopt following temperature like deposited copper circuit board (PCB) of epoxy resin and the deposited copper circuit board of polyimide (PI):
The phase one preheating section: temperature rises to T1 from room temperature earlier; The subordinate phase soaking zone: temperature keeps between T2; The phase III reflux section: temperature is a reflux temperature during T3-T4-T3, and the stage cooling section: temperature drops to room temperature from T3;
T1 is 180 ℃-200 ℃;
T2 is 180 ℃-230 ℃;
T3 is 220 ℃-240 ℃;
T4 is 240 ℃-280 ℃;
Like material is that polyethylene terephthalate (PET) circuit board adopts following temperature:
T1 is 100-120 ℃;
T2 is 100-150 ℃;
T3 is 140-160 ℃;
T4 is 160-180 ℃.
In the time of for larger-size chips welding, can select that reinforcement is carried out at four angles of chip and fix, and pass through curing process, play the purpose of protection chip and pad the reinforcement adhesive curing.
Like Fig. 4 and chip point glue envelope shape synoptic diagram shown in Figure 12; At first adhesive is placed on the zone that needs welding through the automatic attachment process of chip on the part installing zone surface of substrate 3; Adopt mechanical arm bare chip to be mounted on 34 position then; The substrate 3 that will install chip 34 again solidifies welding compound through heating, accomplishes the process that chip is installed; Chip can be down packaged type, with the direct conducting of the pad of bonding pads and substrate, also can adopt positive packaged type, adopts the pad conducting of wire bonds technology with bonding pads and substrate at last.At last,, add protecting colloid 34, make chip and lead-in wire avoid the damage of external force at chip area in order effectively to protect chip and lead-in wire.
Reach like Fig. 5 and Figure 13 card based structures synoptic diagram, the card base is designed to a plurality of lesser calorie joining-card structures of 9 or 15, adopts precision injection molding or accurate groove milling to process and realizes.The module installation region is a sinkage type structure 11, confirms according to the size of module.Designed lesser calorie edge identification slot 10 at another side, after lesser calorie is die-cut, carried out the inspection of outward appearance off normal and use.Pass through cross section A-A ' the card base diagrammatic cross-section of Fig. 6, the thickness of card base 1 is between 0.5 ~ 0.7mm, matees according to the thickness of substrate.Module mounting groove 11 is positioned at the front of card base, and groove depth depends on the actual installation thickness of module, and generally between 0.3 ~ 0.5mm, module boundary trench 10 is positioned at the back side of card base, and installing and locating is convenient on the surface of installing and locating hole 12 outstanding card bases.
The substrate part surface that installs part is sticked adhesive and blocks base through the back applying of pilot hole location.Like the structural profile synoptic diagram of Figure 15 and the local amplification profile synoptic diagram of Figure 16; Card base 1 is positioned at bottommost, and the contact face of substrate 3 makes progress, and part surface is downward; Be connected through welding compound 5 between module and substrate and fixing, module 4 be installed in the module mounting hole 6 of card basic 1; Reliably fit through adhesive 2 between substrate and Ka Ji.Product after the completion such as Fig. 1, Fig. 2 and shown in Figure 10, pilot hole 32 plays accurate installing and locating; Back-side unit location groove 33 can play visual inspection identification for the outward appearance off normal of single product and use; Meet 6 contacts 31 of ISO7816 interface specification or the front that 8 contacts 31 are positioned at the card body; Part beyond the little card-edge of card base 3 is concentrated discarded by die-cut back.
The size of the lesser calorie of accomplishing at last 3 can be the 25.0X15.0mm that meets international SIM standard, like Fig. 7 and shown in Figure 8; Also can be on standard card 3 punch out miniature cards 8 compatible body, as shown in Figure 9; Also can be miniature cards 3 structures, shown in figure 14.The related request that the size of the contact 31 of lesser calorie or miniature cards and position meet ISO7816, the shape of contact is not limited to illustrated square, in application process, can beautify, as long as meet the requirement of ISO7816.
In sum; Be merely embodiment of the present invention, but protection scope of the present invention is not limited thereto, any technician who is familiar with the present technique field is in the technical scope that the present invention discloses; Can expect easily changing or replacement, all should be encompassed within protection scope of the present invention.
Claims (8)
1. a novel smart card is characterized in that, comprises chip, chip package body, substrate and has the card base that module is installed slotted eye;
Described chip is arranged on the part surface of substrate; The chip package body is enclosed in the chip outside; Non-part surface being provided with of substrate meets the contact of ISO7816 standard; The quantity of contact is 6 or 8, and part surface and Ka Ji that the substrate of chip and chip package body is installed fit, and the chip package body is installed in the slotted eye of card base.
2. a kind of novel smart card according to claim 1 is characterized in that, described chip is single the bare chip that does not encapsulate after wafer cuts through attenuate; Described substrate is that epoxy resin applies copper circuit board (PCB), polyimide (PI) applies copper circuit board or polyethylene terephthalate (PET) circuit board; Described encapsulated member is ultraviolet curing glue, silica gel or epoxide-resin glue; Described card base is PVC (PVC) or acrylonitrile-styrene-butadiene copolymer (ABS).
3. a kind of novel smart card according to claim 1 is characterized in that, described chip and encapsulated member have formed slim through surface-pasted module through preprocessing, and the circuit through welding compound and substrate is connected.
4. a kind of novel smart card according to claim 1 is characterized in that described chip is installed to the part surface of substrate, through the supersonic welding Wiring technology bonding pads is connected with base plate line, through encapsulated member chip is surrounded again.
5. a kind of novel smart card according to claim 1 is characterized in that, described substrate is provided with 9 groups of identical line units, and fit with the card base in the processing back simultaneously.
6. a kind of novel smart card according to claim 1 is characterized in that, described card base cuts into the unit lesser calorie after being provided with 9 groups of identical structural units and baseplate-laminating processing, and the length and width of lesser calorie are of a size of 25X15mm.
7. a kind of novel smart card according to claim 1 is characterized in that, it is characterized in that, described substrate is provided with 15 groups of identical line units, and fit with the card base in the processing back simultaneously.
8. a kind of novel smart card according to claim 1 is characterized in that, described card base cuts into the unit miniature cards after being provided with 15 groups of identical structural units and baseplate-laminating processing, and the length and width of miniature cards are of a size of 15X12mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103385924A CN102419825A (en) | 2011-11-01 | 2011-11-01 | Novel smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103385924A CN102419825A (en) | 2011-11-01 | 2011-11-01 | Novel smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102419825A true CN102419825A (en) | 2012-04-18 |
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ID=45944227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103385924A Pending CN102419825A (en) | 2011-11-01 | 2011-11-01 | Novel smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102419825A (en) |
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2011
- 2011-11-01 CN CN2011103385924A patent/CN102419825A/en active Pending
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| C06 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120418 |