CN202339564U - Novel double-interface smart card - Google Patents

Novel double-interface smart card Download PDF

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Publication number
CN202339564U
CN202339564U CN2011204247310U CN201120424731U CN202339564U CN 202339564 U CN202339564 U CN 202339564U CN 2011204247310 U CN2011204247310 U CN 2011204247310U CN 201120424731 U CN201120424731 U CN 201120424731U CN 202339564 U CN202339564 U CN 202339564U
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CN
China
Prior art keywords
chip
smart card
interface smart
double
substrate
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Expired - Fee Related
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CN2011204247310U
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Chinese (zh)
Inventor
陆红梅
杨阳
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SHANGHAI ZHENXIAN ELECTRONIC TECHNOLOGY CO LTD
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SHANGHAI ZHENXIAN ELECTRONIC TECHNOLOGY CO LTD
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Priority to CN2011204247310U priority Critical patent/CN202339564U/en
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Publication of CN202339564U publication Critical patent/CN202339564U/en
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Abstract

The utility model discloses a novel double-interface smart card which is characterized in that the technology that a plurality of small double-interface smart cards are packaged at the same time is adopted for realizing efficient production of products. The novel double-interface smart card comprises a double-interface smart card module and a card base with a module installation groove hole, wherein the double-interface smart card module is composed of a base plate, a chip and a packaging body; the chip is arranged on a part surface of the base plate; a chip encapsulating body surrounds the outside of the chip; a non-part surface of the base plate is provided with contact points which meet an ISO (international standardization organization) 7816 standard; the number of the contact points is six or eight; multiple rings of winding radio frequency antennae and a bonding pad are arranged on the part surface of the base plate; the double-interface smart card module provided with the chip and the chip packaging body is attached to the card base; and the chip packaging body is mounted in module installation groove hole of the car base. The novel double-interface smart card disclosed by the utility model can be used for replacing the traditional double-interface smart card, is environment-friendly, improves the production efficiency, reduces the production cost, and improves the product reliability.

Description

A kind of new type double interface smart card
Technical field
The utility model relates to field of intelligent cards, and particularly the double-interface smart card field is specifically related to a kind of new type double interface smart card.
Background technology
Smart card is a 21 century smart electronics product with the fastest developing speed, through multi-field application, each corner of being socially reintegrated.Like bank card, gate inhibition's card, mass transit card and SIM cards of mobile phones etc., our work and life have depended on the magical function of smart card.Traditional smart card is the slim card of a 85X54mm, and its thickness is 0.76mm, meets the mechanical dimension of ISO7816 and the requirement of electrical specification.Its core is a smart card module that is embedded in the card body, is made up of substrate, chip and some auxiliary material.
The general form of kilocalorie that adopts such as bank card, gate inhibition's card and mass transit card is used, and the SIM of mobile phone adopts the mode of lesser calorie to use bar none, and two kinds of sizes of miniature cards of lesser calorie or the 15X12mm of 25X15mm are arranged at present.In the smart card product in the whole world, SIM cards of mobile phones has occupied and has surpassed 80% share, and annual consumption is above 4,000,000,000! In recent years, the extensive application of contactless smart card, more convenient people's life has engendered the double-interface smart card product of set contact intelligent card and contact type intelligent card.This double-interface smart card is widely used on the fiscard and mobile-phone payment card of bank.Double-interface smart card for the application of mobile phone lesser calorie; Because the restriction of equipment is produced according to the technology of kilocalorie always, punch out the profile of lesser calorie then in the relevant position of kilocalorie during plant produced; The user is after having bought card; Lesser calorie is broken off with the fingers and thumb down, and remaining kilocalorie card base has become waste material, is arbitrarily abandoned to cause environmental pollution.
The utility model is used the problem points that exists in order to solve lesser calorie class double-interface smart card product, considers from cost, reliability, environmental protection equal angles, all needs a kind of new technology to break through.We have proposed brand-new solution, the production technology of small capacity double interface smart card are simplified, efficient improves, reliability is higher, cost is lower, and accomplish environmental protection.
The utility model content
The utility model has proposed many notions that lesser calorie is made simultaneously to the problems referred to above in the production of double-interface smart card.This novel product through bare chip directly is installed on the substrate, couples together through the circuit of ultrasonic welding process with bonding pads and substrate, re-uses encapsulating compound with chip package.A kind of in addition approach is that bare chip is packaged into slim module through slim packaging technology, and the attachment process through the general surface mounting device is then crossed the Reflow Soldering mode with the link tester of the pad of module and substrate and solidified and couple together reliably.The double-interface smart card module that installs chip after attaching adhesive and being die-cut into individual module with the basic reliable connection of card, more multiunit kilocalorie is cut into the little card size that needs at last, like the miniature cards of lesser calorie or the 15X12mm of 25X15mm.The new type double interface smart card of the utility model has been simplified the production procedure of traditional approach, and the double-interface smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and caused the pollution of environment.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of new type double interface smart card comprises double-interface smart card module and the card base with module installation slotted eye;
Described double-interface smart card module is made up of substrate, chip and packaging body; Chip is arranged on the part surface of substrate, and the chip package body is enclosed in the chip outside, and non-part surface being provided with of substrate meets the contact of ISO7816 standard; The quantity of contact is 6 or 8; The substrate part surface is provided with many circle Wound-rotor type radio-frequency antennas and pad, and double-interface smart card module and Ka Ji that chip and chip package body are installed fit, and the chip package body is installed in the slotted eye of card base.
Further, described chip is single the bare chip that does not encapsulate after wafer cuts through attenuate; Described substrate is that epoxy resin applies copper circuit board (PCB), polyimide (PI) applies copper circuit board or polyethylene terephthalate (PET) circuit board; Described encapsulated member is ultraviolet curing glue, silica gel or epoxide-resin glue; Described card base is PVC (PVC) or acrylonitrile-styrene-butadiene copolymer (ABS).
Further again, described chip and encapsulated member have formed slim through surface-pasted module through preprocessing, and the circuit through welding compound and substrate is connected.
Further again, described chip is installed to the part surface of substrate, through the supersonic welding Wiring technology bonding pads is connected with base plate line, through encapsulated member chip is surrounded again.
Further again; Described antenna is many circle Wound-rotor type radio-frequency antennas, and antenna is arranged on the part surface of substrate, and two ports of antenna and the radiofrequency signal port of chip are connected; Parallelly connected one group of matching capacitor between two ports of antenna in case of necessity reaches the resonance frequency of 13.56MHz.
Further again, described card base cuts into the unit lesser calorie after being provided with 9 groups of identical structural units and baseplate-laminating processing, and the length and width of lesser calorie are of a size of 25X15mm.
Further again, described card base cuts into the unit miniature cards after being provided with 15 groups of identical structural units and baseplate-laminating processing, and the length and width of miniature cards are of a size of 15X12mm.
According to the double-interface smart card that technique scheme forms, simplified the production procedure of traditional approach, the double-interface smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and is caused the pollution of environment.The effect of promotion is played in the progress for the double-interface smart card industry of the utility model.
Description of drawings
Further specify the utility model below in conjunction with accompanying drawing and embodiment.
Fig. 1 is the utility model 8 contact double-interface smart cards 9 card synoptic diagram.
Fig. 2 is the utility model 6 contact double-interface smart cards 9 card synoptic diagram.
Fig. 3 is the utility model 6 contact double-interface smart cards 15 card synoptic diagram.
Fig. 4 is box-like lesser calorie of the utility model 6 contact sets and miniature double-interface smart card 15 card synoptic diagram.
Fig. 5 is the utility model double-interface smart card 9 Lian Kaka based structures synoptic diagram.
Fig. 6 is the utility model double-interface smart card 15 Lian Kaka based structures synoptic diagram.
Fig. 7 is the utility model double-interface smart card 9 Lian Kaka based structures synoptic diagram.
Fig. 8 is the utility model double-interface smart card 15 Lian Kaka based structures synoptic diagram.
Fig. 9 is the utility model 8 contact double-interface smart card single deck tape-recorder synoptic diagram.
Figure 10 is the utility model 6 contact double-interface smart card single deck tape-recorder synoptic diagram.
Figure 11 is the box-like small-sized and miniature double-interface smart card single deck tape-recorder synoptic diagram of the utility model 6 contact sets.
Figure 12 is the utility model 6 contacts miniature double-interface smart card single deck tape-recorder synoptic diagram.
Figure 13 adopts the synoptic diagram of surface mount chip for the utility model double-interface smart card module.
Figure 14 decides the synoptic diagram of Chip Packaging for the utility model double-interface smart card module adopts nation.
Figure 15 is the diagrammatic cross-section that the utility model double-interface smart card single deck tape-recorder adopts surface mount chip.
Figure 16 is the section enlarged diagram that the utility model double-interface smart card single deck tape-recorder adopts surface mount chip.
Figure 17 decides the diagrammatic cross-section of Chip Packaging for the utility model double-interface smart card module adopts nation.
Figure 18 adopts the diagrammatic cross-section of surface mount chip for the utility model double-interface smart card module.
Embodiment
For the technological means, the creation characteristic that make the utility model, reach purpose and effect and be easy to understand and understand, below in conjunction with concrete diagram, further set forth the particular content of the utility model.
The utility model adopts many modes that lesser calorie is made simultaneously in the production of double-interface smart card; Through directly being installed to bare chip on the substrate; Adopt ultrasonic welding process that the circuit of bonding pads and substrate is coupled together, re-use encapsulating compound chip package; Also can bare chip be packaged into slim module through slim packaging technology, the attachment process through the general surface mounting device is then crossed the Reflow Soldering mode with the link tester of the pad of module and substrate and is solidified and couple together reliably.The double-interface smart card module that installs chip after attaching adhesive and being die-cut into individual module with the basic reliable connection of card, more multiunit kilocalorie is cut into the little card size that needs at last, like the miniature cards of lesser calorie or the 15X12mm of 25X15mm.This mode has been simplified the production procedure of traditional double interface smart card, and the double-interface smart card of enhance productivity, increase product reliability, using simultaneously for lesser calorie is avoided unnecessary card base waste and caused the pollution of environment.
Like Figure 13 and double-interface smart card module chip attachment synoptic diagram and diagrammatic cross-section shown in Figure 180, antenna 24 is arranged on the upper surface of substrate 21, and contact 22 is arranged on the lower surface of substrate 21.At first welding compound is placed on the zone that needs welding through surface-pasted silk screen printing process on part pad 5 surfaces of substrate 21; The pad 5 of pad alignment substrate that adopts mechanical arm will pass through the chip 23 of encapsulation is then installed; The substrate 21 that will install chip 23 again solidifies welding compound through the reflow soldering heating, accomplishes the process of chips welding; In this process, the amount of welding compound is selected according to the size of pad, is as the criterion can fully connecting.Can adjust through the thickness of selecting steel mesh and the size that printing is windowed in the practical operation.The thickness of steel mesh can be selected between from 25um to 200um.
In the process that welding compound is solidified in the reflow soldering heating, select different welding compounds for use and cooperate corresponding heating-up temperature to realize according to the material of substrate.Adopt following temperature like deposited copper circuit board (PCB) of epoxy resin and the deposited copper circuit board of polyimide (PI):
The phase one preheating section: temperature rises to T1 from room temperature earlier; The subordinate phase soaking zone: temperature keeps between T2; The phase III reflux section: temperature is a reflux temperature during T3-T4-T3, and the stage cooling section: temperature drops to room temperature from T3;
T1 is 180 ℃-200 ℃;
T2 is 180 ℃-230 ℃;
T3 is 220 ℃-240 ℃;
T4 is 240 ℃-280 ℃;
Like material is that polyethylene terephthalate (PET) circuit board adopts following temperature:
T1 is 100-120 ℃;
T2 is 100-150 ℃;
T3 is 140-160 ℃;
T4 is 160-180 ℃.
In the time of for larger-size chips welding, can select that reinforcement is carried out at four angles of chip and fix, and pass through curing process, play the purpose of protection chip and pad the reinforcement adhesive curing.
The chip point glue envelope shape synoptic diagram shown in Figure 17 like Figure 14, antenna 24 is arranged on the upper surface of substrate 21, and contact 22 is arranged on the lower surface of substrate 21.At first adhesive is placed on the zone that needs welding through the automatic attachment process of chip on the part installing zone surface of substrate 21; Adopt mechanical arm that bare chip 27 is mounted on corresponding position then; The substrate 21 that will install chip 27 again solidifies welding compound through heating, accomplishes the process that chip is installed; Chip can be down packaged type, with the direct conducting of the pad of bonding pads and substrate, also can adopt positive packaged type, adopts the pad conducting of wire bonds technology with bonding pads and substrate at last.In order effectively to protect chip 27 and lead-in wire 28, add protecting colloid 23 at chip area, make chip 27 and lead-in wire 28 avoid the damage of external force.
Reach like Fig. 5 and Fig. 6 card based structures synoptic diagram, the card base is designed to a plurality of lesser calorie joining-card structures of 9 or 15, adopts precision injection molding or accurate groove milling to process and realizes.The length and width size is confirmed according to the size of module.Designed lesser calorie edge identification slot 10 at another side, after lesser calorie is die-cut, carried out the inspection of outward appearance off normal and use.Pass through cross section A-A ' the card base diagrammatic cross-section of Fig. 7 and Fig. 8 shown in, the thickness of card base 1 is between 0.7 ~ 0.8mm, the module installation region is the sunk type double step structure, first step is 12, the degree of depth is between the 0.1-0.3mm; Second step is 11, and the degree of depth is between the 0.3-0.5mm; Module boundary trench 10 is positioned at the back side of card base.
The substrate part surface that installs part is sticked adhesive 6, be die-cut into behind the single double-interface smart card module and the applying of card base.Shown in the local amplification profile synoptic diagram of the single deck tape-recorder structural profile synoptic diagram of Figure 15 and Figure 16; Card base 1 is positioned at bottommost, and the contact face of substrate 21 makes progress, and part surface is downward; 21 of module 23 and substrates are connected through welding compound 5 and are fixing, module 23 are installed in the module mounting hole 11 of card basic 1; Reliably fit through adhesive 6 between substrate and Ka Ji.Product after the completion such as Fig. 1, Fig. 2, Fig. 3 and shown in Figure 4, back-side unit location groove 3 can play visual inspection identification for the outward appearance off normal of single product and use; Meet 6 contacts 22 of ISO7816 interface specification or the front that 8 contacts 22 are positioned at the card body; Part 1 beyond the lesser calorie edge 3 of card base 1 and 13 is concentrated discarded by die-cut back.
The size of the lesser calorie of accomplishing at last can be the 25.0X15.0mm that meets international SIM standard, like Fig. 9 and shown in Figure 10; Also can be the compatible body that on standard card, punches out miniature cards 4, shown in figure 11; Also can be miniature cards 3 structures, shown in figure 12.The related request that the size of the contact 22 of lesser calorie or miniature cards and position meet ISO7816, the shape of contact is not limited to illustrated square, in application process, can beautify, as long as meet the requirement of ISO7816.
In sum; Be merely the embodiment of the utility model; But the protection domain of the utility model is not limited thereto; Any technician who is familiar with the present technique field can expect changing or replacement in the technical scope that the utility model discloses easily, all should be encompassed within the protection domain of the utility model.

Claims (7)

1. a new type double interface smart card is characterized in that, comprises double-interface smart card module and the card base with module installation slotted eye;
Described double-interface smart card module is made up of substrate, chip and packaging body; Chip is arranged on the part surface of substrate, and the chip package body is enclosed in the chip outside, and non-part surface being provided with of substrate meets the contact of ISO7816 standard; The quantity of contact is 6 or 8; The part surface of substrate is provided with many circle Wound-rotor type radio-frequency antennas and pad, and double-interface smart card module and Ka Ji that chip and chip package body are installed fit, and the chip package body is installed in the slotted eye of card base.
2. a kind of new type double interface smart card according to claim 1 is characterized in that, described chip is single the bare chip that does not encapsulate after wafer cuts through attenuate; Described substrate is that epoxy resin applies copper circuit board (PCB), polyimide (PI) applies copper circuit board or polyethylene terephthalate (PET) circuit board; Described encapsulated member is ultraviolet curing glue, silica gel or epoxide-resin glue; Described card base is PVC (PVC) or acrylonitrile-styrene-butadiene copolymer (ABS).
3. a kind of new type double interface smart card according to claim 1 is characterized in that, described chip and encapsulated member have formed slim through surface-pasted module through preprocessing, and the circuit through welding compound and substrate is connected.
4. a kind of new type double interface smart card according to claim 1 is characterized in that described chip is installed to the part surface of substrate, through the supersonic welding Wiring technology bonding pads is connected with base plate line, through encapsulated member chip is surrounded again.
5. a kind of new type double interface smart card according to claim 1; It is characterized in that; Described antenna is many circle Wound-rotor type radio-frequency antennas, and antenna is arranged on the part surface of substrate, and two ports of antenna and the radiofrequency signal port of chip are connected; Parallelly connected one group of matching capacitor between two ports of antenna in case of necessity reaches the resonance frequency of 13.56MHz.
6. a kind of new type double interface smart card according to claim 1 is characterized in that, described card base cuts into the unit lesser calorie after being provided with 9 groups of identical structural units and baseplate-laminating processing, and the length and width of lesser calorie are of a size of 25X15mm.
7. a kind of new type double interface smart card according to claim 1 is characterized in that, described card base cuts into the unit miniature cards after being provided with 15 groups of identical structural units and baseplate-laminating processing, and the length and width of miniature cards are of a size of 15X12mm.
CN2011204247310U 2011-11-01 2011-11-01 Novel double-interface smart card Expired - Fee Related CN202339564U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011204247310U CN202339564U (en) 2011-11-01 2011-11-01 Novel double-interface smart card

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102376012A (en) * 2011-11-01 2012-03-14 上海祯显电子科技有限公司 Novel double-interface intelligent card

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102376012A (en) * 2011-11-01 2012-03-14 上海祯显电子科技有限公司 Novel double-interface intelligent card

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120718

Termination date: 20121101